|
US3157308A
(en)
|
1961-09-05 |
1964-11-17 |
Clark Mfg Co J L |
Canister type container and method of making the same
|
|
US3159408A
(en)
|
1961-10-05 |
1964-12-01 |
Grace W R & Co |
Chuck
|
|
US4524308A
(en)
|
1984-06-01 |
1985-06-18 |
Sony Corporation |
Circuits for accomplishing electron beam convergence in color cathode ray tubes
|
|
WO1994025880A1
(en)
|
1993-04-30 |
1994-11-10 |
Board Of Regents, The University Of Texas System |
Megavoltage scanning imager and method for its use
|
|
EP0766405A1
(en)
|
1995-09-29 |
1997-04-02 |
STMicroelectronics S.r.l. |
Successive approximation register without redundancy
|
|
JP3460909B2
(ja)
*
|
1996-06-26 |
2003-10-27 |
大日本スクリーン製造株式会社 |
基板処理システム
|
|
JP2000311850A
(ja)
*
|
1999-02-26 |
2000-11-07 |
Nikon Corp |
露光装置及びリソグラフィシステム、並びにデバイス製造方法及びデバイス
|
|
JP2000252188A
(ja)
*
|
1999-02-26 |
2000-09-14 |
Nikon Corp |
露光装置及びリソグラフィシステム、並びにデバイス
|
|
JP2000269299A
(ja)
|
1999-03-18 |
2000-09-29 |
Kokusai Electric Co Ltd |
半導体製造装置
|
|
JP2001160534A
(ja)
*
|
1999-09-22 |
2001-06-12 |
Nikon Corp |
安全システム及び露光装置
|
|
JP2001203167A
(ja)
*
|
2000-01-20 |
2001-07-27 |
Hitachi Kokusai Electric Inc |
半導体製造装置
|
|
US6261853B1
(en)
*
|
2000-02-07 |
2001-07-17 |
Therma-Wave, Inc. |
Method and apparatus for preparing semiconductor wafers for measurement
|
|
US6519045B2
(en)
*
|
2001-01-31 |
2003-02-11 |
Rudolph Technologies, Inc. |
Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
|
|
US6669783B2
(en)
*
|
2001-06-28 |
2003-12-30 |
Lam Research Corporation |
High temperature electrostatic chuck
|
|
JP2003142393A
(ja)
*
|
2001-11-07 |
2003-05-16 |
Tokyo Seimitsu Co Ltd |
電子ビーム露光装置
|
|
EP2302460A3
(en)
|
2002-10-25 |
2011-04-06 |
Mapper Lithography Ip B.V. |
Lithography system
|
|
KR101077098B1
(ko)
|
2002-10-30 |
2011-10-26 |
마퍼 리쏘그라피 아이피 비.브이. |
전자 빔 노출 시스템
|
|
CN1759465B
(zh)
|
2003-03-10 |
2010-06-16 |
迈普尔平版印刷Ip有限公司 |
用于产生多个小波束的装置
|
|
SG115632A1
(en)
*
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
|
|
JP2004311890A
(ja)
*
|
2003-04-10 |
2004-11-04 |
Sumitomo Heavy Ind Ltd |
移動体のガイド機構
|
|
JP3977767B2
(ja)
|
2003-04-10 |
2007-09-19 |
住友重機械工業株式会社 |
基板処理装置
|
|
EP1830384B1
(en)
|
2003-05-28 |
2011-09-14 |
Mapper Lithography Ip B.V. |
Charged particle beamlet exposure system
|
|
JP2005016255A
(ja)
*
|
2003-06-27 |
2005-01-20 |
Sumitomo Heavy Ind Ltd |
扉ロック装置、及び扉システム
|
|
DE602004010824T2
(de)
|
2003-07-30 |
2008-12-24 |
Mapper Lithography Ip B.V. |
Modulator-schaltkreise
|
|
US20070269297A1
(en)
*
|
2003-11-10 |
2007-11-22 |
Meulen Peter V D |
Semiconductor wafer handling and transport
