RU2579533C2 - Литографическая система и способ обработки подложек в такой литографической системе - Google Patents

Литографическая система и способ обработки подложек в такой литографической системе Download PDF

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Publication number
RU2579533C2
RU2579533C2 RU2013132215/28A RU2013132215A RU2579533C2 RU 2579533 C2 RU2579533 C2 RU 2579533C2 RU 2013132215/28 A RU2013132215/28 A RU 2013132215/28A RU 2013132215 A RU2013132215 A RU 2013132215A RU 2579533 C2 RU2579533 C2 RU 2579533C2
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RU
Russia
Prior art keywords
substrate
lithographic
lithographic system
substrates
vacuum chamber
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RU2013132215/28A
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English (en)
Russian (ru)
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RU2013132215A (ru
Inventor
БУР Гвидо ДЕ
ЙОНГ Хендрик Ян ДЕ
Винцент Сильвстер КЭЙПЕР
Эрвин СЛОТ
Original Assignee
МЭППЕР ЛИТОГРАФИ АйПи Б. В.
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Publication of RU2013132215A publication Critical patent/RU2013132215A/ru
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
RU2013132215/28A 2010-12-14 2011-12-13 Литографическая система и способ обработки подложек в такой литографической системе RU2579533C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42274510P 2010-12-14 2010-12-14
US61/422,745 2010-12-14
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2011/072654 WO2012080278A1 (en) 2010-12-14 2011-12-13 Lithography system and method of processing substrates in such a lithography system

Publications (2)

Publication Number Publication Date
RU2013132215A RU2013132215A (ru) 2015-01-20
RU2579533C2 true RU2579533C2 (ru) 2016-04-10

Family

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Family Applications (1)

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RU2013132215/28A RU2579533C2 (ru) 2010-12-14 2011-12-13 Литографическая система и способ обработки подложек в такой литографической системе

Country Status (8)

Country Link
US (1) US8895943B2 (cg-RX-API-DMAC7.html)
EP (1) EP2681624B1 (cg-RX-API-DMAC7.html)
JP (1) JP6158091B2 (cg-RX-API-DMAC7.html)
KR (1) KR101907433B1 (cg-RX-API-DMAC7.html)
CN (1) CN103370655B (cg-RX-API-DMAC7.html)
RU (1) RU2579533C2 (cg-RX-API-DMAC7.html)
TW (1) TWI548950B (cg-RX-API-DMAC7.html)
WO (1) WO2012080278A1 (cg-RX-API-DMAC7.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049627B2 (ja) * 2010-11-13 2016-12-21 マッパー・リソグラフィー・アイピー・ビー．ブイ． 中間チャンバを備えた荷電粒子リソグラフィシステム
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
JP6049367B2 (ja) * 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
US8907280B1 (en) 2012-09-19 2014-12-09 Sandia Corporation Fast electron microscopy via compressive sensing
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
CN107272352B (zh) * 2013-09-07 2021-02-02 Asml荷兰有限公司 目标处理单元
JP2017520015A (ja) 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
JP2016207755A (ja) * 2015-04-17 2016-12-08 株式会社ニコン 露光システム及び交換方法
NL2014864B1 (en) * 2015-05-27 2017-01-31 Suss Microtec Lithography Gmbh Device for treating a disc-shaped substrate and support adapter.
MY190638A (en) * 2015-10-01 2022-04-29 Intevac Inc Wafer plate and mask arrangement for substrate fabrication
EP3667696A1 (en) * 2018-12-14 2020-06-17 ASML Netherlands B.V. Stage apparatus suitable for electron beam inspection apparatus
EP4117017A1 (en) * 2021-07-05 2023-01-11 ASML Netherlands B.V. Charged particle detector
EP4202970A1 (en) * 2021-12-24 2023-06-28 ASML Netherlands B.V. Alignment determination method and computer program

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2295799C2 (ru) * 2001-06-28 2007-03-20 Лэм Рисерч Корпорейшн Электростатический держатель для использования в вакуумной камере высокотемпературной обработки, способ обработки подложки и расширительный узел электростатического держателя
RU2305918C2 (ru) * 2005-04-19 2007-09-10 Закрытое акционерное общество "Элма-Фотма" Способ получения фотошаблонных заготовок
JP2009124142A (ja) * 2007-11-15 2009-06-04 Asml Netherlands Bv 基板処理装置およびデバイス製造方法
WO2010094804A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Lithography machine and substrate handling arrangement

