JP2014531714A - 回路基板取付器具を備えた照明デバイス - Google Patents
回路基板取付器具を備えた照明デバイス Download PDFInfo
- Publication number
- JP2014531714A JP2014531714A JP2014531343A JP2014531343A JP2014531714A JP 2014531714 A JP2014531714 A JP 2014531714A JP 2014531343 A JP2014531343 A JP 2014531343A JP 2014531343 A JP2014531343 A JP 2014531343A JP 2014531714 A JP2014531714 A JP 2014531714A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lighting device
- frame
- slot
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001169 thermoplastic Polymers 0.000 claims description 19
- 239000004416 thermosoftening plastic Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 14
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000004033 plastic Substances 0.000 description 10
- 238000004382 potting Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 238000010420 art technique Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 108010036050 human cationic antimicrobial protein 57 Proteins 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (14)
- 光源と、前記光源を制御する回路基板と、スロットを含む回路基板フレームとを有し、前記回路基板の縁端は、前記回路基板が前記回路基板フレームと熱的に接触するように前記スロット内に取り付けられる、照明デバイス。
- 前記回路基板フレームは、前記回路基板を電気的に絶縁するための電気絶縁材料を有する、請求項1に記載の照明デバイス。
- 前記回路基板フレームは少なくとも部分的に熱可塑性プラスチックで作製されている、請求項1に記載の照明デバイス。
- 前記スロットは真直であり、前記回路基板は僅かに湾曲されている、請求項1に記載の照明デバイス。
- 前記回路基板フレームは、前記スロットが延在するリブを更に有する、請求項1に記載の照明デバイス。
- 前記回路基板フレームは、前記回路基板を囲む電気絶縁ハウジングを更に有する、請求項1に記載の照明デバイス。
- 前記リブは前記ハウジングと一体化されている、請求項5及び請求項6に記載の照明デバイス。
- 前記回路基板フレームは、電気絶縁箔を更に有し、前記電気絶縁箔と前記リブとは前記回路基板を囲む、請求項5に記載の照明デバイス。
- 前記照明デバイスは口金を更に有し、前記回路基板フレームは前記口金の外部分と一体化されている、請求項1に記載の照明デバイス。
- 前記回路基板フレームと熱的に接触しているヒートシンクを更に有する、請求項1に記載の照明デバイス。
- 前記スロットは、少なくとも1mmの深さ、好ましくは、少なくとも2mmの深さ、更により好ましくは、少なくとも4mmの深さである、請求項1に記載の照明デバイス。
- 前記回路基板の自己加熱構成要素が、前記回路基板の前記縁端の近傍に配置される、請求項1に記載の照明デバイス。
- 前記回路基板フレームは追加のスロットを有し、前記回路基板の別の縁端が、前記追加のスロット内においても、前記回路基板が前記回路基板フレームと熱的に接触するように取り付けられている、請求項1に記載の照明デバイス。
- 前記リブは前記ヒートシンクの内側上に取り付けられ、好ましくは成形されている、請求項5及び請求項10に記載の照明デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161538180P | 2011-09-23 | 2011-09-23 | |
US61/538,180 | 2011-09-23 | ||
PCT/IB2012/054710 WO2013042008A2 (en) | 2011-09-23 | 2012-09-11 | Lighting device with a circuit board mounting |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014531714A true JP2014531714A (ja) | 2014-11-27 |
JP2014531714A5 JP2014531714A5 (ja) | 2015-11-05 |
JP6157476B2 JP6157476B2 (ja) | 2017-07-05 |
Family
ID=47148869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014531343A Active JP6157476B2 (ja) | 2011-09-23 | 2012-09-11 | 回路基板取付器具を備えた照明デバイス |
Country Status (9)
Country | Link |
---|---|
US (1) | US9182110B2 (ja) |
EP (1) | EP2745046B1 (ja) |
JP (1) | JP6157476B2 (ja) |
CN (1) | CN103827578B (ja) |
ES (1) | ES2560833T3 (ja) |
IN (1) | IN2014CN01872A (ja) |
PL (1) | PL2745046T3 (ja) |
RU (1) | RU2608566C2 (ja) |
WO (1) | WO2013042008A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9016899B2 (en) * | 2012-10-17 | 2015-04-28 | Lighting Science Group Corporation | Luminaire with modular cooling system and associated methods |
DE102015216662A1 (de) * | 2015-09-01 | 2017-03-02 | Osram Gmbh | Leuchtmittel mit LEDs |
