JP2014530280A5 - - Google Patents

Download PDF

Info

Publication number
JP2014530280A5
JP2014530280A5 JP2014534790A JP2014534790A JP2014530280A5 JP 2014530280 A5 JP2014530280 A5 JP 2014530280A5 JP 2014534790 A JP2014534790 A JP 2014534790A JP 2014534790 A JP2014534790 A JP 2014534790A JP 2014530280 A5 JP2014530280 A5 JP 2014530280A5
Authority
JP
Japan
Prior art keywords
gel
iron acetylacetonate
hydrosilylation
silicon
average
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014534790A
Other languages
English (en)
Japanese (ja)
Other versions
JP6285359B2 (ja
JP2014530280A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/059015 external-priority patent/WO2013052838A1/en
Publication of JP2014530280A publication Critical patent/JP2014530280A/ja
Publication of JP2014530280A5 publication Critical patent/JP2014530280A5/ja
Application granted granted Critical
Publication of JP6285359B2 publication Critical patent/JP6285359B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014534790A 2011-10-06 2012-10-05 改善された熱安定性を有するゲルを形成する方法 Active JP6285359B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161544001P 2011-10-06 2011-10-06
US61/544,001 2011-10-06
PCT/US2012/059015 WO2013052838A1 (en) 2011-10-06 2012-10-05 Method of forming a gel having improved thermal stability

Publications (3)

Publication Number Publication Date
JP2014530280A JP2014530280A (ja) 2014-11-17
JP2014530280A5 true JP2014530280A5 (cg-RX-API-DMAC7.html) 2015-11-19
JP6285359B2 JP6285359B2 (ja) 2018-02-28

Family

ID=47116380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014534790A Active JP6285359B2 (ja) 2011-10-06 2012-10-05 改善された熱安定性を有するゲルを形成する方法

Country Status (7)

Country Link
US (1) US20140287247A1 (cg-RX-API-DMAC7.html)
EP (1) EP2764055B1 (cg-RX-API-DMAC7.html)
JP (1) JP6285359B2 (cg-RX-API-DMAC7.html)
KR (1) KR101901122B1 (cg-RX-API-DMAC7.html)
CN (1) CN103917603B (cg-RX-API-DMAC7.html)
TW (1) TWI575025B (cg-RX-API-DMAC7.html)
WO (1) WO2013052838A1 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180127552A1 (en) * 2011-10-06 2018-05-10 Dow Corning Corporation Method Of Forming A Gel Having Improved Thermal Stability
JP5962599B2 (ja) * 2013-06-26 2016-08-03 信越化学工業株式会社 耐熱性に優れたシリコーンゲル組成物
EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
CN105358616B (zh) * 2013-09-03 2017-04-19 道康宁公司 用于有机硅封装材料的添加剂
FR3028258B1 (fr) * 2014-11-07 2017-01-13 Bluestar Silicones France Nouveaux catalyseurs de reticulation de compositions silicones
EP3228084A4 (en) * 2014-12-01 2018-04-25 Inscape Data, Inc. System and method for continuous media segment identification
WO2017082338A1 (ja) * 2015-11-13 2017-05-18 戸田工業株式会社 鉄酸化物-炭素複合体粒子粉末及びその製造方法
EP4519083A1 (fr) * 2022-05-03 2025-03-12 Elkem Silicones France SAS Article apte au contact alimentaire et son procédé de fabrication

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029629A (en) * 1975-10-06 1977-06-14 General Electric Company Solvent resistant room temperature vulcanizable silicone rubber composition
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US4528313A (en) * 1984-06-15 1985-07-09 Dow Corning Corporation Polydimethylsiloxanes having improved thermal stability
JPS62149751A (ja) * 1985-12-25 1987-07-03 Dow Corning Kk 耐熱性ポリオルガノシロキサン組成物
GB9219208D0 (en) * 1992-09-10 1992-10-28 Dow Corning Gmbh Elastomer-forming composition
JP3008766B2 (ja) * 1992-12-14 2000-02-14 信越化学工業株式会社 ヒドロシリル化反応方法
US5371163A (en) * 1993-11-02 1994-12-06 Dow Corning Corporation Organosiloxane compositions yielding tough elastomeric materials
JP3765444B2 (ja) 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
US6962685B2 (en) * 2002-04-17 2005-11-08 International Business Machines Corporation Synthesis of magnetite nanoparticles and the process of forming Fe-based nanomaterials
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
JP4605342B2 (ja) * 2004-05-11 2011-01-05 信越化学工業株式会社 耐熱用付加反応硬化型シリコーンゴム組成物及びシリコーン接着剤
JP2006283012A (ja) * 2005-03-08 2006-10-19 Adeka Corp ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP5168732B2 (ja) * 2007-09-21 2013-03-27 信越化学工業株式会社 変位耐久性を有する硬化物を与えるシリコーンゲル組成物
JP5288872B2 (ja) * 2008-04-28 2013-09-11 信越化学工業株式会社 加熱硬化型シリコーン組成物
CN103298887A (zh) * 2011-01-26 2013-09-11 道康宁公司 高温稳定的导热材料

Similar Documents

Publication Publication Date Title
JP2014530280A5 (cg-RX-API-DMAC7.html)
JP2014534295A5 (cg-RX-API-DMAC7.html)
MY170487A (en) Heat conductive silicone composition, heat conductive layer, and semiconductor device
CN101544833B (zh) 固化性硅橡胶组合物以及半导体装置
TW201000559A (en) Thermally conductive silicone composition and electronic device
JP5827834B2 (ja) シリコーン樹脂組成物、シリコーン樹脂シート、シリコーン樹脂シートの製造方法および光半導体装置
WO2015126780A8 (en) Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition
WO2014038727A3 (en) Curable silicone composition and optical semiconductor device
JP6049873B2 (ja) シロキサン混合物
JP2016507528A5 (cg-RX-API-DMAC7.html)
JP5755802B2 (ja) 硬化性シリコーン組成物およびその硬化物
RU2014147036A (ru) Термически отверждаемая теплопроводная композиция силиконовой смазки
JP2014051606A5 (cg-RX-API-DMAC7.html)
CN103827277A (zh) 导热性硅脂组合物
BR112016025241B8 (pt) Composição reticulada, composição cosmética, e, método de formar uma composição reticulada
JP2010070599A5 (cg-RX-API-DMAC7.html)
JP2014088513A5 (cg-RX-API-DMAC7.html)
JP2014534292A5 (cg-RX-API-DMAC7.html)
JP2013067683A5 (cg-RX-API-DMAC7.html)
MY195006A (en) Curable Silicone Composition for Die Bonding use
CN105778516A (zh) 一种加成型可固化聚硅氧烷组合物
CN102585510B (zh) 固化性有机聚硅氧烷组合物、光学元件密封材料及光学元件
TWI534181B (zh) 可固化矽氧樹脂之發光二極體封裝
CN103507353A (zh) 导热性片材和电子设备
MY180275A (en) Curable silicone composition, method for producing semiconductor device, and semiconductor device