JP2014531505A5 - - Google Patents
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- Publication number
- JP2014531505A5 JP2014531505A5 JP2014534933A JP2014534933A JP2014531505A5 JP 2014531505 A5 JP2014531505 A5 JP 2014531505A5 JP 2014534933 A JP2014534933 A JP 2014534933A JP 2014534933 A JP2014534933 A JP 2014534933A JP 2014531505 A5 JP2014531505 A5 JP 2014531505A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- epoxy
- epoxy adhesive
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 31
- 229920006332 epoxy adhesive Polymers 0.000 claims description 19
- 150000002978 peroxides Chemical class 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 238000001879 gelation Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 150000003573 thiols Chemical group 0.000 claims 8
- 238000000034 method Methods 0.000 claims 3
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000013008 thixotropic agent Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 239000012744 reinforcing agent Substances 0.000 claims 1
- 229920000570 polyether Polymers 0.000 description 4
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 2
- YMOIBQNMVPBEEZ-UHFFFAOYSA-N 2-phenoxyethoxycarbonyloxy 2-phenoxyethyl carbonate Chemical compound C=1C=CC=CC=1OCCOC(=O)OOC(=O)OCCOC1=CC=CC=C1 YMOIBQNMVPBEEZ-UHFFFAOYSA-N 0.000 description 2
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 2
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- -1 thiol compounds Chemical class 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- XJHMOGCOFPLTNG-UHFFFAOYSA-N 2,2-dihydroperoxypropane Chemical compound OOC(C)(C)OO XJHMOGCOFPLTNG-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- RFSCGDQQLKVJEJ-UHFFFAOYSA-N 2-methylbutan-2-yl benzenecarboperoxoate Chemical compound CCC(C)(C)OOC(=O)C1=CC=CC=C1 RFSCGDQQLKVJEJ-UHFFFAOYSA-N 0.000 description 1
- QRIQYQXNFSXNGR-UHFFFAOYSA-N 3,3,6,6,9,9-hexamethyl-1,2,4,5-tetraoxonane Chemical compound CC1(C)CCC(C)(C)OOC(C)(C)OO1 QRIQYQXNFSXNGR-UHFFFAOYSA-N 0.000 description 1
- VKERWIBXKLNXCY-UHFFFAOYSA-N 3,5,5-trimethyl-2-(2-methylbutan-2-ylperoxy)hexanoic acid Chemical compound CCC(C)(C)OOC(C(O)=O)C(C)CC(C)(C)C VKERWIBXKLNXCY-UHFFFAOYSA-N 0.000 description 1
- NHQDETIJWKXCTC-UHFFFAOYSA-N 3-chloroperbenzoic acid Chemical compound OOC(=O)C1=CC=CC(Cl)=C1 NHQDETIJWKXCTC-UHFFFAOYSA-N 0.000 description 1
- GFYYWCPQFKCXPK-UHFFFAOYSA-N 3-tert-butylperoxy-2-methylbenzoic acid Chemical compound CC1=C(OOC(C)(C)C)C=CC=C1C(O)=O GFYYWCPQFKCXPK-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-M hydrosulfide Chemical compound [SH-] RWSOTUBLDIXVET-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNPCT/CN2011/080626 | 2011-10-11 | ||
| PCT/CN2011/080626 WO2013053100A1 (en) | 2011-10-11 | 2011-10-11 | Gel time controllable two part epoxy adhesive |
| PCT/CN2012/082794 WO2013053328A1 (en) | 2011-10-11 | 2012-10-11 | Gel time controllable two part epoxy adhesive |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014531505A JP2014531505A (ja) | 2014-11-27 |
| JP2014531505A5 true JP2014531505A5 (cg-RX-API-DMAC7.html) | 2015-11-26 |
| JP6095016B2 JP6095016B2 (ja) | 2017-03-15 |
Family
ID=48081345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014534933A Expired - Fee Related JP6095016B2 (ja) | 2011-10-11 | 2012-10-11 | ゲル化時間を調整可能な２液型エポキシ接着剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9371475B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2766444B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6095016B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102049224B1 (cg-RX-API-DMAC7.html) |
| ES (1) | ES2636686T3 (cg-RX-API-DMAC7.html) |
| IN (1) | IN2014CN02625A (cg-RX-API-DMAC7.html) |
