JP2014221941A5 - - Google Patents

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Publication number
JP2014221941A5
JP2014221941A5 JP2013102470A JP2013102470A JP2014221941A5 JP 2014221941 A5 JP2014221941 A5 JP 2014221941A5 JP 2013102470 A JP2013102470 A JP 2013102470A JP 2013102470 A JP2013102470 A JP 2013102470A JP 2014221941 A5 JP2014221941 A5 JP 2014221941A5
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JP
Japan
Prior art keywords
workpiece
plating film
main surface
producing
plating
Prior art date
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Granted
Application number
JP2013102470A
Other languages
English (en)
Japanese (ja)
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JP6093646B2 (ja
JP2014221941A (ja
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Publication date
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Priority claimed from JP2013102470A external-priority patent/JP6093646B2/ja
Priority to JP2013102470A priority Critical patent/JP6093646B2/ja
Priority to TW103116038A priority patent/TWI627315B/zh
Priority to CN201410199014.0A priority patent/CN104152959B/zh
Priority to MYPI2014001378A priority patent/MY194185A/en
Priority to KR1020140057115A priority patent/KR102102263B1/ko
Publication of JP2014221941A publication Critical patent/JP2014221941A/ja
Publication of JP2014221941A5 publication Critical patent/JP2014221941A5/ja
Publication of JP6093646B2 publication Critical patent/JP6093646B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013102470A 2013-05-14 2013-05-14 めっき膜の製造方法 Active JP6093646B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013102470A JP6093646B2 (ja) 2013-05-14 2013-05-14 めっき膜の製造方法
TW103116038A TWI627315B (zh) 2013-05-14 2014-05-06 電鍍膜的製造方法
CN201410199014.0A CN104152959B (zh) 2013-05-14 2014-05-09 镀膜制造方法
MYPI2014001378A MY194185A (en) 2013-05-14 2014-05-12 Method of manufacturing plating films
KR1020140057115A KR102102263B1 (ko) 2013-05-14 2014-05-13 도금막의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013102470A JP6093646B2 (ja) 2013-05-14 2013-05-14 めっき膜の製造方法

Publications (3)

Publication Number Publication Date
JP2014221941A JP2014221941A (ja) 2014-11-27
JP2014221941A5 true JP2014221941A5 (ru) 2016-02-04
JP6093646B2 JP6093646B2 (ja) 2017-03-08

Family

ID=51878578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013102470A Active JP6093646B2 (ja) 2013-05-14 2013-05-14 めっき膜の製造方法

Country Status (5)

Country Link
JP (1) JP6093646B2 (ru)
KR (1) KR102102263B1 (ru)
CN (1) CN104152959B (ru)
MY (1) MY194185A (ru)
TW (1) TWI627315B (ru)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6685112B2 (ja) * 2015-11-18 2020-04-22 株式会社三井ハイテック リードフレーム及びリードフレームパッケージ、並びにこれらの製造方法
JP6621681B2 (ja) * 2016-02-17 2019-12-18 株式会社三井ハイテック リードフレーム及びその製造方法、並びに半導体パッケージ
JP6905031B2 (ja) * 2016-02-17 2021-07-21 株式会社三井ハイテック リードフレーム及び半導体パッケージ
JP6782116B2 (ja) * 2016-08-02 2020-11-11 古河電気工業株式会社 銀被覆材料
CN109468670B (zh) * 2018-11-16 2021-03-26 中山品高电子材料有限公司 引线框架电镀铜层的方法
CN112331566A (zh) * 2020-11-02 2021-02-05 昆山一鼎工业科技有限公司 引线框架表面粗糙度的制造设备及制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179988B1 (en) * 1997-08-29 2001-01-30 Electrocopper Products Limited Process for making copper wire
JP3690603B2 (ja) * 2002-11-28 2005-08-31 株式会社中央製作所 連続式めっきの電流制御方法
CN2587889Y (zh) * 2002-12-11 2003-11-26 吕明 制造高孔隙率金属带材的电沉积设备
JP2005097721A (ja) * 2003-08-27 2005-04-14 Yamaha Corp 両面メッキ装置および両面メッキ方法
CN2712947Y (zh) * 2004-07-20 2005-07-27 戴其金 一种双阳极电镀槽
JP4981488B2 (ja) * 2007-03-09 2012-07-18 古河電気工業株式会社 粗化圧延銅板およびその製造方法
KR20100066988A (ko) * 2008-12-10 2010-06-18 삼성테크윈 주식회사 전자회로기판의 균일 도금 방법
KR100950442B1 (ko) 2009-05-13 2010-04-02 주식회사 모아기술 고주파펄스를 이용한 알루미늄소재의 항균성 표면처리방법
CN102337578B (zh) * 2010-07-19 2014-04-02 北大方正集团有限公司 一种双面电镀槽、板件及电镀方法

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