JP2014513312A5 - - Google Patents

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Publication number
JP2014513312A5
JP2014513312A5 JP2013553041A JP2013553041A JP2014513312A5 JP 2014513312 A5 JP2014513312 A5 JP 2014513312A5 JP 2013553041 A JP2013553041 A JP 2013553041A JP 2013553041 A JP2013553041 A JP 2013553041A JP 2014513312 A5 JP2014513312 A5 JP 2014513312A5
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JP
Japan
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alkyl
moiety
iodo
fluoro
fluoroalkyl
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JP2013553041A
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Japanese (ja)
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JP2014513312A (ja
JP6109750B2 (ja
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Priority claimed from US13/023,291 external-priority patent/US8465902B2/en
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JP2013553041A 2011-02-08 2012-02-07 下層コーティング組成物および微細電子デバイスを製造するための方法 Active JP6109750B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/023,291 2011-02-08
US13/023,291 US8465902B2 (en) 2011-02-08 2011-02-08 Underlayer coating composition and processes thereof
PCT/IB2012/000213 WO2012107823A1 (en) 2011-02-08 2012-02-07 Underlayer coating composition and process for manufacturing a microelectronic device

Publications (3)

Publication Number Publication Date
JP2014513312A JP2014513312A (ja) 2014-05-29
JP2014513312A5 true JP2014513312A5 (https=) 2016-11-04
JP6109750B2 JP6109750B2 (ja) 2017-04-05

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ID=45815912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013553041A Active JP6109750B2 (ja) 2011-02-08 2012-02-07 下層コーティング組成物および微細電子デバイスを製造するための方法

Country Status (8)

Country Link
US (1) US8465902B2 (https=)
EP (1) EP2673675B1 (https=)
JP (1) JP6109750B2 (https=)
KR (1) KR101824759B1 (https=)
CN (1) CN103370653B (https=)
SG (1) SG190992A1 (https=)
TW (1) TWI545161B (https=)
WO (1) WO2012107823A1 (https=)

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US8906592B2 (en) 2012-08-01 2014-12-09 Az Electronic Materials (Luxembourg) S.A.R.L. Antireflective coating composition and process thereof
US9152051B2 (en) 2013-06-13 2015-10-06 Az Electronics Materials (Luxembourg) S.A.R.L. Antireflective coating composition and process thereof
WO2015146523A1 (ja) * 2014-03-24 2015-10-01 Jsr株式会社 パターン形成方法、樹脂及びレジスト下層膜形成組成物
KR101982103B1 (ko) * 2015-08-31 2019-05-27 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 오버코팅된 포토레지스트와 함께 사용하기 위한 코팅 조성물
TWI646397B (zh) * 2015-10-31 2019-01-01 南韓商羅門哈斯電子材料韓國公司 與外塗佈光致抗蝕劑一起使用的塗料組合物
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US10203602B2 (en) * 2016-09-30 2019-02-12 Rohm And Haas Electronic Materials Korea Ltd. Coating compositions for use with an overcoated photoresist
EP3605228B1 (en) * 2017-03-30 2022-02-09 JSR Corporation Radiation sensitive composition and resist pattern forming method
KR102769920B1 (ko) * 2018-05-25 2025-02-19 닛산 가가쿠 가부시키가이샤 환식 카르보닐 화합물을 이용한 레지스트 하층막 형성 조성물
KR102288386B1 (ko) * 2018-09-06 2021-08-10 삼성에스디아이 주식회사 레지스트 하층막용 조성물 및 이를 이용한 패턴 형성 방법
CN109638156B (zh) * 2018-12-10 2020-09-01 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制作方法
KR102260811B1 (ko) 2018-12-26 2021-06-03 삼성에스디아이 주식회사 하드마스크 조성물, 하드마스크 층 및 패턴 형성 방법
TWI843863B (zh) * 2019-06-17 2024-06-01 日商日產化學股份有限公司 含有具二氰基苯乙烯基之雜環化合物之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法、半導體裝置之製造方法
TWI837443B (zh) * 2019-12-31 2024-04-01 南韓商羅門哈斯電子材料韓國公司 塗料組成物、經塗覆的基底及形成電子裝置的方法
WO2024070786A1 (ja) * 2022-09-30 2024-04-04 Jsr株式会社 レジスト下層膜形成用組成物及び半導体基板の製造方法
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CN120883140A (zh) * 2023-03-27 2025-10-31 日产化学株式会社 抗蚀剂下层膜形成用组合物

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