JP2014192184A - 半導体パッケージの製造方法、半導体チップ支持キャリア及びチップ搭載装置 - Google Patents
半導体パッケージの製造方法、半導体チップ支持キャリア及びチップ搭載装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 132
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 93
- 230000001070 adhesive effect Effects 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
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Abstract
【解決手段】粘着シート2上で複数の半導体チップ21を内蔵したモールド体31を形成後、粘着キャリアシート1Aを支持基板1Bに対して上方に引き出す。支持基板1Bの上面b1に接触する粘着キャリアシート1Aの下面は非粘着層なので、チップ21の機能面21bにストレスを与えずに粘着キャリアシート1Aと支持基板1Bを簡単に分離させることができる。その後、モールド体31を粘着シート2から剥離し、機能面21bに外部接続用の再配線層32とバンプ33を形成する。次いで、モールド体31に内蔵された各チップ21,21の間を切断し、個片の半導体パッケージ35を取得する。
【選択図】図9
Description
1A 粘着キャリアシート(第1の支持手段)
1B 支持基板(第2の支持手段)
2 粘着シート
3 枠部材
4 基材(非粘着層)
5 粘着層
8 位置決めピン(位置決め手段)
9 吸引路
10 基準マーク
11 チップ搭載装置
12 ステージ
14 第1の吸引路(吸引手段)
15 第1の吸引機構(吸引手段)
16 第2の吸引路(吸引手段)
17 第2の吸引機構(吸引手段)
19 カメラ
20 認識処理部
21 半導体チップ
22 搭載ヘッド
31 モールド体(樹脂部)
32 再配線層(外部接続用部材)
33 バンプ(外部接続用部材)
35 半導体パッケージ
Claims (7)
- 一方の面に粘着層を有し、他方の面は非粘着層から成る粘着シートを枠部材に装着して成る第1の支持手段を、前記一方の面を上向きにした状態で第2の支持手段を構成する支持基板で支持する第1の支持手段支持工程と、
前記粘着シートの一方の面に複数の半導体チップを搭載するチップ搭載工程と、
前記複数の半導体チップを樹脂封止することにより前記複数の半導体チップを内蔵した樹脂部を前記粘着シート上で形成する樹脂部形成工程と、
前記粘着シート上で前記樹脂部が形成された前記第1の支持手段を前記第2の支持手段から取り外す第1の支持手段取り外し工程と、
前記樹脂部を前記粘着シートから剥離するシート剥離工程と、
前記樹脂部に内蔵された前記複数の半導体チップに外部接続用の部材を形成する外部接続用部材形成工程と、
前記樹脂部に内蔵された各半導体チップ間を切断して個片の半導体パッケージを取得する半導体パッケージ取得工程とを含むことを特徴とする半導体パッケージの製造方法。 - 請求項1に記載の半導体パッケージの製造方法で使用する半導体チップ支持キャリアであって、
一方の面に粘着層を有し、他方の面は非粘着層から成る粘着シートを枠部材に装着して成る第1の支持手段と、
前記一方の面を上向きにした状態で前記第1の支持手段を支持する支持基板を備えた第2の支持手段を備えたことを特徴とする半導体チップ支持キャリア。 - 前記第1の支持手段と接触する前記支持基板の所定の位置には、上下方向に貫通した吸引路が形成されていることを特徴とする請求項2に記載の半導体チップ支持キャリア。
- 前記第1の支持手段を前記支持基板上の所定の位置に位置決めするための位置決め手段を前記支持基板に設けたことを特徴とする請求項2又は3に記載の半導体チップ支持キャリア。
- 請求項1記載の半導体パッケージの製造方法で使用するチップ搭載装置であって、
一方の面に粘着層を有し、他方の面は非粘着層から成る粘着シートを枠部材に装着して成る第1の支持手段と、前記一方の面を上向きにした状態で前記第1の支持手段を支持する支持基板を備えた第2の支持手段とで構成される半導体チップ支持キャリアを保持するステージと、
前記ステージに保持された前記第1の支持手段と前記第2の支持手段を下方から吸引する吸引手段と、
前記粘着シートの一方の面に半導体チップを搭載する搭載ヘッドとを備えることを特徴とするチップ搭載装置。 - 前記吸引手段による前記第1の支持手段の吸引は、前記第2の支持手段に形成された吸引路を介して行うことを特徴とする請求項5に記載のチップ搭載装置。
- 前記第2の支持手段に形成された基準マークを認識する基準マーク認識手段をさらに備え、前記基準マーク認識手段によって認識した前記基準マークを基準にして半導体チップを前記粘着シートの一方の面に搭載することを特徴とする請求項5又は6に記載のチップ搭載装置。
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JP2013063464A JP6043959B2 (ja) | 2013-03-26 | 2013-03-26 | 半導体パッケージの製造方法、半導体チップ支持キャリア及びチップ搭載装置 |
US14/437,404 US9530680B2 (en) | 2013-03-26 | 2014-03-14 | Method of fabricating semiconductor package, semiconductor chip supporting carrier and chip mounting device |
CN201480002863.0A CN104756240B (zh) | 2013-03-26 | 2014-03-14 | 半导体封装的制造方法、半导体芯片支撑载体及芯片安装装置 |
PCT/JP2014/001475 WO2014156035A1 (ja) | 2013-03-26 | 2014-03-14 | 半導体パッケージの製造方法、半導体チップ支持キャリア及びチップ搭載装置 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016207900A (ja) * | 2015-04-24 | 2016-12-08 | 大日本印刷株式会社 | 樹脂封止部品の製造方法 |
JP2016225340A (ja) * | 2015-05-27 | 2016-12-28 | 富士機械製造株式会社 | グリップリング、アダプタ及びダイ位置特定装置 |
JP2017139365A (ja) * | 2016-02-04 | 2017-08-10 | パナソニックIpマネジメント株式会社 | 半導体パッケージの製造方法 |
CN116313936A (zh) * | 2023-05-16 | 2023-06-23 | 青岛明毅通达科技有限公司 | 集成电路芯片封装设备 |
WO2023127518A1 (ja) * | 2021-12-27 | 2023-07-06 | 三井金属鉱業株式会社 | シート固定装置、シート剥離装置及びシートの剥離方法 |
WO2023243636A1 (ja) * | 2022-06-16 | 2023-12-21 | 日東電工株式会社 | 部材加工方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6547556B2 (ja) * | 2015-09-29 | 2019-07-24 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
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JP7088942B2 (ja) * | 2017-09-12 | 2022-06-21 | 日本碍子株式会社 | チップ部品の製造方法 |
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WO2014156035A1 (ja) | 2014-10-02 |
CN104756240A (zh) | 2015-07-01 |
CN104756240B (zh) | 2018-06-22 |
JP6043959B2 (ja) | 2016-12-14 |
US9530680B2 (en) | 2016-12-27 |
US20160005634A1 (en) | 2016-01-07 |
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