JP2014526148A5 - - Google Patents
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- JP2014526148A5 JP2014526148A5 JP2014522962A JP2014522962A JP2014526148A5 JP 2014526148 A5 JP2014526148 A5 JP 2014526148A5 JP 2014522962 A JP2014522962 A JP 2014522962A JP 2014522962 A JP2014522962 A JP 2014522962A JP 2014526148 A5 JP2014526148 A5 JP 2014526148A5
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- JP
- Japan
- Prior art keywords
- measurement
- composition
- measurement site
- region
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 46
- 238000005259 measurement Methods 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000004458 analytical method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000004949 mass spectrometry Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161511197P | 2011-07-25 | 2011-07-25 | |
| US61/511,197 | 2011-07-25 | ||
| PCT/US2012/048090 WO2013016399A2 (en) | 2011-07-25 | 2012-07-25 | Method and apparatus for characterizing objects and monitoring manufacturing processes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014526148A JP2014526148A (ja) | 2014-10-02 |
| JP2014526148A5 true JP2014526148A5 (enExample) | 2015-09-10 |
Family
ID=47597925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014522962A Pending JP2014526148A (ja) | 2011-07-25 | 2012-07-25 | 対象物を特徴付けて製造プロセスをモニタリングするための方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9157876B2 (enExample) |
| JP (1) | JP2014526148A (enExample) |
| KR (1) | KR20140045991A (enExample) |
| CN (1) | CN103733020A (enExample) |
| TW (1) | TWI571633B (enExample) |
| WO (1) | WO2013016399A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2532068B (en) | 2014-11-07 | 2017-05-31 | Thermo Fisher Scient (Ecublens) Sarl | Apparatus and method for controlling an atomic emission spectrometer |
| US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US10565701B2 (en) | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
| EP3257160A1 (en) | 2016-04-19 | 2017-12-20 | Huawei Technologies Co., Ltd. | Concurrent segmentation using vector processing |
| EP3251216A1 (en) | 2016-04-19 | 2017-12-06 | Huawei Technologies Co., Ltd. | Vector processing for segmentation hash values calculation |
| JP2019060831A (ja) * | 2017-09-28 | 2019-04-18 | 株式会社島津製作所 | レーザ誘起分析装置、および、レーザ誘起分析方法 |
| AU2018378588A1 (en) | 2017-12-05 | 2020-06-25 | Pds Biotechnology Corporation | Methods and compositions comprising cationic lipids for stimulating type 1 interferon genes |
| US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| JP2023515015A (ja) * | 2020-02-21 | 2023-04-12 | ナノトロニクス イメージング インコーポレイテッド | 製造プロセスのためのシステム、方法、及び媒体 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521525A (en) | 1994-04-15 | 1996-05-28 | University Of North Carolina | Method and apparatus for measuring the doping density profile of a semiconductor layer |
| US5719796A (en) | 1995-12-04 | 1998-02-17 | Advanced Micro Devices, Inc. | System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback |
| EP1909318A3 (en) | 1996-03-19 | 2009-12-09 | Hitachi, Ltd. | Process management system |
| JP3260663B2 (ja) * | 1997-07-23 | 2002-02-25 | 沖電気工業株式会社 | ホール内表面の組成分布検出方法 |
| US6055460A (en) * | 1997-08-06 | 2000-04-25 | Advanced Micro Devices, Inc. | Semiconductor process compensation utilizing non-uniform ion implantation methodology |
| US6274449B1 (en) | 1997-12-23 | 2001-08-14 | Texas Instruments Incorporated | Method of pocket implant modeling for a CMOS process |
| US6311096B1 (en) | 1999-04-01 | 2001-10-30 | Texas Instruments Incorporated | Design of microelectronic process flows for manufacturability and performance |
| US6878900B2 (en) | 2000-01-27 | 2005-04-12 | National Research Council Of Canada | Method and apparatus for repair of defects in materials with short laser pulses |
| US6622059B1 (en) | 2000-04-13 | 2003-09-16 | Advanced Micro Devices, Inc. | Automated process monitoring and analysis system for semiconductor processing |
| AU2001281243A1 (en) * | 2000-08-11 | 2002-02-25 | Sensys Instruments Corporation | Device and method for optical inspection of semiconductor wafer |
