JP2014234502A - 電線被覆材用樹脂組成物および絶縁電線ならびにワイヤーハーネス - Google Patents
電線被覆材用樹脂組成物および絶縁電線ならびにワイヤーハーネス Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
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- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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- Insulated Conductors (AREA)
Abstract
Description
〔電線の作製〕
表1の実施例1〜8、表2の実施例9〜16、表3の実施例17〜24、表4の比較例1〜8に示された樹脂組成物の成分組成(質量部)に従って、絶縁被覆層の樹脂組成物を二軸混合機により、ダイ付近の樹脂温度が最適成形温度となるよう混練した。混練した樹脂組成物を断面積0.35mm2の撚線導体の周囲に被覆厚0.2mmの絶縁被覆層を押出成形して、実施例1〜24、比較例1〜8の絶縁電線を得た。押出成形では、直径が、それぞれ1.1mmのダイスと0.75mmのニップルを使用した。また押出成形は、ダイ付近の樹脂温度が最適成形温度となるような押出温度とし、線速度50m/min.で行った。得られた絶縁電線について、着色性、耐摩耗性の評価を行った。各試験結果を表1〜4に示す。なお、各成分の具体的な使用材料、最適成形温度の決定方法および試験方法は下記の通りである。
<(A)ポリサルホン系樹脂>
・ポリサルホン(PSU):Udel P−1700NT(ソルベイアドバンスドポリマーズ社製)
・ポリエーテルサルホン(PES):スミカエクセル4100G(住友化学社製)
・ポリフェニルサルホン(PPSU):ウルトラゾーンP3010(BASF社製)
<(B)芳香族ポリエステル樹脂>
・ポリブチレンテレフタレート(PBT):ジュラネックス800FP(ポリプラスチック社製)
・ポリブチレンナフタレート(PBN):TQB−OT(帝人化成社製)
・ポリエチレンナフタレート(PEN):テオネックスTN−8065S(帝人化成社製)
<(C)ポリエステルエラストマー>
・(C)ポリエステルエラストマー<1>:ハイトレル4047(東レ・デュポン社製、融点182℃)
・(C)ポリエステルエラストマー<2>:ハイトレル5557(東レ・デュポン社製、融点208℃)
・(C)ポリエステルエラストマー<3>:ハイトレル7277(東レ・デュポン社製、融点219℃)
・(C)ポリエステルエラストマー<4>:ペルプレンEN−2034(東洋紡社製、融点224℃)
<(D)脂肪酸アミド、脂肪酸エステル>
・脂肪酸アミド:ライトアマイドWH−255(共栄社化学社製)
・脂肪酸エステル:ユニスターH−476(日油社製)
<(E)顔料>
・カーボンブラック:三菱化学社製「♯45」
・酸化チタン(IV):堺化学社製「SA−1」
最適成形温度を決定するにあたり、各温度でのMI測定(JISK7210準拠)を実施し、MIが1.0g/10min.(荷重2.16kg)となる温度を最適成形温度とした。MIが1.0g/10min.を大きく超えると、ドローダウンなどを引き起こす可能性が高く、電線被覆材に向かない。MIが1.0g/10min.を大きく下回ると、流動性が低く、押出することができない。
絶縁電線の被覆材の表面を観察し、色ムラや変色が観察された場合を不良「×」、色ムラなく均一に着色されており、変色も見られない場合を良「○」、光沢が観察されるほど良好な外観である場合を優「◎」とした。
ISO6722に準拠し、ブレード往復法で行った。ブレードにかかる荷重を7Nとし、試験回数4回の最小値が300回以上を合格(○)、500回以上を合格(◎)、300回未満を不合格(×)とした。
2 金属導体
3 絶縁被覆層
Claims (8)
- (A)ポリサルホン系樹脂、(B)芳香族ポリエステル樹脂、(C)ポリエステルエラストマー、(D)脂肪酸アミドおよび脂肪酸エステルから選択される少なくとも1種、(E)顔料、を含むことを特徴とする電線被覆材用樹脂組成物。
- 前記(A)〜(C)成分を合わせた合計成分中に、前記(C)ポリエステルエラストマーが1〜50質量%含まれることを特徴とする請求項1に記載の電線被覆材用樹脂組成物。
- 前記(A)〜(B)成分を合わせた合計成分中に、前記(B)芳香族ポリエステル樹脂が1〜40質量%含まれることを特徴とする請求項1または2に記載の電線被覆材用樹脂組成物。
- 前記(A)〜(C)成分を合わせた合計成分100質量部に対し、前記(D)成分が0.01〜3質量部含まれることを特徴とする請求項1から3のいずれか1項に記載の電線被覆材用樹脂組成物。
- 前記(A)ポリサルホン系樹脂が、ポリエーテルサルホンおよびポリフェニルサルホンから選択される1種または2種以上であることを特徴とする請求項1から4のいずれか1項に記載の電線被覆材用樹脂組成物。
- 前記(B)芳香族ポリエステル樹脂が、繰り返し単位の構造内にナフチル基を有することを特徴とする請求項1から5のいずれか1項に記載の電線被覆材用樹脂組成物。
- 請求項6に記載の電線被覆材用樹脂組成物を用いて電線被覆を形成したことを特徴とする絶縁電線。
- 請求項7に記載の絶縁電線を有することを特徴とするワイヤーハーネス。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2013118984A JP5949670B2 (ja) | 2013-06-05 | 2013-06-05 | 電線被覆材用樹脂組成物および絶縁電線ならびにワイヤーハーネス |
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JPH02273411A (ja) * | 1989-04-13 | 1990-11-07 | Hitachi Cable Ltd | 自動車用薄肉低圧電線 |
JP2005531120A (ja) * | 2002-06-19 | 2005-10-13 | ソルヴェイ アドバンスド ポリマーズ リミテッド ライアビリティ カンパニー | 高温スルホンポリマーブレンドを含むマグネットワイヤの絶縁 |
WO2012090921A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社オートネットワーク技術研究所 | 自動車用絶縁電線及び自動車用ワイヤーハーネス |
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JP5692157B2 (ja) * | 2012-05-11 | 2015-04-01 | 株式会社オートネットワーク技術研究所 | 電線被覆材用樹脂組成物および絶縁電線 |
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JPH02273411A (ja) * | 1989-04-13 | 1990-11-07 | Hitachi Cable Ltd | 自動車用薄肉低圧電線 |
JP2005531120A (ja) * | 2002-06-19 | 2005-10-13 | ソルヴェイ アドバンスド ポリマーズ リミテッド ライアビリティ カンパニー | 高温スルホンポリマーブレンドを含むマグネットワイヤの絶縁 |
WO2012090921A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社オートネットワーク技術研究所 | 自動車用絶縁電線及び自動車用ワイヤーハーネス |
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