JP2014526148A5 - - Google Patents

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Publication number
JP2014526148A5
JP2014526148A5 JP2014522962A JP2014522962A JP2014526148A5 JP 2014526148 A5 JP2014526148 A5 JP 2014526148A5 JP 2014522962 A JP2014522962 A JP 2014522962A JP 2014522962 A JP2014522962 A JP 2014522962A JP 2014526148 A5 JP2014526148 A5 JP 2014526148A5
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JP
Japan
Prior art keywords
measurement
composition
measurement site
region
determining
Prior art date
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Pending
Application number
JP2014522962A
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English (en)
Japanese (ja)
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JP2014526148A (ja
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Priority claimed from PCT/US2012/048090 external-priority patent/WO2013016399A2/en
Publication of JP2014526148A publication Critical patent/JP2014526148A/ja
Publication of JP2014526148A5 publication Critical patent/JP2014526148A5/ja
Pending legal-status Critical Current

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JP2014522962A 2011-07-25 2012-07-25 対象物を特徴付けて製造プロセスをモニタリングするための方法及び装置 Pending JP2014526148A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161511197P 2011-07-25 2011-07-25
US61/511,197 2011-07-25
PCT/US2012/048090 WO2013016399A2 (en) 2011-07-25 2012-07-25 Method and apparatus for characterizing objects and monitoring manufacturing processes

Publications (2)

Publication Number Publication Date
JP2014526148A JP2014526148A (ja) 2014-10-02
JP2014526148A5 true JP2014526148A5 (enExample) 2015-09-10

Family

ID=47597925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014522962A Pending JP2014526148A (ja) 2011-07-25 2012-07-25 対象物を特徴付けて製造プロセスをモニタリングするための方法及び装置

Country Status (6)

Country Link
US (1) US9157876B2 (enExample)
JP (1) JP2014526148A (enExample)
KR (1) KR20140045991A (enExample)
CN (1) CN103733020A (enExample)
TW (1) TWI571633B (enExample)
WO (1) WO2013016399A2 (enExample)

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US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2023515015A (ja) * 2020-02-21 2023-04-12 ナノトロニクス イメージング インコーポレイテッド 製造プロセスのためのシステム、方法、及び媒体

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