JP2015005621A - 太陽電池用基板およびその製造方法 - Google Patents
太陽電池用基板およびその製造方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 89
- 238000010438 heat treatment Methods 0.000 claims abstract description 67
- 238000009792 diffusion process Methods 0.000 claims abstract description 51
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 39
- 239000007789 gas Substances 0.000 claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 31
- 239000010703 silicon Substances 0.000 claims abstract description 31
- 229910052698 phosphorus Inorganic materials 0.000 claims description 89
- 239000011574 phosphorus Substances 0.000 claims description 89
- 239000012535 impurity Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 31
- 238000006243 chemical reaction Methods 0.000 claims description 9
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 5
- 229910001882 dioxygen Inorganic materials 0.000 claims description 5
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 abstract description 22
- 230000007423 decrease Effects 0.000 abstract description 6
- 230000001629 suppression Effects 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 3
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 73
- 230000008569 process Effects 0.000 description 21
- 238000005215 recombination Methods 0.000 description 21
- 230000006798 recombination Effects 0.000 description 21
- 239000002019 doping agent Substances 0.000 description 20
- 238000009826 distribution Methods 0.000 description 18
- 230000005587 bubbling Effects 0.000 description 13
- 230000003628 erosive effect Effects 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 7
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010248 power generation Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000075 oxide glass Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- -1 phosphorus compound Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 235000008247 Echinochloa frumentacea Nutrition 0.000 description 1
- 240000004072 Panicum sumatrense Species 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
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- H—ELECTRICITY
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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Abstract
【解決手段】 p型シリコン基板の一面から燐を拡散して太陽電池用基板を製造するに際して、オキシ塩化燐溶液中に窒素ガスが1000(ml/min)以下の少ない流量で供給されてドープ用混合ガスが得られる。そのため、加熱炉内に導入されるドープ用混合ガス中のオキシ塩化燐濃度が薄くなることから、基板表面に堆積されるPSG層が比較的薄くなって、基板表面の燐濃度の最大値を低くすることができるので、熱処理時間を長くして拡散深さを深くし、平均濃度1.0〜4.0×1020(個/cm3)、50(nm)深さにおける濃度0.10〜1.6×1020(個/cm3)、シート抵抗70〜120(Ω/□)を容易に実現できる。
【選択図】図4
Description
Claims (8)
- p型シリコン基板の一面側に燐の拡散によりn層が形成された太陽電池用基板であって、
前記一面におけるシート抵抗が50〜120(Ω/□)の範囲内にあり、且つ、前記n層の燐濃度は、前記一面から50(nm)深さまでの範囲の最大値が8×1020(個/cm3)以下、且つ、平均値が1.0×1020(個/cm3)以上、且つ、その50(nm)深さにおける値が1.6×1020(個/cm3)以下であることを特徴とする太陽電池用基板。 - 前記n層の燐濃度は前記一面から50(nm)深さまでの平均値が4.0×1020(個/cm3)以下、且つ、その50(nm)深さにおける値が0.1×1020(個/cm3)以上である請求項1の太陽電池用基板。
- 前記n層の燐濃度は前記50(nm)深さにおける値が0.3×1020(個/cm3)〜1.5×1020(個/cm3)の範囲内にある請求項2の太陽電池用基板。
- p型シリコン基板の一面側に燐の拡散によりn層が形成された太陽電池用基板であって、
前記一面におけるシート抵抗が70〜110(Ω/□)の範囲内にあり、且つ、前記n層の燐濃度は、前記一面から30(nm)深さまでの範囲の最大値が8×1020(個/cm3)以下、且つ、平均値が1.2×1020(個/cm3)以上、且つ、その30(nm)深さにおける値が2.9×1020(個/cm3)以下であることを特徴とする太陽電池用基板。 - 前記n層の燐濃度は前記一面から30(nm)深さまでの平均値が4.0×1020(個/cm3)以下、且つ、その30(nm)深さにおける値が0.4×1020(個/cm3)以上である請求項4の太陽電池用基板。
- 前記n層の燐濃度は前記30(nm)深さにおける値が0.7×1020(個/cm3)〜2.3×1020(個/cm3)の範囲内にある請求項5の太陽電池用基板。
- 所定の不純物の溶液中に窒素ガスを供給することにより生成された不純物ガスを窒素ガスおよび酸素ガスと共に反応容器内に導入して、その反応容器内に予め配置されたp型シリコン基板の一面にその不純物を高濃度で含む酸化物層を形成する酸化物層形成工程と、ガス導入を停止してその反応容器内を所定温度に加熱することによりその酸化物層を拡散源として前記一面から前記不純物を熱拡散させて前記p型シリコン基板の一面にn層を形成する熱処理工程とを含む太陽電池用基板の製造方法であって、
前記酸化物層形成工程は、前記窒素ガスが1000(ml/min)以下の流量で前記不純物の溶液中に供給されることを特徴とする太陽電池用基板の製造方法。 - 前記熱処理工程は、前記酸化物層形成工程に続く第1熱処理工程と、その第1熱処理工程よりも高温で熱処理を施す第2熱処理工程とを含むものである請求項7の太陽電池用基板の製造方法。
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JP2013130021A JP2015005621A (ja) | 2013-06-20 | 2013-06-20 | 太陽電池用基板およびその製造方法 |
TW103120533A TW201505190A (zh) | 2013-06-20 | 2014-06-13 | 太陽電池用基板及其製造方法 |
CN201410272789.6A CN104241104A (zh) | 2013-06-20 | 2014-06-18 | 太阳能电池用基板及其制造方法 |
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CN115394881A (zh) * | 2022-09-30 | 2022-11-25 | 滁州捷泰新能源科技有限公司 | 一种磷浓度梯度分布的topcon电池及其制作方法 |
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JP6254748B1 (ja) * | 2016-11-14 | 2017-12-27 | 信越化学工業株式会社 | 高光電変換効率太陽電池の製造方法及び高光電変換効率太陽電池 |
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WO2022114026A1 (ja) * | 2020-11-30 | 2022-06-02 | Agc株式会社 | 透明電極基板及び太陽電池 |
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CN114914173A (zh) * | 2022-04-11 | 2022-08-16 | 江苏晟驰微电子有限公司 | 一种功率器件制造用涂源装置 |
CN114914173B (zh) * | 2022-04-11 | 2023-09-19 | 江苏晟驰微电子有限公司 | 一种功率器件制造用涂源装置 |
CN115394881A (zh) * | 2022-09-30 | 2022-11-25 | 滁州捷泰新能源科技有限公司 | 一种磷浓度梯度分布的topcon电池及其制作方法 |
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TW201505190A (zh) | 2015-02-01 |
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