JP2014522737A5 - - Google Patents

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Publication number
JP2014522737A5
JP2014522737A5 JP2014520236A JP2014520236A JP2014522737A5 JP 2014522737 A5 JP2014522737 A5 JP 2014522737A5 JP 2014520236 A JP2014520236 A JP 2014520236A JP 2014520236 A JP2014520236 A JP 2014520236A JP 2014522737 A5 JP2014522737 A5 JP 2014522737A5
Authority
JP
Japan
Prior art keywords
wrapping
base
workpiece
outer polymer
polymer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014520236A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014522737A (ja
Filing date
Publication date
Priority claimed from US13/489,132 external-priority patent/US20130017765A1/en
Application filed filed Critical
Publication of JP2014522737A publication Critical patent/JP2014522737A/ja
Publication of JP2014522737A5 publication Critical patent/JP2014522737A5/ja
Pending legal-status Critical Current

Links

JP2014520236A 2011-07-11 2012-07-09 ラッピングキャリア及びその使用方法 Pending JP2014522737A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161506253P 2011-07-11 2011-07-11
US61/506,253 2011-07-11
US13/489,132 2012-06-05
US13/489,132 US20130017765A1 (en) 2011-07-11 2012-06-05 Lapping carrier and method of using the same
PCT/US2012/045926 WO2013009685A1 (en) 2011-07-11 2012-07-09 Lapping carrier and method of using the same

Publications (2)

Publication Number Publication Date
JP2014522737A JP2014522737A (ja) 2014-09-08
JP2014522737A5 true JP2014522737A5 (enExample) 2015-08-13

Family

ID=46548849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014520236A Pending JP2014522737A (ja) 2011-07-11 2012-07-09 ラッピングキャリア及びその使用方法

Country Status (6)

Country Link
US (1) US20130017765A1 (enExample)
JP (1) JP2014522737A (enExample)
KR (1) KR20140046458A (enExample)
CN (1) CN103648716A (enExample)
TW (1) TW201309418A (enExample)
WO (1) WO2013009685A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201608996TA (en) 2014-05-02 2016-11-29 3M Innovative Properties Co Interrupted structured abrasive article and methods of polishing a workpiece
JP5834331B1 (ja) * 2014-05-08 2015-12-16 冨士ベークライト株式会社 研磨キャリア及びその製造方法
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
KR20180112004A (ko) * 2016-02-16 2018-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 시스템 및 그의 제조 방법 및 사용 방법
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
CA3082362A1 (en) * 2017-11-08 2019-05-16 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
JP7205423B2 (ja) * 2018-12-17 2023-01-17 Ａｇｃ株式会社 ガラス基板の保持用膜体、及びガラス基板の研磨方法
CN113891922B (zh) * 2019-05-07 2023-10-20 3M创新有限公司 用于柔性版印刷板安装带的粘合剂底胶
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
US6030280A (en) * 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
JPH1158223A (ja) * 1997-08-12 1999-03-02 Nitto Shinko Kk 研磨治具及びその製造方法
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7186629B2 (en) * 2003-11-19 2007-03-06 Advanced Materials Sciences, Inc. Protecting thin semiconductor wafers during back-grinding in high-volume production
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
US8137157B2 (en) * 2006-11-21 2012-03-20 3M Innovative Properties Company Lapping carrier and method
DE102007056627B4 (de) * 2007-03-19 2023-12-21 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
WO2010009242A2 (en) * 2008-07-16 2010-01-21 Zimmer, Inc. Thermally treated ceramic coating for implants
KR20110111438A (ko) 2008-12-31 2011-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 래핑을 위한 코팅된 캐리어와 제조 및 사용 방법

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