|
|
US7564552B2
(en)
*
|
2004-05-14 |
2009-07-21 |
Kla-Tencor Technologies Corp. |
Systems and methods for measurement of a specimen with vacuum ultraviolet light
|
|
US9111972B2
(en)
*
|
2004-07-13 |
2015-08-18 |
Hitachi Kokusai Electric Inc. |
Substrate processing apparatus and manufacturing method for a semiconductor device
|
|
JP4926433B2
(ja)
*
|
2004-12-06 |
2012-05-09 |
株式会社Ｓｏｋｕｄｏ |
基板処理装置および基板処理方法
|
|
RU2305918C2
(ru)
*
|
2005-04-19 |
2007-09-10 |
Закрытое акционерное общество "Элма-Фотма" |
Способ получения фотошаблонных заготовок
|
|
US7709815B2
(en)
|
2005-09-16 |
2010-05-04 |
Mapper Lithography Ip B.V. |
Lithography system and projection method
|
|
US20070235665A1
(en)
*
|
2006-03-30 |
2007-10-11 |
Applied Materials, Inc. |
Charged particle beam system and method for manufacturing and inspecting LCD devices
|
|
US20080225261A1
(en)
*
|
2007-03-13 |
2008-09-18 |
Noriyuki Hirayanagi |
Exposure apparatus and device manufacturing method
|
|
US8277165B2
(en)
*
|
2007-09-22 |
2012-10-02 |
Dynamic Micro System Semiconductor Equipment GmbH |
Transfer mechanism with multiple wafer handling capability
|
|
NL1036164A1
(nl)
*
|
2007-11-15 |
2009-05-18 |
Asml Netherlands Bv |
Substrate processing apparatus and device manufacturing method.
|
|
US8757026B2
(en)
*
|
2008-04-15 |
2014-06-24 |
Dynamic Micro Systems, Semiconductor Equipment Gmbh |
Clean transfer robot
|
|
JP2010157639A
(ja)
*
|
2008-12-27 |
2010-07-15 |
Canon Inc |
露光装置およびデバイス製造方法
|
|
JP2010165948A
(ja)
*
|
2009-01-16 |
2010-07-29 |
Nikon Corp |
チャンバ装置、基板処理装置、露光装置、デバイス製造方法、及びメンテナンス方法
|
|
KR101025288B1
(ko)
*
|
2009-02-12 |
2011-03-29 |
국민대학교산학협력단 |
전자빔 리소그래피 장치의 나노 스테이지
|
|
CN102414776A
(zh)
*
|
2009-02-22 |
2012-04-11 |
迈普尔平版印刷Ip有限公司 |
微影机及基板处理的配置
|
|
EP2399280B1
(en)
*
|
2009-02-22 |
2020-01-15 |
ASML Netherlands B.V. |
Preparation unit for lithography machine
|
|
GB2469112A
(en)
|
2009-04-03 |
2010-10-06 |
Mapper Lithography Ip Bv |
Wafer support using controlled capillary liquid layer to hold and release wafer
|
|
JP5738981B2
(ja)
*
|
2010-04-12 |
2015-06-24 |
エーエスエムエル ネザーランズ ビー．ブイ． |
基板ハンドリング装置、リソグラフィ装置、ツール、及びデバイス製造方法
|
|
KR101791252B1
(ko)
*
|
2011-04-22 |
2017-10-27 |
마퍼 리쏘그라피 아이피 비.브이. |
리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜
|
|
TWI486723B
(zh)
*
|
2011-04-28 |
2015-06-01 |
Mapper Lithography Ip Bv |
在微影系統中處理基板的方法
|
|
EP3279624B1
(en)
|
2015-04-03 |
2019-08-28 |
Hitachi High-Technologies Corporation |
Light quantity detection device, and immunoanalysis device and charged particle beam device using same
|