MX2016006636A - Tarjeta de circuito impreso, circuito y metodo para producir un circuito. - Google Patents
Tarjeta de circuito impreso, circuito y metodo para producir un circuito.Info
- Publication number
- MX2016006636A MX2016006636A MX2016006636A MX2016006636A MX2016006636A MX 2016006636 A MX2016006636 A MX 2016006636A MX 2016006636 A MX2016006636 A MX 2016006636A MX 2016006636 A MX2016006636 A MX 2016006636A MX 2016006636 A MX2016006636 A MX 2016006636A
- Authority
- MX
- Mexico
- Prior art keywords
- circuit
- metal
- board
- supporting board
- insulator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Se divulga un circuito que comprende una primera tarjeta de circuito impreso (2a) y una segunda tarjeta de circuito impreso (2b). La primera tarjeta de circuito se proporciona con una tarjeta de soporte metálico (14) y una capa aislante (8) la cual aísla eléctricamente la tarjeta de soporte metálico en una superficie, la tarjeta de soporte estando sin capa aislante en al menos una región de conexión (10a-10d). La tarjeta de soporte es recubierta con metal (12) en la región de conexión, y un contacto (30a) de un semiconductor (30) es puesto en contacto eléctricamente en el recubrimiento metálico de la región de conexión. La segunda tarjeta de circuito se proporciona con una tarjeta de soporte metálico (2b), un aislante (16) que aísla eléctricamente la tarjeta de soporte metálico (24) en una superficie, y una capa conductora (18) que es aplicada al aislante. El aislante y la capa conductora tienen una región de ruptura (21) en al menos una zona de contacto, y por lo menos una almohadilla de contacto metálico (20) está arreglada en la zona de contacto de una manera tal que la almohadilla de contacto está dispuesta periféricamente a una distancia del aislante y de la capa conductora. Las tarjetas de circuito en el circuito están separadas una de la otra por un hueco de aire (28) y están interconectadas mecánicamente por al menos un dispositivo semiconductor de potencia (30).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014000126.1A DE102014000126A1 (de) | 2014-01-13 | 2014-01-13 | Leiterplatte, Schaltung und Verfahren zur Herstellung einer Schaltung |
PCT/EP2014/071994 WO2015104072A1 (de) | 2014-01-13 | 2014-10-14 | Leiterplatte, schaltung und verfahren zur herstellung einer schaltung |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2016006636A true MX2016006636A (es) | 2016-09-06 |
MX360521B MX360521B (es) | 2018-11-07 |
Family
ID=51691067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016006636A MX360521B (es) | 2014-01-13 | 2014-10-14 | Tarjeta de circuito impreso, circuito y método para producir un circuito. |
Country Status (9)
Country | Link |
---|---|
US (1) | US9648742B2 (es) |
EP (1) | EP3095307B1 (es) |
JP (1) | JP6078700B1 (es) |
KR (1) | KR101908098B1 (es) |
CN (1) | CN105917749B (es) |
DE (1) | DE102014000126A1 (es) |
ES (1) | ES2702883T3 (es) |
MX (1) | MX360521B (es) |
WO (1) | WO2015104072A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016103585B4 (de) * | 2016-02-29 | 2022-01-13 | Infineon Technologies Ag | Verfahren zum Herstellen eines Package mit lötbarem elektrischen Kontakt |
FR3052013B1 (fr) * | 2016-05-25 | 2019-06-28 | Aptiv Technologies Limited | Module de commutation de puissance |
WO2018087612A1 (en) * | 2016-11-14 | 2018-05-17 | King Abdullah University Of Science And Technology | Microfabrication techniques and devices for thermal management of electronic devices |
DE102018127075B4 (de) * | 2018-10-30 | 2021-12-30 | Auto-Kabel Management Gmbh | Hochstromschaltung |
DE102019102792B4 (de) * | 2019-02-05 | 2021-08-19 | Auto-Kabel Management Gmbh | Schmelzvorrichtung, Schaltungsanordnung und Kraftfahrzeug mit Schaltungsanordnung |
CN112911824A (zh) * | 2019-12-04 | 2021-06-04 | 菲尼萨公司 | 用于光纤印刷电路板组件的表面安装技术 |
