JP2014526080A - 穿孔された電気端子を有する携帯装置 - Google Patents
穿孔された電気端子を有する携帯装置 Download PDFInfo
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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Abstract
【選択図】 図8
Description
具体的には、裏面に電子マイクロ回路と接続するアンテナを備え、表面に少なくとも部分的には表面端部まで延在する接触ランドを備えた支持部材を有する、携帯電子装置に関する。
本発明は通常、標準フォーマット、即ち長さ85mm、幅54mm、厚さ0.76mmのカードに関する規格である、いわゆるISO7810規格に準拠するが、これに限定されるものではない。端子の特に配置と範囲については、7816規格で規定されている。
この突出部は、カードをリーダのスロットに挿入する際、ある種のリーダコネクタに対する障害となる、及び/又はリーダコネクタを摩耗させる恐れがある。
本発明はまた、特にISO/IEC14443規格に準拠した無線通信アンテナに関して、電磁波透過性能を維持したまま、製造コストを低減することができるモジュール製造を目的とする。
この目的のため、本発明は、ほぼ表面端部まで延在し電子マイクロ回路に接続する、貫通孔を有する導電接触ランド又はトラックを表面に備える支持部材を含み、この貫通孔内に金属が含まれないか、又は金属が含まれないよう維持されるように意図されることを特徴とする携帯電子装置、も対象とする。
−支持部材の裏面には、2つの接続端を有する複数回巻回して形成されたアンテナが設けられ、また、複数の貫通孔によりアンテナのための透磁性領域が形成され;
−貫通孔は装置の周辺部及び/又は中央部に配置され、この透磁性領域に少なくとも部分的にはほぼ対向するようにアンテナが配置され;
−貫通孔は、装置が電子接触リーダのスロットに挿入されたときに、リーダコネクタの接触端の経路(F)上に位置するよう配置され;
−接触ランドの幅は支持部材の端部に向かって減少する。
図2において、携帯電子装置20は、支持部材21と、少なくとも部分的に表面端部24まで延在する接触ランド23を有する支持部材の表面22とを含む。これらのランドは、電子マイクロ回路45に電気的に接続される。
チップカードの場合、貫通孔は、規定接触領域C1乃至C8(図5乃至8)とは別の領域25、26にも配置できる。
実施例において複数の貫通孔は円形であるが、その他の幾何学形状であってもよい。
穿孔は、フィルムの製造時に化学的エッチングによって、又は端子と同時に機械的カッティングによって、行われる。
しかしこの大きさは、所望のモデル、及び「リードフレーム」と呼ばれるモジュール基板(接触ランドを含む又は支持する基板)の、プロバイダによる技術的な進歩次第で変化しうる。
穿孔は、ISO7816規格による規定領域C1乃至C8の外部であればどこにでも施してよいし、又は部分的に(例、接触ランド上だがフレーム上ではない、又はその逆。図5乃至8参照)施してもよい。穿孔は、接触ランドの特定の領域上に限定される。
有利には、貫通孔はアンテナのための透磁性領域を形成する。
貫通孔は、装置の周辺及び/又は中央部分(図7)に配置されうる。アンテナの巻回部は、少なくとも部分的には透磁性領域とほぼ対向するように配置される。
貫通孔は装置の周辺部又は中央部に配置され;巻回部は透磁性領域にほぼ対向するように配置される。
平行六面体形の電気接触ランド(図5参照)は公知であるが、接触端子からコネクタへ良好な「導電」がなされるのであれば、接触ランドは他の形状であってもよい。
このように「V」字形にすると、互いに隣り合う接触ランド間に透磁性領域47を設けることができる。
こうしてコネクタが常に、導電物質からなるほぼ貫通孔のない部分49上をスライドするようにすることで、コネクタ及び/又は接触ランドの早期摩耗を回避している。
図6及び7では、上述の表面S1、S2、S3に、穿孔された金属を含む部分P1乃至P5が設けられている。これらの部分の利点は、コネクタに対する段差をなくすだけでなく、モジュールをカード本体の空洞部内に固定する際、モジュールにかかる接着圧を適切に拡散させること、及び/又はモジュールの剛性において有利に働く。
貫通孔により、電子的機能または機械的強度を損なうことなく、電子端子と比べて20乃至50%の金属を節約することができる。
モジュール裏面の導電トラック又は接触ランド(図3)も同様に穿孔されうる。
金属皮膜は、穿孔された金属でもよいし、又は形成時に穿孔して作ってもよい。
貫通孔は、例えばジグザグ形、直線、曲線、波形のスロット等、他の形でもよい。
好ましくは、巻回部は金属皮膜を施したのとは反対側の基板(又は支持部材)の面に配置される。
Claims (7)
- 支持部材(21)を含み、導電接触ランド又はトラック(23)が前記支持部材(21)の表面(22)に形成され、前記導電接触ランド又はトラック(23)は、前記支持部材(21)の端部(24)まで延在し、電子マイクロ回路(45)に接続する携帯電子装置(20)であって、
