JP2014502039A - 薄膜太陽電池用のケステライト層の製造方法 - Google Patents
薄膜太陽電池用のケステライト層の製造方法 Download PDFInfo
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- JP2014502039A JP2014502039A JP2013535365A JP2013535365A JP2014502039A JP 2014502039 A JP2014502039 A JP 2014502039A JP 2013535365 A JP2013535365 A JP 2013535365A JP 2013535365 A JP2013535365 A JP 2013535365A JP 2014502039 A JP2014502039 A JP 2014502039A
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- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 239000010409 thin film Substances 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000000137 annealing Methods 0.000 claims abstract description 36
- 238000000151 deposition Methods 0.000 claims abstract description 22
- 238000001704 evaporation Methods 0.000 claims abstract description 17
- 238000002207 thermal evaporation Methods 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 12
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 97
- 239000011669 selenium Substances 0.000 claims description 37
- 229910052717 sulfur Inorganic materials 0.000 claims description 34
- 229910052711 selenium Inorganic materials 0.000 claims description 30
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000011593 sulfur Substances 0.000 claims description 28
- 239000011135 tin Substances 0.000 claims description 28
- 239000011701 zinc Substances 0.000 claims description 28
- 229910052718 tin Inorganic materials 0.000 claims description 27
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 26
- 229910052725 zinc Inorganic materials 0.000 claims description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 24
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 14
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 8
- 239000011733 molybdenum Substances 0.000 claims description 8
- 230000002745 absorbent Effects 0.000 claims description 7
- 239000002250 absorbent Substances 0.000 claims description 7
- 238000005336 cracking Methods 0.000 claims description 7
- 239000006096 absorbing agent Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 abstract description 10
- 239000010408 film Substances 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000005137 deposition process Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 33
- 238000003860 storage Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 13
- 238000004590 computer program Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 10
- 230000009471 action Effects 0.000 description 9
- 238000001771 vacuum deposition Methods 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000008034 disappearance Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 240000002329 Inga feuillei Species 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02485—Other chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02557—Sulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/128—Active materials comprising only Group I-II-IV-VI kesterite materials, e.g. Cu2ZnSnSe4 or Cu2ZnSnS4
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Photovoltaic Devices (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/911,833 US8440497B2 (en) | 2010-10-26 | 2010-10-26 | Fabricating kesterite solar cells and parts thereof |
| US12/911,833 | 2010-10-26 | ||
| PCT/EP2011/068254 WO2012055737A2 (en) | 2010-10-26 | 2011-10-19 | Kesterite layer fabrication for thin film solar cells |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014502039A true JP2014502039A (ja) | 2014-01-23 |
| JP2014502039A5 JP2014502039A5 (enExample) | 2014-08-07 |
Family
ID=44897726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013535365A Pending JP2014502039A (ja) | 2010-10-26 | 2011-10-19 | 薄膜太陽電池用のケステライト層の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8440497B2 (enExample) |
| JP (1) | JP2014502039A (enExample) |
| CN (1) | CN103180969A (enExample) |
| DE (1) | DE112011102890T5 (enExample) |
| WO (1) | WO2012055737A2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120318361A1 (en) * | 2011-06-20 | 2012-12-20 | Alliance For Sustainable Energy, Llc | Manufacturing thin films with chalcogen species with independent control over doping and bandgaps |