WO2022217387A1 (en) * | 2021-04-11 | 2022-10-20 | Telefonaktiebolaget Lm Ericsson (Publ) | Circuit board assembly and radio unit comprising the same |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6268297U (es) * | 1985-10-17 | 1987-04-28 | ||
JPH0193196A (ja) * | 1987-10-02 | 1989-04-12 | Nec Corp | プリント回路基板 |
US5075759A (en) * | 1989-07-21 | 1991-12-24 | Motorola, Inc. | Surface mounting semiconductor device and method |
JPH05327163A (ja) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | 電子部品の実装構造 |
JP4165045B2 (ja) * | 2000-09-19 | 2008-10-15 | 松下電器産業株式会社 | 電子機器 |
US6744135B2 (en) | 2001-05-22 | 2004-06-01 | Hitachi, Ltd. | Electronic apparatus |
JP3849573B2 (ja) * | 2001-05-22 | 2006-11-22 | 株式会社日立製作所 | 電子装置 |
JP2003115681A (ja) * | 2001-10-04 | 2003-04-18 | Denso Corp | 電子部品の実装構造 |
DE102004043276A1 (de) * | 2003-09-12 | 2005-04-07 | Marquardt Gmbh | Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter |
DE202005019094U1 (de) * | 2004-12-22 | 2006-05-04 | Behr-Hella Thermocontrol Gmbh | Elektrische Schaltung |
CN100481403C (zh) * | 2005-03-17 | 2009-04-22 | 日立电线株式会社 | 电子装置用基板及其制造方法以及电子装置制造方法 |
JP5001542B2 (ja) * | 2005-03-17 | 2012-08-15 | 日立電線株式会社 | 電子装置用基板およびその製造方法、ならびに電子装置の製造方法 |
JP4477541B2 (ja) * | 2005-05-09 | 2010-06-09 | パナソニック株式会社 | 回路基板とその製造方法およびそれを用いた電子部品 |
DE102005048702B4 (de) * | 2005-10-11 | 2014-02-20 | Continental Automotive Gmbh | Elektrische Anordnung zweier elektrisch leitender Fügepartner und Verfahren zum Befestigen einer Platte auf einer Grundplatte |
US8436250B2 (en) * | 2006-11-30 | 2013-05-07 | Sanyo Electric Co., Ltd. | Metal core circuit element mounting board |
US8233287B2 (en) * | 2007-02-07 | 2012-07-31 | Nitto Denko Corporation | Ground vias for enhanced preamp heat release in hard disk drives |
ES2345118T3 (es) * | 2007-09-28 | 2010-09-15 | EBERSPACHER CONTROLS GMBH & CO. KG | Barra conductora con eliminacion de calor. |
DE102008001414A1 (de) | 2008-04-28 | 2009-10-29 | Robert Bosch Gmbh | Substrat-Schaltungsmodul mit Bauteilen in mehreren Kontaktierungsebenen |
DE102009029476B4 (de) * | 2009-09-15 | 2012-11-08 | Lisa Dräxlmaier GmbH | Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe |
JP2011181787A (ja) * | 2010-03-03 | 2011-09-15 | Hitachi Automotive Systems Ltd | パワー系半導体装置 |
CN101834544B (zh) * | 2010-04-27 | 2012-07-18 | 西安交通大学 | 一种用于高频开关电源同步整流电路结构 |
KR101049698B1 (ko) * | 2010-11-02 | 2011-07-15 | 한국세라믹기술원 | Led 어레이 모듈 및 이의 제조방법 |
-
2014
- 2014-01-13 DE DE102014000126.1A patent/DE102014000126A1/de active Pending
- 2014-10-14 US US15/105,723 patent/US9648742B2/en active Active
- 2014-10-14 KR KR1020167018929A patent/KR101908098B1/ko active IP Right Grant
- 2014-10-14 ES ES14783877T patent/ES2702883T3/es active Active
- 2014-10-14 WO PCT/EP2014/071994 patent/WO2015104072A1/de active Application Filing
- 2014-10-14 CN CN201480073066.1A patent/CN105917749B/zh active Active
- 2014-10-14 JP JP2016546529A patent/JP6078700B1/ja active Active
- 2014-10-14 MX MX2016006636A patent/MX360521B/es active IP Right Grant
- 2014-10-14 EP EP14783877.5A patent/EP3095307B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
US20160324002A1 (en) | 2016-11-03 |
JP2017505991A (ja) | 2017-02-23 |
KR20160099642A (ko) | 2016-08-22 |
US9648742B2 (en) | 2017-05-09 |
WO2015104072A9 (de) | 2015-10-08 |
ES2702883T3 (es) | 2019-03-06 |
EP3095307A1 (de) | 2016-11-23 |
CN105917749A (zh) | 2016-08-31 |
JP6078700B1 (ja) | 2017-02-08 |
MX360521B (es) | 2018-11-07 |
CN105917749B (zh) | 2019-05-07 |
WO2015104072A1 (de) | 2015-07-16 |
KR101908098B1 (ko) | 2018-10-16 |
EP3095307B1 (de) | 2018-11-28 |
DE102014000126A1 (de) | 2015-07-16 |
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Legal Events
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FG | Grant or registration |