| US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| WO2002025708A2 (en) * | 2000-09-20 | 2002-03-28 | Kla-Tencor-Inc. | Methods and systems for semiconductor fabrication processes |
| US6694284B1 (en) * | 2000-09-20 | 2004-02-17 | Kla-Tencor Technologies Corp. | Methods and systems for determining at least four properties of a specimen |
| US6326220B1 (en) | 2000-11-11 | 2001-12-04 | Macronix International Co., Ltd. | Method for determining near-surface doping concentration |
| US6638778B1 (en) | 2002-02-25 | 2003-10-28 | Advanced Micro Devices, Inc. | Method for determining, tracking and/or controlling processing based upon silicon characteristics |
| US7074270B2 (en) | 2003-04-02 | 2006-07-11 | Seiko Epson Corporation | Method for predicting the behavior of dopant and defect components |
| US7248367B2 (en) * | 2003-06-10 | 2007-07-24 | Therma-Wave, Inc. | Characterization of ultra shallow junctions in semiconductor wafers |
| US7298496B2 (en) * | 2004-05-21 | 2007-11-20 | Zetetic Institute | Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry |
| US7462502B2 (en) | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
| US7379924B1 (en) | 2004-12-01 | 2008-05-27 | Advanced Micro Devices, Inc. | Quantifying and predicting the impact of line edge roughness on device reliability and performance |
| US7403023B2 (en) | 2005-03-14 | 2008-07-22 | Qc Solutions, Inc. | Apparatus and method of measuring defects in an ion implanted wafer by heating the wafer to a treatment temperature and time to substantially stabilize interstitial defect migration while leaving the vacancy defects substantially unaltered. |
| US7411188B2 (en) | 2005-07-11 | 2008-08-12 | Revera Incorporated | Method and system for non-destructive distribution profiling of an element in a film |
| JP2007036068A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | 不良原因特定システム、不良原因特定方法及び半導体装置の製造方法 |
| JP2007059721A (ja) * | 2005-08-25 | 2007-03-08 | Matsushita Electric Works Ltd | 半導体製造方法及び半導体製造システム |
| US7297972B2 (en) * | 2005-08-26 | 2007-11-20 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target |
| TW200830443A (en) | 2006-07-27 | 2008-07-16 | Qc Solutions Inc | Probes and methods for semiconductor wafer analysis |
| US7512499B1 (en) | 2006-12-20 | 2009-03-31 | National Semiconductor Corporation | System and method for determining substrate doping density in metal oxide semiconductor devices |
| US8396582B2 (en) | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
| US8877524B2 (en) | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
| DE102008021556B4 (de) | 2008-04-30 | 2019-06-06 | Advanced Micro Devices, Inc. | Verfahren und System für zweistufige Vorhersage einer Qualitätsverteilung von Halbleiterbauelementen |
| DE102008021557B4 (de) | 2008-04-30 | 2011-07-28 | Globalfoundries Inc. | Verfahren zum Überwachen einer vorhergesagten Produktqualitätsverteilung |
| EP2331946B1 (en) | 2008-08-29 | 2018-12-26 | Carl Zeiss Microscopy, LLC | Ion beam stabilization |
| US8204721B2 (en) | 2009-06-29 | 2012-06-19 | Sentinel Ic Technologies, Inc. | Apparatus and method for emulation of process variation induced in split process semiconductor wafers |
| US8486726B2 (en) | 2009-12-02 | 2013-07-16 | Veeco Instruments Inc. | Method for improving performance of a substrate carrier |
| KR20110106709A (ko) | 2010-03-23 | 2011-09-29 | 삼성전자주식회사 | 레이아웃 검사 방법 |
| JP2011215749A (ja) | 2010-03-31 | 2011-10-27 | Renesas Electronics Corp | 半導体装置設計支援方法、半導体装置設計支援プログラム、及び半導体装置設計支援装置 |
| US20110313748A1 (en) | 2010-06-16 | 2011-12-22 | Li Zhanming | Method of simulation and design of a semiconductor device |
-
2012
- 2012-07-25 KR KR1020147001944A patent/KR20140045991A/ko not_active Withdrawn
- 2012-07-25 TW TW101126759A patent/TWI571633B/zh not_active IP Right Cessation
- 2012-07-25 JP JP2014522962A patent/JP2014526148A/ja active Pending
- 2012-07-25 WO PCT/US2012/048090 patent/WO2013016399A2/en not_active Ceased
- 2012-07-25 US US13/557,545 patent/US9157876B2/en not_active Expired - Fee Related
- 2012-07-25 CN CN201280037171.0A patent/CN103733020A/zh active Pending
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