| WO (2) | WO2013053100A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101693605B1 (ko) | 2015-02-10 | 2017-01-17 | 한국생산기술연구원 | 폴리티올 경화제를 포함하는 에폭시 접착제 조성물 및 이의 제조방법 |
| TWI804523B (zh) | 2017-10-31 | 2023-06-11 | 日商納美仕有限公司 | 樹脂組成物 |
| TWI812789B (zh) | 2018-10-05 | 2023-08-21 | 日商納美仕有限公司 | 樹脂組成物 |
| WO2020075707A1 (ja) | 2018-10-09 | 2020-04-16 | ナミックス株式会社 | ２－メチレン－１，３－ジカルボニル化合物を硬化させるための硬化剤組成物 |
| CN111171284A (zh) * | 2020-01-07 | 2020-05-19 | 南宁珀源能源材料有限公司 | 一种环氧改性脂肪胺固化剂及其在硅锭切割固定胶的应用 |
| CN112375209B (zh) * | 2020-10-30 | 2022-07-22 | 山东益丰生化环保股份有限公司 | 一种凝胶时间可控的环氧树脂胶黏剂中的固化剂及其制备方法 |
| KR102765200B1 (ko) * | 2021-10-15 | 2025-02-07 | 주식회사 네패스 | 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성 |
| CN120917076A (zh) * | 2023-04-24 | 2025-11-07 | 美敦力公司 | 具有可固化液体馈通灌封粘合剂的植入式医疗装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3727847A1 (de) * | 1987-08-20 | 1989-03-02 | Fuller H B Co | Schmelzklebstoff und verfahren zu seiner herstellung und verarbeitung |
| JP3038777B2 (ja) * | 1990-04-05 | 2000-05-08 | 大日本インキ化学工業株式会社 | 不飽和ポリエステル樹脂系塗床材の施工方法 |
| JPH0676428B2 (ja) | 1990-05-16 | 1994-09-28 | 第一工業製薬株式会社 | ショ糖脂肪酸エステルの脱色方法 |
| JP2500526B2 (ja) | 1990-12-25 | 1996-05-29 | 凸版印刷株式会社 | フォトマスクブランクおよびフォトマスク |
| JP3584537B2 (ja) | 1995-03-31 | 2004-11-04 | 東レ・ファインケミカル株式会社 | チオール基含有ポリエーテルポリマー及びその製造 方法 |
| US6653371B1 (en) | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
| WO1999036484A1 (en) * | 1998-01-16 | 1999-07-22 | Loctite (R & D) Limited | Curable epoxy-based compositions |
| US6495653B1 (en) | 1998-04-17 | 2002-12-17 | Sanyo Chemical Industries, Ltd. | Curable composition and cured article thereof |
| JP3802253B2 (ja) * | 1998-12-22 | 2006-07-26 | 化薬アクゾ株式会社 | 樹脂の硬化促進剤及び硬化方法 |
| US6313257B1 (en) * | 1999-03-23 | 2001-11-06 | Lord Corporation | Poly (mercaptopropylaryl) curatives |
| JP2003231736A (ja) * | 2002-02-08 | 2003-08-19 | Nagase Chemtex Corp | ２液型リペアラブル組成物およびそれを用いたリペアラブル接着剤 |
| DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
| JP4707981B2 (ja) | 2004-08-06 | 2011-06-22 | 昭和電工株式会社 | 成形物の製造方法 |
| JP5248318B2 (ja) * | 2005-10-07 | 2013-07-31 | ディーエスエム アイピー アセッツ ビー．ブイ． | 化学的固着のための方法 |
| JP5076691B2 (ja) | 2007-07-11 | 2012-11-21 | Ｊｆｅスチール株式会社 | 高強度冷延鋼板の製造方法 |
| JP5336485B2 (ja) * | 2007-08-02 | 2013-11-06 | ダウ グローバル テクノロジーズ エルエルシー | 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー |
| KR101187948B1 (ko) | 2007-12-13 | 2012-10-05 | 쇼와 덴코 가부시키가이샤 | 에폭시 수지 경화제 및 그 제조 방법 및 에폭시 수지 조성물 |
| BRPI0905387B1 (pt) * | 2008-01-08 | 2019-08-06 | Dow Global Technologies Inc. | Composição curável e resina termofixa enrijecida |
| JP5466368B2 (ja) * | 2008-02-18 | 2014-04-09 | 積水化学工業株式会社 | 電子部品接合用接着剤 |
| JP5840948B2 (ja) * | 2008-04-14 | 2016-01-06 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ系組成物の反応発熱を低下させるための吸熱相転移を受ける充填剤の使用 |
| CN101698787B (zh) * | 2009-11-12 | 2013-01-09 | 镇江市电子化工材料工程研究中心有限公司 | 一种叶片修补用环氧树脂粘结剂及其制备方法 |
| CN102639579B (zh) * | 2009-11-30 | 2014-03-12 | 帝斯曼知识产权资产管理有限公司 | 适用于结构目的的包含降冰片烯官能团和硫醇的树脂 |
-
2011
- 2011-10-11 WO PCT/CN2011/080626 patent/WO2013053100A1/en not_active Ceased
-
2012
- 2012-10-11 WO PCT/CN2012/082794 patent/WO2013053328A1/en not_active Ceased
- 2012-10-11 JP JP2014534933A patent/JP6095016B2/ja not_active Expired - Fee Related
- 2012-10-11 ES ES12839460.8T patent/ES2636686T3/es active Active
- 2012-10-11 KR KR1020147009425A patent/KR102049224B1/ko not_active Expired - Fee Related
- 2012-10-11 EP EP12839460.8A patent/EP2766444B1/en not_active Not-in-force
- 2012-10-11 IN IN2625CHN2014 patent/IN2014CN02625A/en unknown
-
2014
- 2014-04-11 US US14/251,234 patent/US9371475B2/en not_active Expired - Fee Related
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