KR20140045991A - 객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치 - Google Patents

객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치 Download PDF

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Publication number
KR20140045991A
KR20140045991A KR1020147001944A KR20147001944A KR20140045991A KR 20140045991 A KR20140045991 A KR 20140045991A KR 1020147001944 A KR1020147001944 A KR 1020147001944A KR 20147001944 A KR20147001944 A KR 20147001944A KR 20140045991 A KR20140045991 A KR 20140045991A
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South Korea
Prior art keywords
composition
measurement
determining
measurement point
depth
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Korean (ko)
Inventor
조나단 디. 할더만
씨아란 존 패트릭 오'코너
제이 윌킨스
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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Publication of KR20140045991A publication Critical patent/KR20140045991A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
KR1020147001944A 2011-07-25 2012-07-25 객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치 Withdrawn KR20140045991A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161511197P 2011-07-25 2011-07-25
US61/511,197 2011-07-25
PCT/US2012/048090 WO2013016399A2 (en) 2011-07-25 2012-07-25 Method and apparatus for characterizing objects and monitoring manufacturing processes

Publications (1)

Publication Number Publication Date
KR20140045991A true KR20140045991A (ko) 2014-04-17

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Family Applications (1)

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KR1020147001944A Withdrawn KR20140045991A (ko) 2011-07-25 2012-07-25 객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치

Country Status (6)

Country Link
US (1) US9157876B2 (enExample)
JP (1) JP2014526148A (enExample)
KR (1) KR20140045991A (enExample)
CN (1) CN103733020A (enExample)
TW (1) TWI571633B (enExample)
WO (1) WO2013016399A2 (enExample)

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JP2023515015A (ja) * 2020-02-21 2023-04-12 ナノトロニクス イメージング インコーポレイテッド 製造プロセスのためのシステム、方法、及び媒体

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Also Published As

Publication number Publication date
WO2013016399A3 (en) 2013-04-25
TWI571633B (zh) 2017-02-21
US20130030717A1 (en) 2013-01-31
TW201305556A (zh) 2013-02-01
CN103733020A (zh) 2014-04-16
JP2014526148A (ja) 2014-10-02
US9157876B2 (en) 2015-10-13
WO2013016399A2 (en) 2013-01-31

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PA0105 International application

Patent event date: 20140123

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid