JP2014522731A - 半導体素子用基板の処理方法 - Google Patents
半導体素子用基板の処理方法 Download PDFInfo
- Publication number
- JP2014522731A JP2014522731A JP2013532763A JP2013532763A JP2014522731A JP 2014522731 A JP2014522731 A JP 2014522731A JP 2013532763 A JP2013532763 A JP 2013532763A JP 2013532763 A JP2013532763 A JP 2013532763A JP 2014522731 A JP2014522731 A JP 2014522731A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing
- blasting
- compound semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 83
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 238000012545 processing Methods 0.000 title claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 41
- 238000005422 blasting Methods 0.000 claims abstract description 34
- 230000003746 surface roughness Effects 0.000 claims description 23
- 229910052594 sapphire Inorganic materials 0.000 claims description 20
- 239000010980 sapphire Substances 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000003672 processing method Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 7
- 239000006061 abrasive grain Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000003380 propellant Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 33
- 238000002347 injection Methods 0.000 description 22
- 239000007924 injection Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000005498 polishing Methods 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Led Devices (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
【選択図】図1
Description
ここでは噴射材は、JIS R6001の研磨微粉の粒度を有する材料である。
投射材は新東工業株式会社製アルミナ砥粒(ホワイトアランダム)WA♯240から♯600、粒径に換算すると、平均粒子径で25μmから70μmを用いた。また、噴射圧力は0.3MPaから0.5MPaを用いた。ここでは噴射材は、JIS R6001の研磨微粉の粒度を有する材料である。EPI工程後の4インチ(φ100mm)基板(ウエハ)Wの97mm×97mmの範囲での反り量は、83μmから210μmのバラツキがあったが、ブラスト処理後には40μm以下(35μmから20μm)に矯正された。なお、反り量から曲率半径を換算するといずれも30m以上であった。また、ウエハのインチサイズが今後大きくなった場合には、全体の反り量としては40μm以上となっても、φ100mmのウエハに換算した時に反り量が40μm以下であれば良い。このような反り量の範囲においては、後工程でのチップ切断時のレーザー加工での歩留まりが向上するという利点がある。
Claims (9)
- 第1の面及び前記第1の面とは反対の第2の面を有する基板に対してブラスト処理を施す半導体素子用基板の処理方法であって、
化合物半導体成膜が形成された、又は前記化合物半導体成膜が形成されるべき前記第1の面とは反対の前記第2の面にブラスト処理を施す工程を含む半導体素子用基板の処理方法。 - 基板を作成する工程と、
該基板の前記第1の面に化合物半導体成膜を成膜する工程と、
該ブラスト処理を施した前記第2の面とは反対の前記第1の面にLED電極又はLD電極を形成してLED素子又はLD素子に切断する工程と、
をさらに含む請求項1に記載の半導体素子用基板の処理方法。 - ブラスト処理を施す場合には、前記基板の前記第2の面の全範囲に亘ってブラスト処理が施される請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記ブラスト処理が施された面は、表面粗さが0.01〜5.0μmRaの面である請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記基板のブラスト後の反り量が、前記基板上の97mm×97mmの範囲での反り量で−40μm以上40μm以下である請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記第2の面は、前記第1の面に比べて表面粗さが大きい請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記ブラスト処理が、噴射材として、大きさが平均粒子径で25μmから70μmのアルミナ砥粒を用い、噴射圧力は0.2MPaから0.5MPa、噴射量は100g/minから400g/minである請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記基板がサファイア基板である請求項1又は2に記載の半導体素子用基板の処理方法。
- 前記化合物半導体成膜がGaN系化合物である請求項1又は2に記載の半導体素子用基板の処理方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013532763A JP5716834B2 (ja) | 2011-07-21 | 2012-01-23 | 半導体素子用基板の処理方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011160113 | 2011-07-21 | ||
JP2011160113 | 2011-07-21 | ||
PCT/JP2012/051899 WO2013011705A1 (en) | 2011-07-21 | 2012-01-23 | Processing method of substrate for semiconductor elements |
JP2013532763A JP5716834B2 (ja) | 2011-07-21 | 2012-01-23 | 半導体素子用基板の処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014522731A true JP2014522731A (ja) | 2014-09-08 |
JP5716834B2 JP5716834B2 (ja) | 2015-05-13 |
Family
ID=45852653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013532763A Active JP5716834B2 (ja) | 2011-07-21 | 2012-01-23 | 半導体素子用基板の処理方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5716834B2 (ja) |
KR (1) | KR101883520B1 (ja) |
CN (1) | CN103430281B (ja) |
TW (1) | TWI545623B (ja) |
WO (1) | WO2013011705A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016134433A (ja) * | 2015-01-16 | 2016-07-25 | 株式会社東芝 | ダイシング装置 |
US9947571B2 (en) | 2014-11-14 | 2018-04-17 | Kabushiki Kaisha Toshiba | Processing apparatus, nozzle, and dicing apparatus |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103909475A (zh) * | 2014-04-02 | 2014-07-09 | 天通控股股份有限公司 | 一种大尺寸蓝宝石衬底片背面粗糙度的干式加工方法 |
CN105810578B (zh) * | 2016-03-18 | 2019-01-18 | 成都海威华芯科技有限公司 | 化合物半导体基材的表面处理方法及外延结构 |
CN109015394A (zh) * | 2018-08-10 | 2018-12-18 | 天通控股股份有限公司 | 一种大尺寸钽酸锂衬底片背面粗糙度的干式加工方法 |
JP7259773B2 (ja) * | 2020-01-14 | 2023-04-18 | 新東工業株式会社 | ブラスト加工装置及びブラスト加工方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63124534A (ja) * | 1986-11-14 | 1988-05-28 | Mitsubishi Electric Corp | 半導体装置におけるゲツタリング方法 |
JPH0529323A (ja) * | 1991-07-19 | 1993-02-05 | Shin Etsu Handotai Co Ltd | 半導体基板及びその製造方法 |
JP2001284402A (ja) * | 2000-03-31 | 2001-10-12 | Sharp Corp | 半導体装置およびその製造方法 |
JP2003300800A (ja) * | 1998-09-30 | 2003-10-21 | Nec Corp | Iii族元素窒化物半導体ウェーハの製造方法 |
JP2004165226A (ja) * | 2002-11-08 | 2004-06-10 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子の製造方法 |
JP2011222608A (ja) * | 2010-04-06 | 2011-11-04 | Okamoto Machine Tool Works Ltd | 半導体基板の薄肉研削方法およびそれに用いる半導体基板の薄肉研削加工装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3738344A1 (de) * | 1986-11-14 | 1988-05-26 | Mitsubishi Electric Corp | Anlage zum einfuehren von gitterstoerstellen und verfahren dazu |
DE69227158T2 (de) * | 1991-07-19 | 1999-02-18 | Shinetsu Handotai Kk | Extrinsisches Gettering für ein halbleitendes Substrat |
JP2001344710A (ja) * | 2000-06-05 | 2001-12-14 | Tdk Corp | ウエハの平面度制御方法及び薄膜磁気ヘッドの製造方法 |
JP2003128499A (ja) | 2001-10-18 | 2003-05-08 | Hitachi Cable Ltd | 窒化物結晶基板の製造方法及び窒化物結晶基板 |
JP4232605B2 (ja) * | 2003-10-30 | 2009-03-04 | 住友電気工業株式会社 | 窒化物半導体基板の製造方法と窒化物半導体基板 |
KR100894064B1 (ko) * | 2007-09-03 | 2009-04-21 | 삼성에스디아이 주식회사 | 전자 방출 촉진 물질-함유 MgO 보호막, 이의 제조 방법및 상기 보호막을 구비한 플라즈마 디스플레이 패널 |
JP4965479B2 (ja) * | 2008-02-15 | 2012-07-04 | 株式会社アルバック | スパッタリングターゲットの製造方法及びスパッタリングターゲットの洗浄方法 |
JP2010205888A (ja) * | 2009-03-03 | 2010-09-16 | Toppan Printing Co Ltd | 半導体装置 |
-
2012
- 2012-01-23 WO PCT/JP2012/051899 patent/WO2013011705A1/en active Application Filing
- 2012-01-23 JP JP2013532763A patent/JP5716834B2/ja active Active
- 2012-01-23 CN CN201280013566.7A patent/CN103430281B/zh active Active
- 2012-01-23 KR KR1020137029494A patent/KR101883520B1/ko active IP Right Grant
- 2012-01-31 TW TW101103079A patent/TWI545623B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63124534A (ja) * | 1986-11-14 | 1988-05-28 | Mitsubishi Electric Corp | 半導体装置におけるゲツタリング方法 |
JPH0529323A (ja) * | 1991-07-19 | 1993-02-05 | Shin Etsu Handotai Co Ltd | 半導体基板及びその製造方法 |
JP2003300800A (ja) * | 1998-09-30 | 2003-10-21 | Nec Corp | Iii族元素窒化物半導体ウェーハの製造方法 |
JP2001284402A (ja) * | 2000-03-31 | 2001-10-12 | Sharp Corp | 半導体装置およびその製造方法 |
JP2004165226A (ja) * | 2002-11-08 | 2004-06-10 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子の製造方法 |
JP2011222608A (ja) * | 2010-04-06 | 2011-11-04 | Okamoto Machine Tool Works Ltd | 半導体基板の薄肉研削方法およびそれに用いる半導体基板の薄肉研削加工装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9947571B2 (en) | 2014-11-14 | 2018-04-17 | Kabushiki Kaisha Toshiba | Processing apparatus, nozzle, and dicing apparatus |
JP2016134433A (ja) * | 2015-01-16 | 2016-07-25 | 株式会社東芝 | ダイシング装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101883520B1 (ko) | 2018-07-30 |
WO2013011705A1 (en) | 2013-01-24 |
TW201306092A (zh) | 2013-02-01 |
JP5716834B2 (ja) | 2015-05-13 |
TWI545623B (zh) | 2016-08-11 |
KR20140050604A (ko) | 2014-04-29 |
CN103430281A (zh) | 2013-12-04 |
CN103430281B (zh) | 2017-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5716834B2 (ja) | 半導体素子用基板の処理方法 | |
US8062960B2 (en) | Compound semiconductor device and method of manufacturing compound semiconductor device | |
CN1241253C (zh) | 半导体元件的制造方法 | |
CN100517583C (zh) | 化合物半导体器件晶片的制造方法及其制造的晶片和器件 | |
JP5370262B2 (ja) | 半導体発光チップおよび基板の加工方法 | |
JP7320130B2 (ja) | 緩和された正の湾曲を有する炭化ケイ素ウェーハを処理するための方法 | |
JP5732684B2 (ja) | 単結晶基板、単結晶基板の製造方法、多層膜付き単結晶基板の製造方法および素子製造方法 | |
JP5674759B2 (ja) | 多層膜付き単結晶基板、多層膜付き単結晶基板の製造方法および素子製造方法 | |
EP2543752A1 (en) | Internal reforming substrate for epitaxial growth, internal reforming substrate with multilayer film, semiconductor device, bulk semiconductor substrate, and production methods therefor | |
US8691602B2 (en) | Method for producing semiconductor light-emitting chip | |
US9455229B2 (en) | Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element | |
JP2011129765A (ja) | 半導体発光素子の製造方法 | |
WO2005099057A1 (ja) | 窒化物半導体発光素子用ウエハとその製造方法およびそのウエハから得られた窒化物半導体発光素子 | |
US10763390B2 (en) | Optical device wafer processing method | |
JP2009135512A (ja) | 窒化物系半導体素子の製造方法 | |
JP2007284283A (ja) | GaN単結晶基板の加工方法及びGaN単結晶基板 | |
JP6714431B2 (ja) | 結晶基板の製造方法 | |
JP2015225902A (ja) | サファイア基板、サファイア基板の製造方法 | |
WO2017216997A1 (ja) | 窒化物半導体テンプレート、窒化物半導体テンプレートの製造方法および窒化物半導体自立基板の製造方法 | |
US20160265140A1 (en) | Single crystal substrate, manufacturing method for single crystal substrate, manufacturing method for single crystal substrate with multilayer film, and element manufacturing method | |
JP5332691B2 (ja) | 窒化物半導体基板の加工方法 | |
WO2015182280A1 (ja) | サファイア基板、サファイア基板の製造方法 | |
KR101232716B1 (ko) | 기판 제조방법 | |
JP2013244563A (ja) | サファイア基板及びその製造方法。 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AA64 | Notification of invalidation of claim of internal priority (with term) |
Free format text: JAPANESE INTERMEDIATE CODE: A241764 Effective date: 20140603 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141028 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141216 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150217 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150302 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5716834 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140407 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |