TWI575025B - 形成具有改良的熱穩定性之凝膠的方法 - Google Patents

形成具有改良的熱穩定性之凝膠的方法 Download PDF

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Publication number
TWI575025B
TWI575025B TW101137050A TW101137050A TWI575025B TW I575025 B TWI575025 B TW I575025B TW 101137050 A TW101137050 A TW 101137050A TW 101137050 A TW101137050 A TW 101137050A TW I575025 B TWI575025 B TW I575025B
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TW
Taiwan
Prior art keywords
iron
gel
weight
acetonitrile
reaction product
Prior art date
Application number
TW101137050A
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English (en)
Chinese (zh)
Other versions
TW201335285A (zh
Inventor
蘭道Ｇ 史密特
麥特Ｄ 多蘭
玄大涉
約翰Ｊ 基南
許生青
肯特Ｒ 拉森
Original Assignee
道康寧公司
韓國道康寧股份有限公司
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Publication date
Application filed by 道康寧公司, 韓國道康寧股份有限公司 filed Critical 道康寧公司
Publication of TW201335285A publication Critical patent/TW201335285A/zh
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Publication of TWI575025B publication Critical patent/TWI575025B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW101137050A 2011-10-06 2012-10-05 形成具有改良的熱穩定性之凝膠的方法 TWI575025B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161544001P 2011-10-06 2011-10-06

Publications (2)

Publication Number Publication Date
TW201335285A TW201335285A (zh) 2013-09-01
TWI575025B true TWI575025B (zh) 2017-03-21

Family

ID=47116380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101137050A TWI575025B (zh) 2011-10-06 2012-10-05 形成具有改良的熱穩定性之凝膠的方法

Country Status (7)

Country Link
US (1) US20140287247A1 (cg-RX-API-DMAC7.html)
EP (1) EP2764055B1 (cg-RX-API-DMAC7.html)
JP (1) JP6285359B2 (cg-RX-API-DMAC7.html)
KR (1) KR101901122B1 (cg-RX-API-DMAC7.html)
CN (1) CN103917603B (cg-RX-API-DMAC7.html)
TW (1) TWI575025B (cg-RX-API-DMAC7.html)
WO (1) WO2013052838A1 (cg-RX-API-DMAC7.html)

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US20180127552A1 (en) * 2011-10-06 2018-05-10 Dow Corning Corporation Method Of Forming A Gel Having Improved Thermal Stability
JP5962599B2 (ja) * 2013-06-26 2016-08-03 信越化学工業株式会社 耐熱性に優れたシリコーンゲル組成物
EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
CN105358616B (zh) * 2013-09-03 2017-04-19 道康宁公司 用于有机硅封装材料的添加剂
FR3028258B1 (fr) * 2014-11-07 2017-01-13 Bluestar Silicones France Nouveaux catalyseurs de reticulation de compositions silicones
EP3228084A4 (en) * 2014-12-01 2018-04-25 Inscape Data, Inc. System and method for continuous media segment identification
WO2017082338A1 (ja) * 2015-11-13 2017-05-18 戸田工業株式会社 鉄酸化物－炭素複合体粒子粉末及びその製造方法
EP4519083A1 (fr) * 2022-05-03 2025-03-12 Elkem Silicones France SAS Article apte au contact alimentaire et son procédé de fabrication

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231519A2 (en) * 1985-12-25 1987-08-12 Dow Corning Kabushiki Kaisha Heat-resistant polyorganosiloxane composition
TW200513499A (en) * 2003-08-14 2005-04-16 Dow Corning Silicones having improved surface properties and curable silicone compositions for preparing the silicones

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US4029629A (en) * 1975-10-06 1977-06-14 General Electric Company Solvent resistant room temperature vulcanizable silicone rubber composition
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US4528313A (en) * 1984-06-15 1985-07-09 Dow Corning Corporation Polydimethylsiloxanes having improved thermal stability
GB9219208D0 (en) * 1992-09-10 1992-10-28 Dow Corning Gmbh Elastomer-forming composition
JP3008766B2 (ja) * 1992-12-14 2000-02-14 信越化学工業株式会社 ヒドロシリル化反応方法
US5371163A (en) * 1993-11-02 1994-12-06 Dow Corning Corporation Organosiloxane compositions yielding tough elastomeric materials
JP3765444B2 (ja) 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
US6962685B2 (en) * 2002-04-17 2005-11-08 International Business Machines Corporation Synthesis of magnetite nanoparticles and the process of forming Fe-based nanomaterials
JP4605342B2 (ja) * 2004-05-11 2011-01-05 信越化学工業株式会社 耐熱用付加反応硬化型シリコーンゴム組成物及びシリコーン接着剤
JP2006283012A (ja) * 2005-03-08 2006-10-19 Adeka Corp ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP5168732B2 (ja) * 2007-09-21 2013-03-27 信越化学工業株式会社 変位耐久性を有する硬化物を与えるシリコーンゲル組成物
JP5288872B2 (ja) * 2008-04-28 2013-09-11 信越化学工業株式会社 加熱硬化型シリコーン組成物
CN103298887A (zh) * 2011-01-26 2013-09-11 道康宁公司 高温稳定的导热材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231519A2 (en) * 1985-12-25 1987-08-12 Dow Corning Kabushiki Kaisha Heat-resistant polyorganosiloxane composition
TW200513499A (en) * 2003-08-14 2005-04-16 Dow Corning Silicones having improved surface properties and curable silicone compositions for preparing the silicones

Also Published As

Publication number Publication date
CN103917603A (zh) 2014-07-09
US20140287247A1 (en) 2014-09-25
TW201335285A (zh) 2013-09-01
WO2013052838A1 (en) 2013-04-11
JP6285359B2 (ja) 2018-02-28
KR101901122B1 (ko) 2018-09-28
EP2764055B1 (en) 2018-03-21
JP2014530280A (ja) 2014-11-17
EP2764055A1 (en) 2014-08-13
KR20140093674A (ko) 2014-07-28
CN103917603B (zh) 2016-08-24

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