JP2014206936A - タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート - Google Patents

タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート Download PDF

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Publication number
JP2014206936A
JP2014206936A JP2013085304A JP2013085304A JP2014206936A JP 2014206936 A JP2014206936 A JP 2014206936A JP 2013085304 A JP2013085304 A JP 2013085304A JP 2013085304 A JP2013085304 A JP 2013085304A JP 2014206936 A JP2014206936 A JP 2014206936A
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JP
Japan
Prior art keywords
wiring
detection electrode
substrate
pad portion
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2013085304A
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English (en)
Japanese (ja)
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JP2014206936A5 (enExample
Inventor
晃 一木
Akira Ichiki
晃 一木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2013085304A priority Critical patent/JP2014206936A/ja
Priority to CN201480021441.8A priority patent/CN105190497A/zh
Priority to PCT/JP2014/060636 priority patent/WO2014171426A1/ja
Priority to TW103113764A priority patent/TW201447718A/zh
Publication of JP2014206936A publication Critical patent/JP2014206936A/ja
Priority to US14/883,339 priority patent/US9891777B2/en
Publication of JP2014206936A5 publication Critical patent/JP2014206936A5/ja
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
JP2013085304A 2013-04-15 2013-04-15 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート Abandoned JP2014206936A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013085304A JP2014206936A (ja) 2013-04-15 2013-04-15 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート
CN201480021441.8A CN105190497A (zh) 2013-04-15 2014-04-14 触控面板用导电片材的制造方法和触控面板用导电片材
PCT/JP2014/060636 WO2014171426A1 (ja) 2013-04-15 2014-04-14 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート
TW103113764A TW201447718A (zh) 2013-04-15 2014-04-15 觸控面板之導電片及其製造方法
US14/883,339 US9891777B2 (en) 2013-04-15 2015-10-14 Method for manufacturing touch-panel conductive sheet, and touch-panel conductive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013085304A JP2014206936A (ja) 2013-04-15 2013-04-15 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート

Publications (2)

Publication Number Publication Date
JP2014206936A true JP2014206936A (ja) 2014-10-30
JP2014206936A5 JP2014206936A5 (enExample) 2015-12-10

Family

ID=51731367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013085304A Abandoned JP2014206936A (ja) 2013-04-15 2013-04-15 タッチパネル用導電シートの製造方法、および、タッチパネル用導電シート

Country Status (5)

Country Link
US (1) US9891777B2 (enExample)
JP (1) JP2014206936A (enExample)
CN (1) CN105190497A (enExample)
TW (1) TW201447718A (enExample)
WO (1) WO2014171426A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016099767A (ja) * 2014-11-20 2016-05-30 日立化成株式会社 静電容量方式タッチパネル
KR20160090978A (ko) * 2015-01-22 2016-08-02 삼성디스플레이 주식회사 회로부를 포함하는 플렉서블 표시 장치
JP2019016391A (ja) * 2018-10-02 2019-01-31 日立化成株式会社 静電容量方式タッチパネル
JP2019133501A (ja) * 2018-02-01 2019-08-08 日本航空電子工業株式会社 タッチパネル
WO2019150562A1 (ja) * 2018-02-02 2019-08-08 コニカミノルタ株式会社 タッチパネルセンサーの製造方法及びタッチパネルセンサー基材セット
KR102334798B1 (ko) * 2020-12-01 2021-12-02 성균관대학교산학협력단 일체형 센서 모듈 및 이의 제조 방법
US11669013B2 (en) 2015-09-30 2023-06-06 Fujifilm Corporation Composition for electrode protective film of electrostatic capacitance-type input device, electrode protective film of electrostatic capacitance-type input device, transfer film, laminate, electrostatic capacitance-type input device, and image display device
WO2026147263A1 (ko) * 2025-01-06 2026-07-09 삼성디스플레이주식회사 전자 장치 및 전자 장치의 제조방법

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CN104503617B (zh) 2014-12-26 2017-10-13 合肥鑫晟光电科技有限公司 触摸屏的边框结构及其制造方法、触摸屏和显示装置
CN109075446B (zh) * 2016-01-29 2020-09-08 夏普株式会社 天线设备
DE102016207387B4 (de) 2016-04-29 2021-11-18 Adidas Ag Socke
CN106163103A (zh) * 2016-07-01 2016-11-23 业成光电（深圳）有限公司 线路填孔搭接结构及方法
JP2018018008A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
JP6768394B2 (ja) 2016-07-29 2020-10-14 株式会社ジャパンディスプレイ 電子機器
JP2018017987A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
JP2018017988A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
CN106468972B (zh) * 2016-08-31 2020-07-24 京东方科技集团股份有限公司 一种触控基板及其制造方法、触控装置
CN106973495B (zh) * 2017-05-04 2019-12-13 奇酷互联网络科技（深圳）有限公司 一种印刷电路板的内层电路调试方法
CN107656646A (zh) * 2017-09-27 2018-02-02 上海天马微电子有限公司 触摸传感器及触摸显示面板
US10802315B2 (en) * 2017-11-14 2020-10-13 Japan Display, Inc. Display device
CN109933227A (zh) * 2017-12-15 2019-06-25 南昌欧菲光科技有限公司 Fpc结构和终端
CN110221731B (zh) * 2018-03-02 2023-03-28 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
KR102054934B1 (ko) * 2018-05-29 2019-12-12 일진디스플레이(주) 투명 유연 전극을 구비하는 터치패널 및 그 제조방법
CN208673308U (zh) * 2018-08-29 2019-03-29 深圳市汇顶科技股份有限公司 电容式悬浮触控传感器、装置及电子设备
KR102453234B1 (ko) * 2018-09-18 2022-10-07 동우 화인켐 주식회사 터치 센서 및 이를 포함하는 화상 표시 장치
CN110333793B (zh) * 2019-05-09 2022-12-09 业成科技（成都）有限公司 可挠触控结构

