JP2014531505A5 - - Google Patents
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- Publication number
- JP2014531505A5 JP2014531505A5 JP2014534933A JP2014534933A JP2014531505A5 JP 2014531505 A5 JP2014531505 A5 JP 2014531505A5 JP 2014534933 A JP2014534933 A JP 2014534933A JP 2014534933 A JP2014534933 A JP 2014534933A JP 2014531505 A5 JP2014531505 A5 JP 2014531505A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- epoxy
- epoxy adhesive
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 31
- 229920006332 epoxy adhesive Polymers 0.000 claims description 19
- 150000002978 peroxides Chemical class 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 238000001879 gelation Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 150000003573 thiols Chemical group 0.000 claims 8
- 238000000034 method Methods 0.000 claims 3
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000013008 thixotropic agent Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 239000012744 reinforcing agent Substances 0.000 claims 1
- 229920000570 polyether Polymers 0.000 description 4
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 2
- YMOIBQNMVPBEEZ-UHFFFAOYSA-N 2-phenoxyethoxycarbonyloxy 2-phenoxyethyl carbonate Chemical compound C=1C=CC=CC=1OCCOC(=O)OOC(=O)OCCOC1=CC=CC=C1 YMOIBQNMVPBEEZ-UHFFFAOYSA-N 0.000 description 2
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 2
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- -1 thiol compounds Chemical class 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- XJHMOGCOFPLTNG-UHFFFAOYSA-N 2,2-dihydroperoxypropane Chemical compound OOC(C)(C)OO XJHMOGCOFPLTNG-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- RFSCGDQQLKVJEJ-UHFFFAOYSA-N 2-methylbutan-2-yl benzenecarboperoxoate Chemical compound CCC(C)(C)OOC(=O)C1=CC=CC=C1 RFSCGDQQLKVJEJ-UHFFFAOYSA-N 0.000 description 1
- QRIQYQXNFSXNGR-UHFFFAOYSA-N 3,3,6,6,9,9-hexamethyl-1,2,4,5-tetraoxonane Chemical compound CC1(C)CCC(C)(C)OOC(C)(C)OO1 QRIQYQXNFSXNGR-UHFFFAOYSA-N 0.000 description 1
- VKERWIBXKLNXCY-UHFFFAOYSA-N 3,5,5-trimethyl-2-(2-methylbutan-2-ylperoxy)hexanoic acid Chemical compound CCC(C)(C)OOC(C(O)=O)C(C)CC(C)(C)C VKERWIBXKLNXCY-UHFFFAOYSA-N 0.000 description 1
- NHQDETIJWKXCTC-UHFFFAOYSA-N 3-chloroperbenzoic acid Chemical compound OOC(=O)C1=CC=CC(Cl)=C1 NHQDETIJWKXCTC-UHFFFAOYSA-N 0.000 description 1
- GFYYWCPQFKCXPK-UHFFFAOYSA-N 3-tert-butylperoxy-2-methylbenzoic acid Chemical compound CC1=C(OOC(C)(C)C)C=CC=C1C(O)=O GFYYWCPQFKCXPK-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-M hydrosulfide Chemical compound [SH-] RWSOTUBLDIXVET-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNPCT/CN2011/080626 | 2011-10-11 | ||
| PCT/CN2011/080626 WO2013053100A1 (en) | 2011-10-11 | 2011-10-11 | Gel time controllable two part epoxy adhesive |
| PCT/CN2012/082794 WO2013053328A1 (en) | 2011-10-11 | 2012-10-11 | Gel time controllable two part epoxy adhesive |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014531505A JP2014531505A (ja) | 2014-11-27 |
| JP2014531505A5 true JP2014531505A5 (https=) | 2015-11-26 |
| JP6095016B2 JP6095016B2 (ja) | 2017-03-15 |
Family
ID=48081345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014534933A Expired - Fee Related JP6095016B2 (ja) | 2011-10-11 | 2012-10-11 | ゲル化時間を調整可能な２液型エポキシ接着剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9371475B2 (https=) |
| EP (1) | EP2766444B1 (https=) |
| JP (1) | JP6095016B2 (https=) |
| KR (1) | KR102049224B1 (https=) |
| ES (1) | ES2636686T3 (https=) |
| IN (1) | IN2014CN02625A (https=) |
| WO (2) | WO2013053100A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101693605B1 (ko) | 2015-02-10 | 2017-01-17 | 한국생산기술연구원 | 폴리티올 경화제를 포함하는 에폭시 접착제 조성물 및 이의 제조방법 |
