JP2014524661A - AlNバッファN極GaNHEMTプロファイル - Google Patents
AlNバッファN極GaNHEMTプロファイル Download PDFInfo
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- JP2014524661A JP2014524661A JP2014523972A JP2014523972A JP2014524661A JP 2014524661 A JP2014524661 A JP 2014524661A JP 2014523972 A JP2014523972 A JP 2014523972A JP 2014523972 A JP2014523972 A JP 2014523972A JP 2014524661 A JP2014524661 A JP 2014524661A
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- 230000004888 barrier function Effects 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 230000005533 two-dimensional electron gas Effects 0.000 claims abstract description 5
- 229910002704 AlGaN Inorganic materials 0.000 claims description 30
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 15
- 229910052733 gallium Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 230000007704 transition Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 230000006911 nucleation Effects 0.000 description 10
- 238000010899 nucleation Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005336 cracking Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000010287 polarization Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000002269 spontaneous effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 241000408659 Darpa Species 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7781—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Abstract
Description
[0001] DARPAによって与えられる契約番号HR011-09-C-0132の条件によって提供されるように、アメリカ政府は特許所有者が相応な値段で他を認可することを必要とするために本発明の支払済みの許可および限られた状況の権利を有することができる。
Claims (20)
- 基板と、
前記基板上に配置されたアルミニウムを包含するバッファ層と、
前記バッファ層上に配置されたアルミニウムを包含するバリア層と、
前記バリア層の上に堆積されたGaNチャネル層と
を有し、
チャネル層、バリア層およびバッファ層が、チャネル層とバリア層との間に遷移して2次元電子ガス(2-DEG)層を形成することを特徴とするNフェイスGaN半導体デバイス。 - 前記バッファ層がAlNバッファ層であることを特徴とする請求項1に記載のデバイス。
- 前記バッファ層が、AlGaNバッファ層であることを特徴とする請求項1に記載のデバイス。
- 前記バリア層が、AlGaNバリア層であることを特徴とする請求項1に記載のデバイス。
- 前記AlGaNバリア層が、傾斜層であり、バリア層のガリウムとアルミニウムが、バッファ層とバリア層との間の遷移で高い濃度のアルミニウム及び低い濃度のガリウムから、バリア層とチャネル層との間の遷移で低い濃度のアルミニウムおよび高い濃度のガリウムまで選択的に傾斜することを特徴とする請求項4に記載のデバイス。
- 前記バリア層が、AlNバリア層であることを特徴とする請求項1に記載のデバイス。
- 前記半導体デバイスが、高電子移動度トランジスタ(HEMT)デバイスであることを特徴とする請求項1に記載のデバイス。
- 基板が、シリコンカーバイド(SiC)基板であることを特徴とする請求項1に記載のデバイス。
- シリコンカーバイド(SiC)基板と、
基板上に堆積されたアルミニウムを包含するバッファ層と、
前記バッファ層上に堆積されたアルミニウムを包含するバリア層と、
前記バリア層上に堆積されたGaNチャネル層と
を有し、
チャネル層、バリア層、および、バッファ層が、チャネル層とバリア層との間の遷移で2次元電子ガス(2-DEG)層を形成することを特徴とするNフェイスGaN高電子移動度トランジスタ(HEMT)デバイス。 - バッファ層がAlNバッファ層であることを特徴とする請求項9に記載のデバイス。
- 前記バッファ層が、AlGaNバッファ層であることを特徴とする請求項9に記載のデバイス。
- 前記バリア層が、AlGaNバリア層であることを特徴とする請求項9に記載のデバイス。
- 前記AlGaNバリア層が、傾斜層であり、バリア層のアルミニウムおよびガリウムが、バッファ層とバリア層との間の遷移で高い濃度のアルミニウム及び低い濃度のガリウムから、バリア層とチャネル層との間の遷移で低い濃度のアルミニウムおよび高い濃度のガリウムまで選択的に傾斜することを特徴とする請求項12に記載のデバイス。
- 前記バリア層がAlNバリア層であることを特徴とする請求項9に記載のデバイス。
- 基板を提供するステップと、
バッファ層がアルミニウムを包含するNフェイス方位デバイスを形成する基板の面にバッファ層をエピタキシャル成長させるステップと、
バッファ層にアルミニウムを包含するバリア層をエピタキシャル成長させるステップと、
チャネル層、バリア層、および、バッファ層が、チャネル層とバリア層との間の遷移で2次元電子ガス(2-DEG)層を形成するように、バリア層上にGaNチャネル層をエピタキシャル成長させるステップと、
を有することを特徴とするNフェイスGaN半導体デバイスを製造する方法。 - 前記バッファ層をエピタキシャル成長させるステップが、AlNバッファ層をエピタキシャル成長させるステップを包含することを特徴とする請求項15に記載の方法。
- 前記バッファ層をエピタキシャル成長させるステップが、AlGaNバッファ層をエピタキシャル成長させるステップを包含することを特徴とする請求項15に記載の方法。
- 前記バリア層をエピタキシャル成長させるステップが、AlGaNバリア層をエピタキシャル成長させるステップを包含することを特徴とする請求項15に記載の方法。
- 前記バリア層をエピタキシャル成長させるステップが、AlNバリア層をエピタキシャル成長させるステップを包含することを特徴とする請求項15に記載の方法。
- 前記半導体デバイスが、高電子移動度トランジスタ(HEMT)デバイスであることを特徴とする請求項15に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US13/194,213 US8710511B2 (en) | 2011-07-29 | 2011-07-29 | AIN buffer N-polar GaN HEMT profile |
US13/194,213 | 2011-07-29 | ||
PCT/US2012/048178 WO2013019516A1 (en) | 2011-07-29 | 2012-07-25 | AIN BUFFER N-POLAR GaN HEMT PROFILE |
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JP2014524661A true JP2014524661A (ja) | 2014-09-22 |
JP6224584B2 JP6224584B2 (ja) | 2017-11-01 |
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US (1) | US8710511B2 (ja) |
EP (1) | EP2737538A1 (ja) |
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WO (1) | WO2013019516A1 (ja) |
Cited By (8)
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EP2737538A1 (en) | 2014-06-04 |
US20130026489A1 (en) | 2013-01-31 |
US8710511B2 (en) | 2014-04-29 |
JP6224584B2 (ja) | 2017-11-01 |
WO2013019516A1 (en) | 2013-02-07 |
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