JP2015018049A5 - - Google Patents
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- Publication number
- JP2015018049A5 JP2015018049A5 JP2013144034A JP2013144034A JP2015018049A5 JP 2015018049 A5 JP2015018049 A5 JP 2015018049A5 JP 2013144034 A JP2013144034 A JP 2013144034A JP 2013144034 A JP2013144034 A JP 2013144034A JP 2015018049 A5 JP2015018049 A5 JP 2015018049A5
- Authority
- JP
- Japan
- Prior art keywords
- diisocyanate
- diisocyanates
- isomers
- aromatic
- multimers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- HJOVHMDZYOCNQW-UHFFFAOYSA-N Isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N [N-]=C=O Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N Diphenylmethane p,p'-diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N Hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N Toluene diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- UQFAQHDNJXQUAS-UHFFFAOYSA-N [N-]=C=O.[N-]=C=O.C1=CC=CC=C1C1=CC=CC=C1 Chemical compound [N-]=C=O.[N-]=C=O.C1=CC=CC=C1C1=CC=CC=C1 UQFAQHDNJXQUAS-UHFFFAOYSA-N 0.000 description 1
- NDVBYVCCHSWRTP-UHFFFAOYSA-N [N-]=C=O.[N-]=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound [N-]=C=O.[N-]=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 NDVBYVCCHSWRTP-UHFFFAOYSA-N 0.000 description 1
- KVOQCZGCUHITGI-UHFFFAOYSA-N [N-]=C=O.[N-]=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 Chemical compound [N-]=C=O.[N-]=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KVOQCZGCUHITGI-UHFFFAOYSA-N 0.000 description 1
- QIMNMSOZIDDLGN-UHFFFAOYSA-L cyclohexylmethylcyclohexane;dicyanate Chemical compound [O-]C#N.[O-]C#N.C1CCCCC1CC1CCCCC1 QIMNMSOZIDDLGN-UHFFFAOYSA-L 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
Description
イソシアネート成分としては、芳香族ジイソシアネート及びその異性体や多量体、脂肪族ジイソシアネート類、脂環式ジイソシアネート類及びその異性体などのジイソシアネートやその他汎用のジイソシアネート類を用いることができるが、これらのイソシアネートに限定されるものではない。また、これらのイソシアネート成分は、単独でまたは組み合わせて使用してもよい。
ジイソシアネートとして、例えば４，４’−ジフェニルメタンジイソシアネート、トリレンジイソシアネート、ナフタレンジイソシアネート、キシリレンジイソシアネート、ビフェニルジイソシアネート、ジフェニルスルホンジイソシアネート、ジフェニルエーテルジイソシアネートなどの芳香族ジイソシアネート及びその異性体、多量体、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、ジシクロヘキシルメタンジイソシアネートなどの脂肪族ジイソシアネート類、あるいは前記芳香族ジイソシアネートを水添した脂環式ジイソシアネート類及び異性体、もしくはその他汎用のジイソシアネート類が挙げられる。
Diisocyanates such as aromatic diisocyanates and isomers and multimers, aliphatic diisocyanates, alicyclic diisocyanates and isomers thereof, and other general-purpose diisocyanates can be used as the isocyanate component. It is not limited. These isocyanate components may be used alone or in combination.
Examples of diisocyanates include aromatic diisocyanates such as 4,4′-diphenylmethane diisocyanate, tolylene diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, biphenyl diisocyanate, diphenyl sulfone diisocyanate, diphenyl ether diisocyanate, and isomers, multimers, hexamethylene diisocyanate, isophorone. Examples thereof include aliphatic diisocyanates such as diisocyanate and dicyclohexylmethane diisocyanate, alicyclic diisocyanates and isomers obtained by hydrogenation of the aromatic diisocyanate, and other general-purpose diisocyanates.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013144034A JP6306296B2 (en) | 2013-07-09 | 2013-07-09 | Photosensitive thermosetting resin composition and flexible printed wiring board |
| PCT/JP2014/066078 WO2015005077A1 (en) | 2013-07-09 | 2014-06-17 | Photosensitive thermosetting resin composition and flexible printed circuit board |
| CN201480039321.0A CN105378564B (en) | 2013-07-09 | 2014-06-17 | Photosensitive thermosetting resin composition and flexible printed circuit board |
| KR1020167003054A KR102372561B1 (en) | 2013-07-09 | 2014-06-17 | Photosensitive thermosetting resin composition and flexible printed circuit board |
| TW103122978A TWI637665B (en) | 2013-07-09 | 2014-07-03 | Photosensitive thermosetting resin composition and flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013144034A JP6306296B2 (en) | 2013-07-09 | 2013-07-09 | Photosensitive thermosetting resin composition and flexible printed wiring board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018041156A Division JP6547025B2 (en) | 2018-03-07 | 2018-03-07 | Photosensitive thermosetting resin composition and flexible printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015018049A JP2015018049A (en) | 2015-01-29 |
