CN105378564B - 感光性热固性树脂组合物和柔性印刷电路板 - Google Patents

感光性热固性树脂组合物和柔性印刷电路板 Download PDF

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Publication number
CN105378564B
CN105378564B CN201480039321.0A CN201480039321A CN105378564B CN 105378564 B CN105378564 B CN 105378564B CN 201480039321 A CN201480039321 A CN 201480039321A CN 105378564 B CN105378564 B CN 105378564B
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China
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bis
resin composition
resin
dianhydride
photosensitive thermosetting
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Chinese (zh)
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CN105378564A (zh
Inventor
宫部英和
林亮
横山裕
小池直之
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Optics & Photonics (AREA)
CN201480039321.0A 2013-07-09 2014-06-17 感光性热固性树脂组合物和柔性印刷电路板 Active CN105378564B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-144034 2013-07-09
JP2013144034A JP6306296B2 (ja) 2013-07-09 2013-07-09 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
PCT/JP2014/066078 WO2015005077A1 (ja) 2013-07-09 2014-06-17 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
CN105378564A CN105378564A (zh) 2016-03-02
CN105378564B true CN105378564B (zh) 2020-02-07

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CN201480039321.0A Active CN105378564B (zh) 2013-07-09 2014-06-17 感光性热固性树脂组合物和柔性印刷电路板

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Country Link
JP (1) JP6306296B2 (https=)
KR (1) KR102372561B1 (https=)
CN (1) CN105378564B (https=)
TW (1) TWI637665B (https=)
WO (1) WO2015005077A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6363861B2 (ja) * 2014-03-31 2018-07-25 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板
TWI652281B (zh) * 2015-02-18 2019-03-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像聚烯烴組成物
WO2018030761A1 (ko) * 2016-08-09 2018-02-15 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
KR102040224B1 (ko) * 2016-08-09 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP6745344B2 (ja) * 2016-08-31 2020-08-26 富士フイルム株式会社 パターン形成方法、積層体の製造方法および電子デバイスの製造方法
WO2018088754A1 (ko) * 2016-11-11 2018-05-17 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
KR102207604B1 (ko) * 2018-11-06 2021-01-26 (주)이녹스첨단소재 Fpic 필름 및 이의 제조방법
CN110239163B (zh) * 2019-06-13 2021-01-08 东莞市政潮电子科技有限公司 一种提高PI膜与Cu箔间粘结性能的柔性印刷电路板基材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006098291A1 (ja) * 2005-03-15 2006-09-21 Toray Industries, Inc. 感光性樹脂組成物
CN101213491A (zh) * 2005-06-30 2008-07-02 东丽株式会社 感光性树脂组合物及粘合改良剂

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP4191956B2 (ja) * 2002-05-24 2008-12-03 サンノプコ株式会社 感光性樹脂組成物
US20090202793A1 (en) * 2006-07-11 2009-08-13 Nippon Kayaku Kabushiki Kaisha Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same
JP5125747B2 (ja) * 2007-05-25 2013-01-23 東レ株式会社 感光性樹脂組成物
TW200908839A (en) * 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
JP2009258471A (ja) * 2008-04-18 2009-11-05 Toray Ind Inc 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法
JP5402332B2 (ja) * 2009-07-09 2014-01-29 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板
US8759989B2 (en) * 2010-07-09 2014-06-24 Toray Industries, Inc. Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006098291A1 (ja) * 2005-03-15 2006-09-21 Toray Industries, Inc. 感光性樹脂組成物
CN101213491A (zh) * 2005-06-30 2008-07-02 东丽株式会社 感光性树脂组合物及粘合改良剂

Also Published As

Publication number Publication date
TWI637665B (zh) 2018-10-01
JP6306296B2 (ja) 2018-04-04
CN105378564A (zh) 2016-03-02
WO2015005077A1 (ja) 2015-01-15
TW201519708A (zh) 2015-05-16
KR102372561B1 (ko) 2022-03-10
KR20160029111A (ko) 2016-03-14
JP2015018049A (ja) 2015-01-29

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Effective date of registration: 20230607

Address after: Saitama Prefecture, Japan

Patentee after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.

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