前記導電接触ランド又はトラック(23)は、複数の貫通孔(27)を有し、前記貫通孔(27)の孔内には金属は存在しないか又は存在しないように意図されていることを特徴とする携帯電子装置。 - 前記支持部材(21)の裏面(35)には、2個の接続端(31)を有する巻回アセンブリを形成するアンテナ(29)が形成され、前記複数の貫通孔(27)が前記アンテナ(29)のための透磁率を向上させる領域(25)を形成することを特徴とする請求項1に記載の携帯電子装置。
- 前記貫通孔(27)は、前記携帯電子装置の周辺部及び/又は中心部に位置し、前記アンテナ(29)は少なくともその一部が前記領域(25)にほぼ面して配置されることを特徴とする請求項2に記載の携帯電子装置。
- 前記貫通孔(27)は、前記携帯電子装置がリーダのスロットに挿入されたとき、電子接触リーダコネクタの接触領域の経路(F)上に配置されることを特徴とする請求項1乃至3のいずれかに記載の携帯電子装置。
- 前記接触領域の幅(46)が、前記支持部材(21)の前記端部(24)に向って減少することを特徴とする請求項1乃至4のいずれかに記載の携帯電子装置。
- 前記貫通孔(27)の直径が、250〜350μmであることを特徴とする請求項1乃至5のいずれかに記載の携帯電子装置。
- 前記携帯電子装置が、ISO7816標準規格又はUSBドライブに適合する前記接触ランド(23)を有するチップカードモジュールを含むか又は構成することを特徴とする請求項1乃至6のいずれかに記載の携帯電子装置。
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11305857A EP2541471A1 (fr) | 2011-07-01 | 2011-07-01 | Dispositif portatif à contacts électriques évidés |
EP11305857.2 | 2011-07-01 | ||
PCT/EP2012/062153 WO2013004522A2 (fr) | 2011-07-01 | 2012-06-22 | Dispositif portatif a contacts electriques evides |
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JP2014526080A true JP2014526080A (ja) | 2014-10-02 |
JP5719971B2 JP5719971B2 (ja) | 2015-05-20 |
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JP2014517617A Active JP5719971B2 (ja) | 2011-07-01 | 2012-06-22 | 穿孔された電気端子を有する携帯装置 |
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US (1) | US9318790B2 (ja) |
EP (2) | EP2541471A1 (ja) |
JP (1) | JP5719971B2 (ja) |
KR (1) | KR101569301B1 (ja) |
ES (1) | ES2938055T3 (ja) |
WO (1) | WO2013004522A2 (ja) |
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JP2018190139A (ja) * | 2017-05-01 | 2018-11-29 | 凸版印刷株式会社 | 基板モジュール |
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US9475086B2 (en) | 2013-01-18 | 2016-10-25 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
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- 2012-06-22 JP JP2014517617A patent/JP5719971B2/ja active Active
- 2012-06-22 WO PCT/EP2012/062153 patent/WO2013004522A2/fr active Application Filing
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US20140152511A1 (en) | 2014-06-05 |
EP2727052B1 (fr) | 2022-12-28 |
WO2013004522A3 (fr) | 2013-06-06 |
JP5719971B2 (ja) | 2015-05-20 |
KR101569301B1 (ko) | 2015-11-13 |
KR20140043461A (ko) | 2014-04-09 |
US9318790B2 (en) | 2016-04-19 |
EP2727052A2 (fr) | 2014-05-07 |
ES2938055T3 (es) | 2023-04-04 |
WO2013004522A2 (fr) | 2013-01-10 |
EP2541471A1 (fr) | 2013-01-02 |
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