JP2015012292A - 発光モジュール及びその製造方法 - Google Patents

発光モジュール及びその製造方法 Download PDF

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Publication number
JP2015012292A
JP2015012292A JP2014129754A JP2014129754A JP2015012292A JP 2015012292 A JP2015012292 A JP 2015012292A JP 2014129754 A JP2014129754 A JP 2014129754A JP 2014129754 A JP2014129754 A JP 2014129754A JP 2015012292 A JP2015012292 A JP 2015012292A
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JP
Japan
Prior art keywords
emitting diode
light emitting
led module
transparent adhesive
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014129754A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015012292A5 (enExample
Inventor
ジィ，リュウ ホン
hong-zhi Liu
ジィ，リュウ ホン
ティン，クオ イ
Yi-Ting Kuo
ティン，クオ イ
チ，チェン ズ
Tzu-Chi Cheng
チ，チェン ズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huga Optotech Inc
Interlight Optotech Corp
Intematix Technology Center Corp
Original Assignee
Huga Optotech Inc
Interlight Optotech Corp
Intematix Technology Center Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huga Optotech Inc, Interlight Optotech Corp, Intematix Technology Center Corp filed Critical Huga Optotech Inc
Publication of JP2015012292A publication Critical patent/JP2015012292A/ja
Publication of JP2015012292A5 publication Critical patent/JP2015012292A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10W72/07554—
    • H10W72/325—
    • H10W72/353—
    • H10W72/354—
    • H10W72/536—
    • H10W72/547—
    • H10W72/884—
    • H10W74/00—
    • H10W90/00—
    • H10W90/734—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2014129754A 2013-06-27 2014-06-25 発光モジュール及びその製造方法 Pending JP2015012292A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW102122873 2013-06-27
TW102122873 2013-06-27
TW103111887A TWI651871B (zh) 2013-06-27 2014-03-27 發光組件及製作方法
TW103111887 2014-03-27

Publications (2)

Publication Number Publication Date
JP2015012292A true JP2015012292A (ja) 2015-01-19
JP2015012292A5 JP2015012292A5 (enExample) 2017-08-03

Family

ID=52115413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014129754A Pending JP2015012292A (ja) 2013-06-27 2014-06-25 発光モジュール及びその製造方法

Country Status (4)

Country Link
US (3) US20150003038A1 (enExample)
JP (1) JP2015012292A (enExample)
CN (2) CN104253200B (enExample)
TW (1) TWI651871B (enExample)

Cited By (4)

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JP2017028205A (ja) * 2015-07-27 2017-02-02 ウシオ電機株式会社 光源装置
JP2017103232A (ja) * 2015-12-02 2017-06-08 羅冠傑 シェル一体型発光ダイオードアセンブリ、シェル一体型発光ダイオードランプ、およびそれらの製造方法
JP2022544879A (ja) * 2019-11-07 2022-10-21 シグニファイ ホールディング ビー ヴィ ３つのタイプのｌｅｄを備える発光ダイオードフィラメント
KR20240155173A (ko) * 2018-09-28 2024-10-28 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 장치

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TW201543720A (zh) * 2014-05-06 2015-11-16 新世紀光電股份有限公司 封裝結構及其製備方法
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
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US12359779B1 (en) * 2015-09-25 2025-07-15 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
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US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
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CN106369367A (zh) * 2015-07-23 2017-02-01 晶元光电股份有限公司 发光装置
DE102015112536A1 (de) * 2015-07-30 2017-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Steckmodul und Beleuchtungsanordnung für den Innenraum einer Fahrzeugkabine
DE102015120085A1 (de) * 2015-11-19 2017-05-24 Osram Opto Semiconductors Gmbh LED-Filamente, Verfahren zur Herstellung von LED-Filamenten und Retrofitlampe mit LED-Filament
CN106449618A (zh) * 2016-01-29 2017-02-22 罗冠杰 灯壳整合型发光二极管装置及其制作方法
JP2017181815A (ja) * 2016-03-30 2017-10-05 パナソニック液晶ディスプレイ株式会社 液晶表示装置
KR101995000B1 (ko) * 2016-05-16 2019-07-01 엘지이노텍 주식회사 발광소자 패키지 및 조명장치
CN106151905A (zh) * 2016-08-15 2016-11-23 浙江阳光美加照明有限公司 一种led发光灯丝及使用该led发光灯丝的led球泡灯
KR102400151B1 (ko) * 2017-05-31 2022-05-20 서울반도체 주식회사 엘이디 패키지 세트 및 이를 포함하는 엘이디 벌브
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US11674644B2 (en) * 2019-05-02 2023-06-13 Signify Holding B.V. LED filament lamp
TWI712188B (zh) * 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
JP7508782B2 (ja) * 2020-01-20 2024-07-02 株式会社リコー 電子デバイス及びその製造方法、画像形成方法、並びに画像形成装置

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JP2017028205A (ja) * 2015-07-27 2017-02-02 ウシオ電機株式会社 光源装置
JP2017103232A (ja) * 2015-12-02 2017-06-08 羅冠傑 シェル一体型発光ダイオードアセンブリ、シェル一体型発光ダイオードランプ、およびそれらの製造方法
KR20240155173A (ko) * 2018-09-28 2024-10-28 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 장치
KR102886339B1 (ko) * 2018-09-28 2025-11-19 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 장치
JP2022544879A (ja) * 2019-11-07 2022-10-21 シグニファイ ホールディング ビー ヴィ ３つのタイプのｌｅｄを備える発光ダイオードフィラメント

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TWI651871B (zh) 2019-02-21
CN111457260A (zh) 2020-07-28
US20150003038A1 (en) 2015-01-01
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