AU2001281243A1 - Device and method for optical inspection of semiconductor wafer - Google Patents

Device and method for optical inspection of semiconductor wafer

Info

Publication number
AU2001281243A1
AU2001281243A1 AU2001281243A AU8124301A AU2001281243A1 AU 2001281243 A1 AU2001281243 A1 AU 2001281243A1 AU 2001281243 A AU2001281243 A AU 2001281243A AU 8124301 A AU8124301 A AU 8124301A AU 2001281243 A1 AU2001281243 A1 AU 2001281243A1
Authority
AU
Australia
Prior art keywords
semiconductor wafer
optical inspection
inspection
optical
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281243A
Inventor
James M. Cahill Jr.
Kenneth C. Johnson
Adam E. Norton
Douglas E. Ruth
Fred E. Stanke
Edric H. Tong
Michael Weber-Grabau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensys Instruments Corp
Original Assignee
Sensys Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensys Instruments Corp filed Critical Sensys Instruments Corp
Publication of AU2001281243A1 publication Critical patent/AU2001281243A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
AU2001281243A 2000-08-11 2001-08-10 Device and method for optical inspection of semiconductor wafer Abandoned AU2001281243A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22457100P 2000-08-11 2000-08-11
US60/224,571 2000-08-11
PCT/US2001/025196 WO2002015238A2 (en) 2000-08-11 2001-08-10 Device and method for optical inspection of semiconductor wafer

Publications (1)

Publication Number Publication Date
AU2001281243A1 true AU2001281243A1 (en) 2002-02-25

Family

ID=22841241

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281243A Abandoned AU2001281243A1 (en) 2000-08-11 2001-08-10 Device and method for optical inspection of semiconductor wafer

Country Status (5)

Country Link
US (1) US20020018217A1 (en)
EP (1) EP1309875A2 (en)
JP (1) JP2004536440A (en)
AU (1) AU2001281243A1 (en)
WO (1) WO2002015238A2 (en)

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Also Published As

Publication number Publication date
US20020018217A1 (en) 2002-02-14
EP1309875A2 (en) 2003-05-14
WO2002015238A3 (en) 2002-10-03
WO2002015238A2 (en) 2002-02-21
JP2004536440A (en) 2004-12-02

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