JP2011181787A - パワー系半導体装置 - Google Patents
パワー系半導体装置 Download PDFInfo
- Publication number
- JP2011181787A JP2011181787A JP2010046065A JP2010046065A JP2011181787A JP 2011181787 A JP2011181787 A JP 2011181787A JP 2010046065 A JP2010046065 A JP 2010046065A JP 2010046065 A JP2010046065 A JP 2010046065A JP 2011181787 A JP2011181787 A JP 2011181787A
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- power semiconductor
- semiconductor device
- solder
- metal plate
- semiconductor element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】パワー系半導体装置は、金属板と、金属板の上に設置された絶縁層と、絶縁層の上に設置された導体回路パターンと、導体回路パターンのうち回路構成部品が装着される部分以外を覆うレジスト層と、導体回路パターンの上に設置されたダイパッドと、ダイパッドの上に、はんだもしくは導電性接着剤を介して接着されたパワー系半導体素子と、パワー系半導体素子を覆う樹脂と、パワー系半導体素子と外部を接続する端子と、を備え、更に、金属板に押し出し加工によって設けられた突起部を備える。
【選択図】 図1
Description
2 リードフレーム
3 樹脂
4 パワー系半導体素子
5 はんだ(もしくは導電性接着剤)
6 ダイパッド
7 はんだもしくは導電性接着剤
8 パッケージ型パワー系半導体
10 金属板
10a 突起部
11 絶縁層
12 レジスト層
13 導体回路パターン
14 金属基板
Claims (8)
- 金属板と、
前記金属板の上に設置された絶縁層と、
前記絶縁層の上に設置された導体回路パターンと、
前記導体回路パターンのうち回路構成部品が装着される部分以外を覆うレジスト層と、
前記導体回路パターンの上に設置されたダイパッドと、
前記ダイパッドの上に、はんだもしくは導電性接着剤を介して接着されたパワー系半導体素子と、
前記パワー系半導体素子を覆う樹脂と、
前記パワー系半導体素子と外部を接続する端子と、を備え、更に、
前記金属板に押し出し加工によって設けられた突起部を備える、パワー系半導体装置。 - 前記金属板は、熱伝導率が80W/m・K以上である、請求項1記載のパワー系半導体装置。
- 前記金属板は、鉄,銅,アルミニウム,金,銀,ニッケル,マグネシウムのうち、少なくとも1つから構成される、請求項2記載のパワー系半導体装置。
- 前記突起部は、前記パッケージ型パワー系半導体の前記金属基板とはんだによって接続される面において、前記パッケージ型パワー系半導体の、平面方向における重心から略等距離に、略均等に複数個形成される、請求項1記載のパワー系半導体装置。
- 前記突起部は、ワイヤ状に形成される、請求項1記載のパワー系半導体装置。
- 前記突起部は、前記導体回路パターンが形成されている以外の部位に形成される、請求項1記載のパワー系半導体装置。
- 前記突起部は、先端が曲面で形成される、請求項1記載のパワー系半導体装置。
- 前記突起部は、前記パッケージ型パワー系半導体の樹脂外形と接している、請求項1記載のパワー系半導体装置。
Priority Applications (1)
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JP2010046065A JP2011181787A (ja) | 2010-03-03 | 2010-03-03 | パワー系半導体装置 |
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JP2010046065A JP2011181787A (ja) | 2010-03-03 | 2010-03-03 | パワー系半導体装置 |
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JP2010046065A Pending JP2011181787A (ja) | 2010-03-03 | 2010-03-03 | パワー系半導体装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3198315U (ja) * | 2015-04-15 | 2015-06-25 | 株式会社アヅマ | バター塗布具 |
JP2017505991A (ja) * | 2014-01-13 | 2017-02-23 | アウト カーベル マネージメントゲゼルシャフト ミット ベシュレンクテル ハフツング | プリント回路基板、回路、及び回路を製造するための方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04152590A (ja) * | 1990-10-16 | 1992-05-26 | Tamura Seisakusho Co Ltd | 金属コア基板 |
JPH07226422A (ja) * | 1994-02-14 | 1995-08-22 | Sumitomo Electric Ind Ltd | 電子部品パッケージ |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPH11330309A (ja) * | 1998-05-11 | 1999-11-30 | Furukawa Electric Co Ltd:The | メタルコア基板 |
JP2001358267A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP2006165114A (ja) * | 2004-12-03 | 2006-06-22 | Nec Corp | 半導体素子の実装方法及び実装構造、装置 |
JP2006210956A (ja) * | 1997-02-27 | 2006-08-10 | Fujitsu Ltd | 半導体装置 |
JP2008171936A (ja) * | 2007-01-10 | 2008-07-24 | Toyota Motor Corp | 冷却構造 |
-
2010
- 2010-03-03 JP JP2010046065A patent/JP2011181787A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04152590A (ja) * | 1990-10-16 | 1992-05-26 | Tamura Seisakusho Co Ltd | 金属コア基板 |
JPH07226422A (ja) * | 1994-02-14 | 1995-08-22 | Sumitomo Electric Ind Ltd | 電子部品パッケージ |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JP2006210956A (ja) * | 1997-02-27 | 2006-08-10 | Fujitsu Ltd | 半導体装置 |
JPH11330309A (ja) * | 1998-05-11 | 1999-11-30 | Furukawa Electric Co Ltd:The | メタルコア基板 |
JP2001358267A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP2006165114A (ja) * | 2004-12-03 | 2006-06-22 | Nec Corp | 半導体素子の実装方法及び実装構造、装置 |
JP2008171936A (ja) * | 2007-01-10 | 2008-07-24 | Toyota Motor Corp | 冷却構造 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017505991A (ja) * | 2014-01-13 | 2017-02-23 | アウト カーベル マネージメントゲゼルシャフト ミット ベシュレンクテル ハフツング | プリント回路基板、回路、及び回路を製造するための方法 |
JP3198315U (ja) * | 2015-04-15 | 2015-06-25 | 株式会社アヅマ | バター塗布具 |
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