ES2902161T3 (es) * | 2017-08-24 | 2022-03-25 | Leedarson America Inc | Aparato óptico |
WO2020010473A1 (en) * | 2018-07-13 | 2020-01-16 | 10644137 Canada Inc. | High-performance high-power led lighting systems and methods thereof |
CN114198651B (zh) * | 2021-12-10 | 2024-04-19 | 东莞市鸿庆光电科技有限公司 | 一种新型led光源结构 |
Citations (6)
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WO2000058997A1 (fr) * | 1999-03-30 | 2000-10-05 | Matsushita Electric Industrial Co., Ltd. | Lampe fluorescente compacte a autostabilisation |
JP2001274571A (ja) * | 2000-03-27 | 2001-10-05 | Ricoh Co Ltd | 回路基板の固定支持機構 |
JP2006059738A (ja) * | 2004-08-23 | 2006-03-02 | Nagano Japan Radio Co | 放電灯照明装置 |
WO2009145109A1 (ja) * | 2008-05-29 | 2009-12-03 | 電気化学工業株式会社 | 金属ベース回路基板 |
JP2010003579A (ja) * | 2008-06-20 | 2010-01-07 | Sharp Corp | 放熱部材、放熱ユニット及び照明装置 |
JP2011082122A (ja) * | 2009-10-09 | 2011-04-21 | Aps Japan Co Ltd | 照明装置 |
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CN100516631C (zh) | 2004-09-27 | 2009-07-22 | 陈仕群 | Led灯 |
WO2006101190A1 (ja) * | 2005-03-24 | 2006-09-28 | Toshiba Lighting & Technology Corporation | 電球形蛍光ランプおよび照明装置 |
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JP5236937B2 (ja) | 2006-11-01 | 2013-07-17 | 展生 小田 | 電池電圧低下表示機能つきledライトユニット |
US7976182B2 (en) | 2007-03-21 | 2011-07-12 | International Rectifier Corporation | LED lamp assembly with temperature control and method of making the same |
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2012
- 2012-09-11 PL PL12784071T patent/PL2745046T3/pl unknown
- 2012-09-11 ES ES12784071.8T patent/ES2560833T3/es active Active
- 2012-09-11 RU RU2014116266A patent/RU2608566C2/ru active
- 2012-09-11 US US14/344,073 patent/US9182110B2/en active Active
- 2012-09-11 CN CN201280046547.4A patent/CN103827578B/zh active Active
- 2012-09-11 EP EP12784071.8A patent/EP2745046B1/en active Active
- 2012-09-11 IN IN1872CHN2014 patent/IN2014CN01872A/en unknown
- 2012-09-11 JP JP2014531343A patent/JP6157476B2/ja active Active
- 2012-09-11 WO PCT/IB2012/054710 patent/WO2013042008A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2000058997A1 (fr) * | 1999-03-30 | 2000-10-05 | Matsushita Electric Industrial Co., Ltd. | Lampe fluorescente compacte a autostabilisation |
JP2001274571A (ja) * | 2000-03-27 | 2001-10-05 | Ricoh Co Ltd | 回路基板の固定支持機構 |
JP2006059738A (ja) * | 2004-08-23 | 2006-03-02 | Nagano Japan Radio Co | 放電灯照明装置 |
WO2009145109A1 (ja) * | 2008-05-29 | 2009-12-03 | 電気化学工業株式会社 | 金属ベース回路基板 |
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Also Published As
Publication number | Publication date |
---|---|
EP2745046B1 (en) | 2015-11-25 |
EP2745046A2 (en) | 2014-06-25 |
CN103827578B (zh) | 2019-06-07 |
WO2013042008A2 (en) | 2013-03-28 |
CN103827578A (zh) | 2014-05-28 |
WO2013042008A3 (en) | 2013-06-06 |
PL2745046T3 (pl) | 2016-04-29 |
IN2014CN01872A (ja) | 2015-05-29 |
RU2608566C2 (ru) | 2017-01-23 |
JP6157476B2 (ja) | 2017-07-05 |
ES2560833T3 (es) | 2016-02-23 |
RU2014116266A (ru) | 2015-10-27 |
US9182110B2 (en) | 2015-11-10 |
US20140376238A1 (en) | 2014-12-25 |
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