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
WO1994025880A1 (en) 1993-04-30 1994-11-10 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JP3460909B2 (ja) * 1996-06-26 2003-10-27 大日本スクリーン製造株式会社 基板処理システム
JP2000311850A (ja) * 1999-02-26 2000-11-07 Nikon Corp 露光装置及びリソグラフィシステム、並びにデバイス製造方法及びデバイス
JP2000252188A (ja) * 1999-02-26 2000-09-14 Nikon Corp 露光装置及びリソグラフィシステム、並びにデバイス
JP2000269299A (ja) 1999-03-18 2000-09-29 Kokusai Electric Co Ltd 半導体製造装置
JP2001160534A (ja) * 1999-09-22 2001-06-12 Nikon Corp 安全システム及び露光装置
JP2001203167A (ja) * 2000-01-20 2001-07-27 Hitachi Kokusai Electric Inc 半導体製造装置
US6261853B1 (en) * 2000-02-07 2001-07-17 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
JP2003142393A (ja) * 2001-11-07 2003-05-16 Tokyo Seimitsu Co Ltd 電子ビーム露光装置
EP2302460A3 (en) 2002-10-25 2011-04-06 Mapper Lithography Ip B.V. Lithography system
KR101077098B1 (ko) 2002-10-30 2011-10-26 마퍼 리쏘그라피 아이피 비.브이. 전자 빔 노출 시스템
CN1759465B (zh) 2003-03-10 2010-06-16 迈普尔平版印刷Ip有限公司 用于产生多个小波束的装置
SG115632A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
JP2004311890A (ja) * 2003-04-10 2004-11-04 Sumitomo Heavy Ind Ltd 移動体のガイド機構
JP3977767B2 (ja) 2003-04-10 2007-09-19 住友重機械工業株式会社 基板処理装置
EP1830384B1 (en) 2003-05-28 2011-09-14 Mapper Lithography Ip B.V. Charged particle beamlet exposure system
JP2005016255A (ja) * 2003-06-27 2005-01-20 Sumitomo Heavy Ind Ltd 扉ロック装置、及び扉システム
DE602004010824T2 (de) 2003-07-30 2008-12-24 Mapper Lithography Ip B.V. Modulator-schaltkreise
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7564552B2 (en) * 2004-05-14 2009-07-21 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
US9111972B2 (en) * 2004-07-13 2015-08-18 Hitachi Kokusai Electric Inc. Substrate processing apparatus and manufacturing method for a semiconductor device
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
US20070235665A1 (en) * 2006-03-30 2007-10-11 Applied Materials, Inc. Charged particle beam system and method for manufacturing and inspecting LCD devices
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
US8277165B2 (en) * 2007-09-22 2012-10-02 Dynamic Micro System Semiconductor Equipment GmbH Transfer mechanism with multiple wafer handling capability
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP2010157639A (ja) * 2008-12-27 2010-07-15 Canon Inc 露光装置およびデバイス製造方法
JP2010165948A (ja) * 2009-01-16 2010-07-29 Nikon Corp チャンバ装置、基板処理装置、露光装置、デバイス製造方法、及びメンテナンス方法
KR101025288B1 (ko) * 2009-02-12 2011-03-29 국민대학교산학협력단 전자빔 리소그래피 장치의 나노 스테이지
EP2399280B1 (en) * 2009-02-22 2020-01-15 ASML Netherlands B.V. Preparation unit for lithography machine
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
JP5738981B2 (ja) * 2010-04-12 2015-06-24 エーエスエムエル ネザーランズ ビー．ブイ． 基板ハンドリング装置、リソグラフィ装置、ツール、及びデバイス製造方法
KR101791252B1 (ko) * 2011-04-22 2017-10-27 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜
TWI486723B (zh) * 2011-04-28 2015-06-01 Mapper Lithography Ip Bv 在微影系統中處理基板的方法
EP3279624B1 (en) 2015-04-03 2019-08-28 Hitachi High-Technologies Corporation Light quantity detection device, and immunoanalysis device and charged particle beam device using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2295799C2 (ru) * 2001-06-28 2007-03-20 Лэм Рисерч Корпорейшн Электростатический держатель для использования в вакуумной камере высокотемпературной обработки, способ обработки подложки и расширительный узел электростатического держателя
RU2305918C2 (ru) * 2005-04-19 2007-09-10 Закрытое акционерное общество "Элма-Фотма" Способ получения фотошаблонных заготовок
JP2009124142A (ja) * 2007-11-15 2009-06-04 Asml Netherlands Bv 基板処理装置およびデバイス製造方法
WO2010094804A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Lithography machine and substrate handling arrangement

Also Published As

Publication number Publication date
JP6158091B2 (ja) 2017-07-05
TWI548950B (zh) 2016-09-11
EP2681624A1 (en) 2014-01-08
CN103370655A (zh) 2013-10-23
KR101907433B1 (ko) 2018-10-12
US8895943B2 (en) 2014-11-25
RU2013132215A (ru) 2015-01-20
EP2681624B1 (en) 2016-07-20
US20120175527A1 (en) 2012-07-12
TW201241575A (en) 2012-10-16
JP2014501442A (ja) 2014-01-20
KR20130131398A (ko) 2013-12-03
WO2012080278A1 (en) 2012-06-21
CN103370655B (zh) 2016-03-16

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