| JP2015018049A5 true JP2015018049A5 (en) | 2016-07-28 |
| JP6306296B2 JP6306296B2 (en) | 2018-04-04 |
Family
ID=52279763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013144034A Active JP6306296B2 (en) | 2013-07-09 | 2013-07-09 | Photosensitive thermosetting resin composition and flexible printed wiring board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6306296B2 (en) |
| KR (1) | KR102372561B1 (en) |
| CN (1) | CN105378564B (en) |
| TW (1) | TWI637665B (en) |
| WO (1) | WO2015005077A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6363861B2 (en) * | 2014-03-31 | 2018-07-25 | 太陽インキ製造株式会社 | Curable resin composition, dry film and cured product thereof, and printed wiring board having cured coating formed using the same |
| TWI652281B (en) * | 2015-02-18 | 2019-03-01 | 日商住友電木股份有限公司 | Photoimageable polyolefin composition containing photobase generator |
| KR102040224B1 (en) * | 2016-08-09 | 2019-11-06 | 주식회사 엘지화학 | Method for manufacturing insulating film and multilayered printed circuit board |
| WO2018030761A1 (en) * | 2016-08-09 | 2018-02-15 | 주식회사 엘지화학 | Insulating layer production method and multilayered printed circuit board production method |
| WO2018043262A1 (en) * | 2016-08-31 | 2018-03-08 | 富士フイルム株式会社 | Pattern forming method, method for producing laminate and method for producing electronic device |
| WO2018088754A1 (en) * | 2016-11-11 | 2018-05-17 | 주식회사 엘지화학 | Insulating layer manufacturing method and multi-layered printed circuit board manufacturing method |
| KR102040225B1 (en) * | 2016-11-11 | 2019-11-06 | 주식회사 엘지화학 | Method for manufacturing insulating film and multilayered printed circuit board |
| KR102207604B1 (en) * | 2018-11-06 | 2021-01-26 | (주)이녹스첨단소재 | flexible photo imageable coverlay film and manufacturing method thereof |
| CN110239163B (en) * | 2019-06-13 | 2021-01-08 | 东莞市政潮电子科技有限公司 | Flexible printed circuit board substrate for improving bonding performance between PI film and Cu foil |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62263692A (en) | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | Heat-resistant printed wiring board and manufacture of the same |
| JPS63110224A (en) | 1986-10-27 | 1988-05-14 | Dainippon Printing Co Ltd | Flexible overlay film |
| TW436491B (en) * | 1997-08-22 | 2001-05-28 | Ciba Sc Holding Ag | Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions |
| JP4191956B2 (en) * | 2002-05-24 | 2008-12-03 | サンノプコ株式会社 | Photosensitive resin composition |
| TWI398724B (en) * | 2005-03-15 | 2013-06-11 | Toray Industries | Photo-sensitive resin composition |
| US7977028B2 (en) * | 2005-06-30 | 2011-07-12 | Toray Industries, Inc. | Photosensitive resin composition and adhesion promoter |
| KR20090038390A (en) * | 2006-07-11 | 2009-04-20 | 니폰 가야꾸 가부시끼가이샤 | Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same |
| JP5125747B2 (en) * | 2007-05-25 | 2013-01-23 | 東レ株式会社 | Photosensitive resin composition |
| TW200908839A (en) * | 2007-08-09 | 2009-02-16 | Nichigo Morton Co Ltd | Solder mask, photoresist pattern forming method and the light-emitting device thereof |
| JP2009258471A (en) * | 2008-04-18 | 2009-11-05 | Toray Ind Inc | Photosensitive resin composition film and method for forming resist using the same |
| JP5402332B2 (en) * | 2009-07-09 | 2014-01-29 | 東レ株式会社 | Photosensitive resin composition, photosensitive resin composition film and multilayer wiring board using the same |
| CN102985505B (en) * | 2010-07-09 | 2014-08-20 | 东丽株式会社 | Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| JP5740915B2 (en) * | 2010-10-28 | 2015-07-01 | 東レ株式会社 | Film laminate |
| WO2013171888A1 (en) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | Alkali-development-type thermoset resin composition and printed circuit board |
-
2013
- 2013-07-09 JP JP2013144034A patent/JP6306296B2/en active Active
-
2014
- 2014-06-17 WO PCT/JP2014/066078 patent/WO2015005077A1/en active Application Filing
- 2014-06-17 CN CN201480039321.0A patent/CN105378564B/en active Active
- 2014-06-17 KR KR1020167003054A patent/KR102372561B1/en active IP Right Grant
- 2014-07-03 TW TW103122978A patent/TWI637665B/en active
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