JP2014187153A5 - - Google Patents

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Publication number
JP2014187153A5
JP2014187153A5 JP2013060521A JP2013060521A JP2014187153A5 JP 2014187153 A5 JP2014187153 A5 JP 2014187153A5 JP 2013060521 A JP2013060521 A JP 2013060521A JP 2013060521 A JP2013060521 A JP 2013060521A JP 2014187153 A5 JP2014187153 A5 JP 2014187153A5
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JP
Japan
Prior art keywords
electrically connected
wiring board
printed wiring
multilayer printed
voltage
Prior art date
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Granted
Application number
JP2013060521A
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English (en)
Japanese (ja)
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JP6116955B2 (ja
JP2014187153A (ja
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Priority to JP2013060521A priority Critical patent/JP6116955B2/ja
Priority claimed from JP2013060521A external-priority patent/JP6116955B2/ja
Publication of JP2014187153A publication Critical patent/JP2014187153A/ja
Publication of JP2014187153A5 publication Critical patent/JP2014187153A5/ja
Application granted granted Critical
Publication of JP6116955B2 publication Critical patent/JP6116955B2/ja
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JP2013060521A 2013-03-22 2013-03-22 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置 Active JP6116955B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013060521A JP6116955B2 (ja) 2013-03-22 2013-03-22 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013060521A JP6116955B2 (ja) 2013-03-22 2013-03-22 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置

Publications (3)

Publication Number Publication Date
JP2014187153A JP2014187153A (ja) 2014-10-02
JP2014187153A5 true JP2014187153A5 (enrdf_load_stackoverflow) 2015-11-12
JP6116955B2 JP6116955B2 (ja) 2017-04-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013060521A Active JP6116955B2 (ja) 2013-03-22 2013-03-22 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置

Country Status (1)

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JP (1) JP6116955B2 (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9354270B2 (en) * 2014-06-13 2016-05-31 Oracle International Corporation Step drill test structure of layer depth sensing on printed circuit board
CN104551088A (zh) * 2014-12-23 2015-04-29 深圳市五株科技股份有限公司 印刷电路板背钻装置及背钻方法
CN104582288A (zh) * 2015-01-14 2015-04-29 景旺电子科技(龙川)有限公司 一种pcb背钻板背钻深度检测方法
JP6098848B2 (ja) 2015-09-08 2017-03-22 山栄化学株式会社 穴埋めプリント配線板の製造方法
CN105491800A (zh) * 2015-12-23 2016-04-13 江门崇达电路技术有限公司 一种具有背钻孔的pcb的制作方法
JP2017157606A (ja) 2016-02-29 2017-09-07 富士通株式会社 プリント基板、電子機器および電子機器の製造方法
JP6972560B2 (ja) * 2017-01-16 2021-11-24 日本電気株式会社 制御装置、加工システムおよび制御方法
WO2018146369A1 (en) * 2017-02-07 2018-08-16 Coriant Oy A circuit board system and method for manufacturing the same
CN108617097B (zh) * 2018-05-11 2020-09-18 华南理工大学 印制电路板的制作方法及印制电路板
CN109195313A (zh) * 2018-09-25 2019-01-11 深圳崇达多层线路板有限公司 一种新型背钻测试孔制作方法
CN111315110A (zh) * 2018-12-12 2020-06-19 深南电路股份有限公司 一种电路板及电子装置
WO2021077383A1 (en) * 2019-10-25 2021-04-29 Telefonaktiebolaget Lm Ericsson (Publ) Board drilling apparatus, drill bit, and method for board drilling apparatus to drill a board
CN111010825B (zh) * 2019-12-27 2021-01-01 生益电子股份有限公司 一种无残桩的pcb制作方法
CN113811067A (zh) * 2020-06-17 2021-12-17 竞华电子(深圳)有限公司 一种多层电路板
CN114143953B (zh) * 2020-09-03 2024-03-19 超聚变数字技术有限公司 一种电路板、电路板的背钻质量检测方法及电子设备
CN112140229B (zh) 2020-09-28 2021-06-18 广东鼎泰高科技术股份有限公司 一种背钻刀具及其制备方法
CN114423161B (zh) * 2021-12-27 2024-09-06 生益电子股份有限公司 一种pcb加工方法及pcb
CN114938570A (zh) * 2022-03-28 2022-08-23 诚亿电子（嘉兴）有限公司 一种高精度pcb板加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114966U (enrdf_load_stackoverflow) * 1989-03-02 1990-09-14
CN101547561A (zh) * 2003-09-19 2009-09-30 通道系统集团公司 闭合反钻系统
JP4046058B2 (ja) * 2003-10-10 2008-02-13 日本電気株式会社 多層プリント配線板、そのスタブ座ぐり装置、方法
JP2007201112A (ja) * 2006-01-26 2007-08-09 Hitachi Ltd 掘削深さ検出構造を備えた回路基板及びこれが搭載された伝送装置

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