| US11230617B2 (en) | 2017-10-31 | 2022-01-25 | Namics Corporation | Resin composition |
| EP3865519B1 (en) | 2018-10-05 | 2023-04-19 | Namics Corporation | Resin composition |
| EP3865520B1 (en) | 2018-10-09 | 2024-02-28 | Namics Corporation | Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound |
| CN111171284A (zh) * | 2020-01-07 | 2020-05-19 | 南宁珀源能源材料有限公司 | 一种环氧改性脂肪胺固化剂及其在硅锭切割固定胶的应用 |
| CN112375209B (zh) * | 2020-10-30 | 2022-07-22 | 山东益丰生化环保股份有限公司 | 一种凝胶时间可控的环氧树脂胶黏剂中的固化剂及其制备方法 |
| KR102765200B1 (ko) * | 2021-10-15 | 2025-02-07 | 주식회사 네패스 | 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성 |
| EP4702072A1 (en) * | 2023-04-24 | 2026-03-04 | Medtronic, Inc. | Implantable medical device with curable liquid feedthrough potting adhesive |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3727847A1 (de) * | 1987-08-20 | 1989-03-02 | Fuller H B Co | Schmelzklebstoff und verfahren zu seiner herstellung und verarbeitung |
| JP3038777B2 (ja) * | 1990-04-05 | 2000-05-08 | 大日本インキ化学工業株式会社 | 不飽和ポリエステル樹脂系塗床材の施工方法 |
| JPH0676428B2 (ja) | 1990-05-16 | 1994-09-28 | 第一工業製薬株式会社 | ショ糖脂肪酸エステルの脱色方法 |
| JP2500526B2 (ja) | 1990-12-25 | 1996-05-29 | 凸版印刷株式会社 | フォトマスクブランクおよびフォトマスク |
| JP3584537B2 (ja) | 1995-03-31 | 2004-11-04 | 東レ・ファインケミカル株式会社 | チオール基含有ポリエーテルポリマー及びその製造 方法 |
| US6653371B1 (en) | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
| CN1165592C (zh) * | 1998-01-16 | 2004-09-08 | 洛克泰特(R&D)有限公司 | 可固化的环氧基组合物 |
| US6495653B1 (en) | 1998-04-17 | 2002-12-17 | Sanyo Chemical Industries, Ltd. | Curable composition and cured article thereof |
| JP3802253B2 (ja) * | 1998-12-22 | 2006-07-26 | 化薬アクゾ株式会社 | 樹脂の硬化促進剤及び硬化方法 |
| US6313257B1 (en) * | 1999-03-23 | 2001-11-06 | Lord Corporation | Poly (mercaptopropylaryl) curatives |
| JP2003231736A (ja) * | 2002-02-08 | 2003-08-19 | Nagase Chemtex Corp | ２液型リペアラブル組成物およびそれを用いたリペアラブル接着剤 |
| DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
| JP4707981B2 (ja) * | 2004-08-06 | 2011-06-22 | 昭和電工株式会社 | 成形物の製造方法 |
| CA2624381A1 (en) * | 2005-10-07 | 2007-04-19 | Dsm Ip Assets B.V. | Method for chemical anchoring |
| JP5076691B2 (ja) | 2007-07-11 | 2012-11-21 | Ｊｆｅスチール株式会社 | 高強度冷延鋼板の製造方法 |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| KR101187948B1 (ko) | 2007-12-13 | 2012-10-05 | 쇼와 덴코 가부시키가이샤 | 에폭시 수지 경화제 및 그 제조 방법 및 에폭시 수지 조성물 |
| EP2229416B1 (en) * | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
| JP5466368B2 (ja) * | 2008-02-18 | 2014-04-09 | 積水化学工業株式会社 | 電子部品接合用接着剤 |
| EP2268696A1 (en) * | 2008-04-14 | 2011-01-05 | Dow Global Technologies Inc. | Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions |
| CN101698787B (zh) * | 2009-11-12 | 2013-01-09 | 镇江市电子化工材料工程研究中心有限公司 | 一种叶片修补用环氧树脂粘结剂及其制备方法 |
| WO2011064360A1 (en) * | 2009-11-30 | 2011-06-03 | Dsm Ip Assets B.V. | Resin suitable for construction purposes comprising norbornene functional groups and thiols |
-
2011
- 2011-10-11 WO PCT/CN2011/080626 patent/WO2013053100A1/en not_active Ceased
-
2012
- 2012-10-11 ES ES12839460.8T patent/ES2636686T3/es active Active
- 2012-10-11 WO PCT/CN2012/082794 patent/WO2013053328A1/en not_active Ceased
- 2012-10-11 JP JP2014534933A patent/JP6095016B2/ja not_active Expired - Fee Related
- 2012-10-11 EP EP12839460.8A patent/EP2766444B1/en not_active Not-in-force
- 2012-10-11 KR KR1020147009425A patent/KR102049224B1/ko not_active Expired - Fee Related
- 2012-10-11 IN IN2625CHN2014 patent/IN2014CN02625A/en unknown
-
2014
- 2014-04-11 US US14/251,234 patent/US9371475B2/en not_active Expired - Fee Related
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