JP2014201777A5 - - Google Patents
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- Publication number
- JP2014201777A5 JP2014201777A5 JP2013077075A JP2013077075A JP2014201777A5 JP 2014201777 A5 JP2014201777 A5 JP 2014201777A5 JP 2013077075 A JP2013077075 A JP 2013077075A JP 2013077075 A JP2013077075 A JP 2013077075A JP 2014201777 A5 JP2014201777 A5 JP 2014201777A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- carrier
- copper foil
- copper
- ultrathin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 37
- 239000011889 copper foil Substances 0.000 claims 19
- 229910052802 copper Inorganic materials 0.000 claims 18
- 239000010949 copper Substances 0.000 claims 18
- 238000000034 method Methods 0.000 claims 9
- 239000000654 additive Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910000077 silane Inorganic materials 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077075A JP6353193B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013077075A JP6353193B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014201777A JP2014201777A (ja) | 2014-10-27 |
| JP2014201777A5 true JP2014201777A5 (enrdf_load_stackoverflow) | 2016-05-26 |
| JP6353193B2 JP6353193B2 (ja) | 2018-07-04 |
Family
ID=52352504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013077075A Active JP6353193B2 (ja) | 2013-04-02 | 2013-04-02 | キャリア付き銅箔、当該キャリア付き銅箔を用いて銅張積層板を製造する方法、当該キャリア付き銅箔を用いてプリント配線板を製造する方法、及びプリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6353193B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6193534B2 (ja) * | 2015-07-03 | 2017-09-06 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
| EP4132235B1 (en) * | 2020-03-30 | 2025-02-19 | Mitsubishi Materials Corporation | Bonded body and insulating circuit board |
| JPWO2022255421A1 (enrdf_load_stackoverflow) * | 2021-06-03 | 2022-12-08 | ||
| TWI781818B (zh) | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | 表面處理銅箔及銅箔基板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01194391A (ja) * | 1988-01-28 | 1989-08-04 | Hitachi Chem Co Ltd | 配線板の製造方法 |
| JP2506574B2 (ja) * | 1990-12-19 | 1996-06-12 | 日鉱グールド・フォイル株式会社 | 電解銅箔の製造方法及び装置 |
| JP3466506B2 (ja) * | 1999-04-23 | 2003-11-10 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
| JP3429290B2 (ja) * | 2000-09-18 | 2003-07-22 | 日本電解株式会社 | 微細配線用銅箔の製造方法 |
| WO2004005588A1 (ja) * | 2002-07-04 | 2004-01-15 | Mitsui Mining & Smelting Co.,Ltd. | キャリア箔付電解銅箔 |
| JP4429979B2 (ja) * | 2005-06-29 | 2010-03-10 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法 |
| JP2007194265A (ja) * | 2006-01-17 | 2007-08-02 | Dainippon Printing Co Ltd | フレキシブルプリント配線板、およびその製造方法 |
| JP4921420B2 (ja) * | 2008-06-03 | 2012-04-25 | 新日鐵化学株式会社 | 金属張積層体およびその製造方法 |
| JP5499517B2 (ja) * | 2009-05-21 | 2014-05-21 | 三菱瓦斯化学株式会社 | 金属表面処理方法 |
| JP2010006071A (ja) * | 2009-08-21 | 2010-01-14 | Furukawa Electric Co Ltd:The | 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板 |
| KR20130098359A (ko) * | 2010-10-06 | 2013-09-04 | 후루카와 덴키 고교 가부시키가이샤 | 동박 및 그 제조 방법, 캐리어 부착 동박 및 그 제조 방법, 프린트 배선판, 다층 프린트 배선판 |
| JP2012107266A (ja) * | 2010-11-15 | 2012-06-07 | Jx Nippon Mining & Metals Corp | 電解銅箔の製造方法及び製造装置 |
| KR20120053921A (ko) * | 2010-11-18 | 2012-05-29 | 삼성전기주식회사 | 인쇄 회로 기판 및 그 제조 방법 |
| JP2013001993A (ja) * | 2011-06-21 | 2013-01-07 | Meltex Inc | キャリア箔付き極薄銅箔およびその製造方法 |
-
2013
- 2013-04-02 JP JP2013077075A patent/JP6353193B2/ja active Active
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