JP2014201778A5 - - Google Patents
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- Publication number
- JP2014201778A5 JP2014201778A5 JP2013077077A JP2013077077A JP2014201778A5 JP 2014201778 A5 JP2014201778 A5 JP 2014201778A5 JP 2013077077 A JP2013077077 A JP 2013077077A JP 2013077077 A JP2013077077 A JP 2013077077A JP 2014201778 A5 JP2014201778 A5 JP 2014201778A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- carrier
- copper foil
- less
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 31
- 239000011889 copper foil Substances 0.000 claims 18
- 229910052802 copper Inorganic materials 0.000 claims 13
- 239000010949 copper Substances 0.000 claims 13
- 238000000034 method Methods 0.000 claims 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 3
- 239000000654 additive Substances 0.000 claims 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 3
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 238000007788 roughening Methods 0.000 claims 3
- 229910000077 silane Inorganic materials 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000002265 prevention Effects 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077077A JP6360659B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、及びプリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077077A JP6360659B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、及びプリント配線板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014201778A JP2014201778A (ja) | 2014-10-27 |
| JP2014201778A5 true JP2014201778A5 (enrdf_load_stackoverflow) | 2016-05-26 |
| JP6360659B2 JP6360659B2 (ja) | 2018-07-18 |
Family
ID=52352505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013077077A Active JP6360659B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、及びプリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6360659B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6190500B2 (ja) * | 2015-08-06 | 2017-08-30 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| TWI781818B (zh) | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | 表面處理銅箔及銅箔基板 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2594840B2 (ja) * | 1990-05-31 | 1997-03-26 | 日鉱グールド・フォイル株式会社 | 電解銅箔の製造方法及び装置 |
| JP3466506B2 (ja) * | 1999-04-23 | 2003-11-10 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
| JP3429290B2 (ja) * | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | 微細配線用銅箔の製造方法 |
| JP2002280689A (ja) * | 2001-03-19 | 2002-09-27 | Asahi Kasei Corp | 支持体付き極薄銅箔とそれを用いた極薄銅箔基板 |
| WO2004005588A1 (ja) * | 2002-07-04 | 2004-01-15 | Mitsui Mining & Smelting Co.,Ltd. | キャリア箔付電解銅箔 |
| JP4429979B2 (ja) * | 2005-06-29 | 2010-03-10 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法 |
| JP2007146289A (ja) * | 2005-10-31 | 2007-06-14 | Mitsui Mining & Smelting Co Ltd | 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板 |
| JP5129642B2 (ja) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
| JP4642120B2 (ja) * | 2009-04-01 | 2011-03-02 | 三井金属鉱業株式会社 | 電解金属箔製造装置並びに電解金属箔製造装置に用いる薄板状不溶性金属電極の製造方法及びその電解金属箔製造装置を用いて得られた電解金属箔 |
| JP2010006071A (ja) * | 2009-08-21 | 2010-01-14 | Furukawa Electric Co Ltd:The | 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板 |
| JP5352542B2 (ja) * | 2010-07-15 | 2013-11-27 | エル エス エムトロン リミテッド | リチウム二次電池の集電体用銅箔 |
| JP2012172198A (ja) * | 2011-02-22 | 2012-09-10 | Jx Nippon Mining & Metals Corp | 電解銅箔及びその製造方法 |
| PH12013500788A1 (en) * | 2011-08-31 | 2013-06-03 | Jx Nippon Mining & Metals Corp | Carrier-attached copper foil |
-
2013
- 2013-04-02 JP JP2013077077A patent/JP6360659B2/ja active Active
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