TWI367926B - Method to improve high temperature cohesive strength with adhesive having multi-phase system - Google Patents

Method to improve high temperature cohesive strength with adhesive having multi-phase system

Info

Publication number
TWI367926B
TWI367926B TW094110162A TW94110162A TWI367926B TW I367926 B TWI367926 B TW I367926B TW 094110162 A TW094110162 A TW 094110162A TW 94110162 A TW94110162 A TW 94110162A TW I367926 B TWI367926 B TW I367926B
Authority
TW
Taiwan
Prior art keywords
adhesive
high temperature
phase system
cohesive strength
improve high
Prior art date
Application number
TW094110162A
Other languages
English (en)
Chinese (zh)
Other versions
TW200613501A (en
Inventor
Tadashi Takano
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Publication of TW200613501A publication Critical patent/TW200613501A/zh
Application granted granted Critical
Publication of TWI367926B publication Critical patent/TWI367926B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
TW094110162A 2004-04-01 2005-03-31 Method to improve high temperature cohesive strength with adhesive having multi-phase system TWI367926B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Publications (2)

Publication Number Publication Date
TW200613501A TW200613501A (en) 2006-05-01
TWI367926B true TWI367926B (en) 2012-07-11

Family

ID=34887744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110162A TWI367926B (en) 2004-04-01 2005-03-31 Method to improve high temperature cohesive strength with adhesive having multi-phase system

Country Status (8)

Country Link
US (1) US7160946B2 (OSRAM)
EP (1) EP1582574B1 (OSRAM)
JP (2) JP5654718B2 (OSRAM)
KR (1) KR101158348B1 (OSRAM)
CN (1) CN1676564A (OSRAM)
DE (1) DE602005000365T2 (OSRAM)
SG (1) SG115812A1 (OSRAM)
TW (1) TWI367926B (OSRAM)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8088308B2 (en) 2004-03-19 2012-01-03 Sumitomo Bakelite Company, Ltd. Resin composition and semiconductor device produced by using the same
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
EP2250227A4 (en) * 2008-02-25 2013-08-21 Henkel Ag & Co Kgaa OUT OF THEIR PUNCHING CHIP FIXING PASTE
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
WO2016031553A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
WO2016087036A1 (de) * 2014-12-01 2016-06-09 Pi Ceramic Gmbh Kermische Technologien Und Bauelemente Aktuatorvorrichtung
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
KR102466030B1 (ko) * 2016-09-29 2022-11-10 세키스이가가쿠 고교가부시키가이샤 액정 표시 소자용 시일제, 상하 도통 재료, 및 액정 표시 소자
CN110582841B (zh) 2017-05-16 2023-08-22 迪睿合株式会社 底部填充材料、底部填充薄膜及使用其的半导体装置的制备方法
US20220112373A1 (en) * 2019-01-24 2022-04-14 Showa Denko K.K. Thermosetting resin composition
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP4054062B2 (ja) * 1995-11-13 2008-02-27 サイテク・テクノロジー・コーポレーシヨン 複合材及び接着剤用途の熱硬化性重合体
US20030055121A1 (en) 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
BR9810357A (pt) * 1997-07-03 2000-08-29 Loctite Corp Composição adesiva anaeróbica, composição anaeróbica capaz de curar sob condições de temperatura ambiente, composição anaerobicamente curável, e, produto de reação
JPH11106454A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JPH11106455A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
AU779923B2 (en) * 1999-07-08 2005-02-17 Georgia State University Novel prodrugs for antimicrobial amidines
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
MXPA02012842A (es) * 2000-06-23 2003-05-15 Solutia Inc Procedimiento para formar microesferas solidas polimericas adhesivas sensibles a la presion.
JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
ES2249592T3 (es) * 2001-06-22 2006-04-01 Unilever N.V. Composiciones de acondicionamiento del cabello.
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Also Published As

Publication number Publication date
US20050222330A1 (en) 2005-10-06
DE602005000365T2 (de) 2007-05-16
SG115812A1 (en) 2005-10-28
JP2005290380A (ja) 2005-10-20
EP1582574B1 (en) 2006-12-27
DE602005000365D1 (de) 2007-02-08
EP1582574A1 (en) 2005-10-05
TW200613501A (en) 2006-05-01
KR101158348B1 (ko) 2012-06-22
JP5654718B2 (ja) 2015-01-14
CN1676564A (zh) 2005-10-05
JP2014169450A (ja) 2014-09-18
US7160946B2 (en) 2007-01-09
KR20060044868A (ko) 2006-05-16
JP5676801B2 (ja) 2015-02-25

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