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511086A (ja) * 1994-04-05 1997-11-04 ビンステッド、ロナルド、ピーター 多入力近接検出器およびタッチパッドシステム
JP2007018020A (ja) * 2003-07-22 2007-01-25 Gunze Ltd 透明タッチパネル及び電子機器
WO2008096484A1 (ja) * 2007-02-08 2008-08-14 Sharp Kabushiki Kaisha タッチパネル装置及びその製造方法
JP2009123106A (ja) * 2007-11-16 2009-06-04 Smk Corp タッチセンサ
JP2009294815A (ja) * 2008-06-04 2009-12-17 Mitsubishi Electric Corp タッチパネルおよびそれを備えた表示装置
JP2010108172A (ja) * 2008-10-29 2010-05-13 Kyocera Corp タッチパネルおよびタッチパネル型表示装置
JP2011154442A (ja) * 2010-01-26 2011-08-11 Sony Corp センサ素子及び表示装置
JP2011197754A (ja) * 2010-03-17 2011-10-06 Dainippon Printing Co Ltd タッチパネルセンサの製造方法
JP2011528147A (ja) * 2009-02-23 2011-11-10 イー アンド エイチ． シーオー．，エルティーディー． 静電容量方式のタッチスクリーンパネル
JP2012073992A (ja) * 2010-09-29 2012-04-12 Samsung Mobile Display Co Ltd タッチスクリーンパネル及びその製造方法
JP2012146134A (ja) * 2011-01-12 2012-08-02 Dainippon Printing Co Ltd タッチパネルセンサおよびタッチパネルセンサの製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09511086A (ja) * 1994-04-05 1997-11-04 ビンステッド、ロナルド、ピーター 多入力近接検出器およびタッチパッドシステム
JP2007018020A (ja) * 2003-07-22 2007-01-25 Gunze Ltd 透明タッチパネル及び電子機器
WO2008096484A1 (ja) * 2007-02-08 2008-08-14 Sharp Kabushiki Kaisha タッチパネル装置及びその製造方法
JP2009123106A (ja) * 2007-11-16 2009-06-04 Smk Corp タッチセンサ
JP2009294815A (ja) * 2008-06-04 2009-12-17 Mitsubishi Electric Corp タッチパネルおよびそれを備えた表示装置
JP2010108172A (ja) * 2008-10-29 2010-05-13 Kyocera Corp タッチパネルおよびタッチパネル型表示装置
JP2011528147A (ja) * 2009-02-23 2011-11-10 イー アンド エイチ． シーオー．，エルティーディー． 静電容量方式のタッチスクリーンパネル
JP2011154442A (ja) * 2010-01-26 2011-08-11 Sony Corp センサ素子及び表示装置
JP2011197754A (ja) * 2010-03-17 2011-10-06 Dainippon Printing Co Ltd タッチパネルセンサの製造方法
JP2012073992A (ja) * 2010-09-29 2012-04-12 Samsung Mobile Display Co Ltd タッチスクリーンパネル及びその製造方法
JP2012146134A (ja) * 2011-01-12 2012-08-02 Dainippon Printing Co Ltd タッチパネルセンサおよびタッチパネルセンサの製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016099767A (ja) * 2014-11-20 2016-05-30 日立化成株式会社 静電容量方式タッチパネル
KR20160090978A (ko) * 2015-01-22 2016-08-02 삼성디스플레이 주식회사 회로부를 포함하는 플렉서블 표시 장치
KR102376442B1 (ko) * 2015-01-22 2022-03-18 삼성디스플레이 주식회사 회로부를 포함하는 플렉서블 표시 장치
US11669013B2 (en) 2015-09-30 2023-06-06 Fujifilm Corporation Composition for electrode protective film of electrostatic capacitance-type input device, electrode protective film of electrostatic capacitance-type input device, transfer film, laminate, electrostatic capacitance-type input device, and image display device
JP2019133501A (ja) * 2018-02-01 2019-08-08 日本航空電子工業株式会社 タッチパネル
JP7093190B2 (ja) 2018-02-01 2022-06-29 日本航空電子工業株式会社 タッチパネル
WO2019150562A1 (ja) * 2018-02-02 2019-08-08 コニカミノルタ株式会社 タッチパネルセンサーの製造方法及びタッチパネルセンサー基材セット
JP2019016391A (ja) * 2018-10-02 2019-01-31 日立化成株式会社 静電容量方式タッチパネル
KR102334798B1 (ko) * 2020-12-01 2021-12-02 성균관대학교산학협력단 일체형 센서 모듈 및 이의 제조 방법
WO2026147263A1 (ko) * 2025-01-06 2026-07-09 삼성디스플레이주식회사 전자 장치 및 전자 장치의 제조방법

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Publication number Publication date
US9891777B2 (en) 2018-02-13
TW201447718A (zh) 2014-12-16
CN105190497A (zh) 2015-12-23
US20160034081A1 (en) 2016-02-04
WO2014171426A1 (ja) 2014-10-23

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