JP2014169450A5 - - Google Patents

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Publication number
JP2014169450A5
JP2014169450A5 JP2014097205A JP2014097205A JP2014169450A5 JP 2014169450 A5 JP2014169450 A5 JP 2014169450A5 JP 2014097205 A JP2014097205 A JP 2014097205A JP 2014097205 A JP2014097205 A JP 2014097205A JP 2014169450 A5 JP2014169450 A5 JP 2014169450A5
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JP
Japan
Prior art keywords
resin
acrylate
group
resins
adhesive formulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014097205A
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English (en)
Japanese (ja)
Other versions
JP2014169450A (ja
JP5676801B2 (ja
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Publication date
Priority claimed from US10/815,442 external-priority patent/US7160946B2/en
Application filed filed Critical
Publication of JP2014169450A publication Critical patent/JP2014169450A/ja
Publication of JP2014169450A5 publication Critical patent/JP2014169450A5/ja
Application granted granted Critical
Publication of JP5676801B2 publication Critical patent/JP5676801B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2014097205A 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法 Expired - Lifetime JP5676801B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/815442 2004-04-01
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005100639A Division JP5654718B2 (ja) 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法

Publications (3)

Publication Number Publication Date
JP2014169450A JP2014169450A (ja) 2014-09-18
JP2014169450A5 true JP2014169450A5 (OSRAM) 2014-10-30
JP5676801B2 JP5676801B2 (ja) 2015-02-25

Family

ID=34887744

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005100639A Expired - Lifetime JP5654718B2 (ja) 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法
JP2014097205A Expired - Lifetime JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2005100639A Expired - Lifetime JP5654718B2 (ja) 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法

Country Status (8)

Country Link
US (1) US7160946B2 (OSRAM)
EP (1) EP1582574B1 (OSRAM)
JP (2) JP5654718B2 (OSRAM)
KR (1) KR101158348B1 (OSRAM)
CN (1) CN1676564A (OSRAM)
DE (1) DE602005000365T2 (OSRAM)
SG (1) SG115812A1 (OSRAM)
TW (1) TWI367926B (OSRAM)

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CN102585760A (zh) * 2004-03-19 2012-07-18 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5250640B2 (ja) * 2008-02-25 2013-07-31 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 自己フィレット化・ダイ取付けペースト
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
KR101974257B1 (ko) * 2014-08-29 2019-04-30 후루카와 덴키 고교 가부시키가이샤 접착 필름 및 접착 필름을 이용한 반도체 패키지
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
EP3097593B1 (de) * 2014-12-01 2020-08-26 PI Ceramic GmbH Aktuatorvorrichtung
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
WO2018062164A1 (ja) * 2016-09-29 2018-04-05 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
US20220112373A1 (en) * 2019-01-24 2022-04-14 Showa Denko K.K. Thermosetting resin composition
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
DE69621635T2 (de) * 1995-11-13 2003-01-02 Cytec Technology Corp., Wilmington Aushärtendes Bismaleinimid Polymer für Kleb- und Verbundwerkstoffe
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
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JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
DE60034063T2 (de) * 1999-07-08 2007-07-26 University Of North Carolina At Chapel Hill Neue prodrugs für antimicrobielle amidine
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
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JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
BRPI0211039B1 (pt) * 2001-06-22 2015-07-14 Unilever Nv Composição condicionadora sólida para os cabelos e uso de uma composição condicionadora sólida para os cabelos
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