JP2014170926A - 振動体、その製造方法、及び振動型駆動装置 - Google Patents

振動体、その製造方法、及び振動型駆動装置 Download PDF

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Publication number
JP2014170926A
JP2014170926A JP2014014570A JP2014014570A JP2014170926A JP 2014170926 A JP2014170926 A JP 2014170926A JP 2014014570 A JP2014014570 A JP 2014014570A JP 2014014570 A JP2014014570 A JP 2014014570A JP 2014170926 A JP2014170926 A JP 2014170926A
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JP
Japan
Prior art keywords
layer
piezoelectric
substrate
vibrating body
ceramic layer
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Pending
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JP2014014570A
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English (en)
Japanese (ja)
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JP2014170926A5 (enExample
Inventor
Yutaka Maruyama
裕 丸山
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014014570A priority Critical patent/JP2014170926A/ja
Publication of JP2014170926A publication Critical patent/JP2014170926A/ja
Publication of JP2014170926A5 publication Critical patent/JP2014170926A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/22—Methods relating to manufacturing, e.g. assembling, calibration
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • H02N2/001—Driving devices, e.g. vibrators
    • H02N2/0015—Driving devices, e.g. vibrators using only bending modes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • H02N2/001—Driving devices, e.g. vibrators
    • H02N2/002—Driving devices, e.g. vibrators using only longitudinal or radial modes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/026—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors by pressing one or more vibrators against the driven body
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
    • H02N2/103—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors by pressing one or more vibrators against the rotor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP2014014570A 2013-02-08 2014-01-29 振動体、その製造方法、及び振動型駆動装置 Pending JP2014170926A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014014570A JP2014170926A (ja) 2013-02-08 2014-01-29 振動体、その製造方法、及び振動型駆動装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013023670 2013-02-08
JP2013023670 2013-02-08
JP2014014570A JP2014170926A (ja) 2013-02-08 2014-01-29 振動体、その製造方法、及び振動型駆動装置

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JP2014170926A true JP2014170926A (ja) 2014-09-18
JP2014170926A5 JP2014170926A5 (enExample) 2017-03-02

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US (1) US9837938B2 (enExample)
JP (1) JP2014170926A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023286758A1 (ja) * 2021-07-14 2023-01-19 京セラ株式会社 接合体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE061708T2 (hu) * 2020-11-07 2023-08-28 Contemporary Amperex Technology Co Ltd Energiafejlesztõ készülék, felfüggesztés, jármû, valamint eszköz és eljárás energiafejlesztõ készülék elõállítására
CN113242499A (zh) * 2021-06-18 2021-08-10 江苏波速传感器有限公司 一种超薄双晶多层压电陶瓷扬声器单元

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558720A (ja) * 1991-08-29 1993-03-09 Nec Corp 多層ガラスセラミツク基板
JP2001063048A (ja) * 1999-08-26 2001-03-13 Kyocera Corp 圧電／電歪膜型アクチュエータ及びこれを用いたインクジェットプリンタヘッド
JP2003008092A (ja) * 2001-06-20 2003-01-10 Mutsuo Munekata 積層型圧電素子とその製造方法ならびに積層型圧電素子用封止材料
JP2008254936A (ja) * 2007-03-30 2008-10-23 Tdk Corp 誘電体磁器組成物、複合電子部品および積層セラミックコンデンサ
JP2011045869A (ja) * 2009-07-28 2011-03-10 Canon Inc 振動体及び振動波アクチュエータ
JP2011217493A (ja) * 2010-03-31 2011-10-27 Canon Inc 振動体及び振動波アクチュエータ
JP2011254569A (ja) * 2010-05-31 2011-12-15 Canon Inc 振動体とその製造方法及び振動波アクチュエータ
JP2012191733A (ja) * 2011-03-10 2012-10-04 Canon Inc 圧電素子、圧電素子を有する圧電アクチュエータおよび振動波モータ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2842448B2 (ja) 1989-07-11 1999-01-06 日本碍子株式会社 圧電／電歪膜型アクチュエータ
JP2004200382A (ja) 2002-12-18 2004-07-15 Ngk Insulators Ltd 圧電／電歪膜型素子
JP2004304887A (ja) 2003-03-28 2004-10-28 Canon Inc 振動型駆動装置
CA2561615A1 (en) * 2005-10-04 2007-04-04 Tdk Corporation Piezoelectric ceramic composition and laminated piezoelectric element
JP2009124791A (ja) 2007-11-12 2009-06-04 Canon Inc 振動体及び振動波アクチュエータ
JP5597368B2 (ja) 2009-07-29 2014-10-01 京セラ株式会社 積層型電子部品およびその製法
JP2012015758A (ja) 2010-06-30 2012-01-19 Nec Casio Mobile Communications Ltd 発振装置、その製造方法、電子機器
JP5588771B2 (ja) 2010-07-16 2014-09-10 Ｆｄｋ株式会社 圧電材料、および圧電材料の製造方法
JP5665522B2 (ja) 2010-12-20 2015-02-04 キヤノン株式会社 振動体及び振動型駆動装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558720A (ja) * 1991-08-29 1993-03-09 Nec Corp 多層ガラスセラミツク基板
JP2001063048A (ja) * 1999-08-26 2001-03-13 Kyocera Corp 圧電／電歪膜型アクチュエータ及びこれを用いたインクジェットプリンタヘッド
JP2003008092A (ja) * 2001-06-20 2003-01-10 Mutsuo Munekata 積層型圧電素子とその製造方法ならびに積層型圧電素子用封止材料
JP2008254936A (ja) * 2007-03-30 2008-10-23 Tdk Corp 誘電体磁器組成物、複合電子部品および積層セラミックコンデンサ
JP2011045869A (ja) * 2009-07-28 2011-03-10 Canon Inc 振動体及び振動波アクチュエータ
JP2011217493A (ja) * 2010-03-31 2011-10-27 Canon Inc 振動体及び振動波アクチュエータ
JP2011254569A (ja) * 2010-05-31 2011-12-15 Canon Inc 振動体とその製造方法及び振動波アクチュエータ
JP2012191733A (ja) * 2011-03-10 2012-10-04 Canon Inc 圧電素子、圧電素子を有する圧電アクチュエータおよび振動波モータ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023286758A1 (ja) * 2021-07-14 2023-01-19 京セラ株式会社 接合体
JPWO2023286758A1 (enExample) * 2021-07-14 2023-01-19
JP7692042B2 (ja) 2021-07-14 2025-06-12 京セラ株式会社 接合体

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US9837938B2 (en) 2017-12-05

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