| US20130217211A1 (en) * | 2012-02-21 | 2013-08-22 | Aqt Solar, Inc. | Controlled-Pressure Process for Production of CZTS Thin-Films |
| US8586457B1 (en) * | 2012-05-17 | 2013-11-19 | Intermolecular, Inc. | Method of fabricating high efficiency CIGS solar cells |
| US9153729B2 (en) * | 2012-11-26 | 2015-10-06 | International Business Machines Corporation | Atomic layer deposition for photovoltaic devices |
| US9349906B2 (en) | 2014-09-27 | 2016-05-24 | International Business Machines Corporation | Anneal techniques for chalcogenide semiconductors |
| US9917216B2 (en) * | 2014-11-04 | 2018-03-13 | International Business Machines Corporation | Flexible kesterite photovoltaic device on ceramic substrate |
| CN105679878A (zh) * | 2014-11-17 | 2016-06-15 | 中国电子科技集团公司第十八研究所 | 一种共蒸发制备铜锌锡硫硒薄膜太阳电池吸收层的方法 |
| US10032949B2 (en) * | 2015-11-09 | 2018-07-24 | International Business Machines Corporation | Photovoltaic device based on Ag2ZnSn(S,Se)4 absorber |
| CN105470113B (zh) * | 2015-11-20 | 2018-07-10 | 中国电子科技集团公司第十八研究所 | 一种CZTSSe薄膜太阳电池吸收层的制备方法 |
| KR20170097440A (ko) * | 2016-02-18 | 2017-08-28 | 전영권 | 태양전지 및 그 제조방법 |
| PL241416B1 (pl) * | 2019-02-11 | 2022-09-26 | Akademia Górniczo-Hutnicza im. Stanisława Staszica w Krakowie | Sposób wytwarzania proszkowego kesterytu typu Cu₂SnZnS₄, przeznaczonego do produkcji warstw czynnych w cienkowarstwowych ogniwach fotowoltaicznych |
| PL241410B1 (pl) * | 2019-02-11 | 2022-09-26 | Akademia Górniczo-Hutnicza im. Stanisława Staszica w Krakowie | Sposób wytwarzania proszkowego kesterytu typu Cu<sub>₂</sub>SnZnS<sub>₄</sub> |
| CN110867383B (zh) * | 2019-11-21 | 2023-05-30 | 中国电子科技集团公司第十八研究所 | 一种三步硫化工艺制备铜锌锡硫薄膜吸收层的方法 |
| CN114864752A (zh) * | 2022-06-15 | 2022-08-05 | 金陵科技学院 | 一种改善柔性CZTSSe薄膜太阳能电池吸收层残余应力的方法及应用 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078619A (ja) * | 2006-08-24 | 2008-04-03 | National Institute Of Advanced Industrial & Technology | 半導体薄膜の製造方法、半導体薄膜の製造装置、光電変換素子の製造方法及び光電変換素子 |
| JP2010245238A (ja) * | 2009-04-03 | 2010-10-28 | Promatic Kk | 光電変換装置およびその製造方法ならびに硫化物焼結体ターゲットの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4543162B2 (ja) * | 2001-09-05 | 2010-09-15 | 独立行政法人産業技術総合研究所 | ZnOSSe混晶半導体 |
| US7518207B1 (en) * | 2004-03-19 | 2009-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Molecular beam epitaxy growth of ternary and quaternary metal chalcogenide films |
| US20110017289A1 (en) * | 2009-07-24 | 2011-01-27 | Electronics And Telecommunications Research Institute | Cigs solar cell and method of fabricating the same |
| WO2011090728A2 (en) * | 2009-12-28 | 2011-07-28 | David Jackrel | Low cost solar cells formed using a chalcogenization rate modifier |
| CN101824638B (zh) * | 2010-05-06 | 2012-12-19 | 深圳丹邦投资集团有限公司 | 一种电化学沉积铜锌锡硒半导体薄膜材料的方法 |
-
2010
- 2010-10-26 US US12/911,833 patent/US8440497B2/en active Active
-
2011
- 2011-10-19 JP JP2013535365A patent/JP2014502039A/ja active Pending
- 2011-10-19 DE DE112011102890T patent/DE112011102890T5/de not_active Ceased
- 2011-10-19 CN CN2011800510920A patent/CN103180969A/zh active Pending
- 2011-10-19 WO PCT/EP2011/068254 patent/WO2012055737A2/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078619A (ja) * | 2006-08-24 | 2008-04-03 | National Institute Of Advanced Industrial & Technology | 半導体薄膜の製造方法、半導体薄膜の製造装置、光電変換素子の製造方法及び光電変換素子 |
| JP2010245238A (ja) * | 2009-04-03 | 2010-10-28 | Promatic Kk | 光電変換装置およびその製造方法ならびに硫化物焼結体ターゲットの製造方法 |
Non-Patent Citations (2)
| Title |
|---|
| JPN5014000935; WANG K.: 'THERMALLY EVAPORATED CU2ZNSNS4 SOLAR CELLS' APPLIED PHYSICS LETTERS V97 N14, 20101005, P143508-1 - 143508-3, AMERICAN INSTITUTE OF PHYSICS * |
| JPN6014029997; 星野 雄斗 et al.: '多元同時真空蒸着法によるCu2ZnSnS4薄膜の成長と評価(III)' 第57回応用物理学関係連合講演会講演予稿集 , 20100303, 20p-TE-8 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103180969A (zh) | 2013-06-26 |
| DE112011102890T5 (de) | 2013-06-06 |
| US8440497B2 (en) | 2013-05-14 |
| US20120100664A1 (en) | 2012-04-26 |
| WO2012055737A3 (en) | 2012-12-27 |
| WO2012055737A2 (en) | 2012-05-03 |
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