JP2014146590A - パターン形成された透明導電体を製造する方法 - Google Patents
パターン形成された透明導電体を製造する方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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Abstract
【解決手段】銀キャリヤー中に分散した銀ナノ粒子を含む銀インクコア成分を用意する工程と、シェルキャリヤー中に分散した膜形成性ポリマーを含むシェル成分を用意する工程と、基体を用意する工程と、銀インクコア成分およびシェル成分を共電界紡糸して、コアシェル繊維であって、銀ナノ粒子がコアにあるコアシェル繊維を形成する工程と、コアシェル繊維を基体上に堆積させる工程と、堆積コアシェル繊維の一部分を選択的に処理して、パターン形成された透明導電体を得る工程とを含む、パターン形成された透明導電体を製造する方法であって、パターン形成された透明導電体は処理領域および未処理領域を有し、処理領域は複数の電気的相互接続銀ミニワイヤーを含み、処理領域は導電性領域であり、並びに未処理領域は電気絶縁性領域である方法。
【選択図】なし
Description
最も好ましくは、以下の式:
IME Technologies製のデュアルノズル電界紡糸機械モデルEC−DIGを使用してコアシェル繊維を電界紡糸した。使用するノズルは0.4mm直径を有する材料フローの方向に垂直な円形横断面を有する内側開口部および材料フローの方向に垂直な環状横断面を有し内側開口部と同心円状の外側開口部を有し、0.6mm内径および1.2mm外径を有する同軸ノズル(IME Technologies製のEM−CAX)とした。材料を紡糸する際、銀インクコア成分は同軸ノズルの内側開口部を通して供給し、シェル成分は同軸ノズルの外側開口部を通して供給した。銀インクコア成分およびシェル成分は、独立したシリンジポンプ(IME Technologies製のEP−NE1)を使用して同軸ノズルを通して供給し、銀インクコア成分の体積流量VFRcoreを2.5μL/分に、またシェル成分の体積流量VFRshellを18μL/分に制御した。電界紡糸プロセスは、20℃および25〜35%の相対湿度の気候制御実験室中、周囲雰囲気条件で行った。
比較例A1〜A2および実施例2〜3でIME Technologies製のデュアルノズル電界紡糸機械モデルEC−DIGを使用して銀ミニワイヤーを電界紡糸した。使用するノズルは0.4mm直径を有する材料フローの方向に垂直な円形横断面を有する内側開口部および材料フローの方向に垂直な環状横断面を有し内側開口部と同心円状の外側開口部を有し、0.6mm内径および1.2mm外径を有する同軸ノズル(IME Technologies製のEM−CAX)とした。材料を紡糸する際、銀インクコア成分は同軸ノズルの内側開口部を通して供給し、シェル成分は同軸ノズルの外側開口部を通して供給した。銀インクコア成分およびシェル成分は、独立したシリンジポンプ(IME Technologies製のEP−NE1)を使用して同軸ノズルを通して供給し、銀インクコア成分の体積流量VFRcoreを0.5μL/分に、またシェル成分の体積流量VFRshellを5μL/分に制御した。電界紡糸プロセスは、20℃および25〜35%の相対湿度の気候制御実験室中、周囲雰囲気条件で行った。
実施例2〜3の各々で、コアシェル繊維を電界紡糸し、ガラススライド基体上に堆積させた。実施例2〜3に使用する銀インクコア成分は、水中に分散した50nmの公称粒径を有する75重量%の銀ナノ粒子(CSD95としてCabot Corporationから市販されている)を含んでいた。実施例2〜3に使用するシェル成分は、40/60重量%水/エタノール溶液中に溶解した6重量%ポリエチレンオキシド(Aldrich製の400,000g/mol)を含んでおり、この銀インクコア成分とシェル成分との間の界面張力は2〜5mN/mであると測定された。
使用する銀インクコア成分は、水中に分散した60重量%の銀ナノ粒子(PFI−722インクとしてPChem Associates,Inc.から市販されている)を含んでいた。以下を含む種々のシェル成分を使用した:
水中の6重量%ポリアクリル酸;
60/40重量%エタノール/水混合物中の4重量%ポリエチレンオキシド;
60/40重量%イソプロパノール/水混合物中の6重量%ポリエチレンオキシド;
30/20/50重量%水/イソプロパノール/ブタノール混合物中の8重量%ポリアクリル酸;
60/40重量%エタノール/水混合物中の4〜6重量%ポリエチレンオキシド;
60/40重量%エタノール/水混合物中の4〜8重量%ポリアクリル酸;
40/60重量%エタノール/水混合物中の4〜8重量%ポリアクリル酸。
これらの系の各々における銀インクコア成分とシェル成分との間の界面張力は0.4〜2mN/mであると測定された。
使用する銀インクコア成分は、水中に分散した60重量%の銀ナノ粒子(PFI−722インクとしてPChem Associates,Inc.から市販されている)を含んでいた。以下を含む種々のシェル成分を使用した:
水中の6重量%ポリアクリル酸;
60/40重量%エタノール/水混合物中の4重量%ポリエチレンオキシド;
60/40重量%イソプロパノール/水混合物中の6重量%ポリエチレンオキシド;
30/20/50重量%水/イソプロパノール/ブタノール混合物中の8重量%ポリアクリル酸;
60/40重量%エタノール/水混合物中の4〜6重量%ポリエチレンオキシド;
60/40重量%エタノール/水混合物中の4〜8重量%ポリアクリル酸;
40/60重量%エタノール/水混合物中の4〜8重量%ポリアクリル酸。
これらの系の各々における銀インクコア成分とシェル成分との間の界面張力は0.4〜2mN/mであると測定された。
Claims (10)
- 銀キャリヤー中に分散した銀ナノ粒子を含む銀インクコア成分を用意する工程と、
シェルキャリヤー中に分散した膜形成性ポリマーを含むシェル成分を用意する工程と、
基体を用意する工程と、
前記銀インクコア成分および前記シェル成分を共電界紡糸して、コアおよび前記コアを囲むシェルを有するコアシェル繊維であって、前記銀ナノ粒子が前記コアにあるコアシェル繊維を形成する工程と、
前記コアシェル繊維を基体上に堆積させて堆積コアシェル繊維を得る工程と、
前記堆積コアシェル繊維の一部分を選択的に処理して、パターン形成された透明導電体を得る工程と
を含む、パターン形成された透明導電体を製造する方法であって、
前記パターン形成された透明導電体は処理領域および未処理領域を有し、
前記処理領域は複数の電気的相互接続銀ミニワイヤーを含み、前記処理領域は導電性領域であり、並びに前記未処理領域は電気絶縁性領域である、
パターン形成された透明導電体を製造する方法。 - 前記処理領域が前記基体上に制御されたパターンで形成される、請求項1に記載の方法。
- 前記制御されたパターンが規則的パターンである、請求項2に記載の方法。
- 前記制御されたパターンが不規則的パターンである、請求項2に記載の方法。
- 前記制御されたパターン格子状パターンが不規則的格子状パターンである、請求項2に記載の方法。
- 前記パターン形成された透明導電体が1%以下のΔTransを示す、請求項1に記載の方法。
- 前記パターン形成された透明導電体が1%以下のΔHazeを示す、請求項1に記載の方法。
- 前記パターン形成された透明導電体が1%以下のΔHazeを示す、請求項6に記載の方法。
- 前記堆積コアシェル繊維の一部分を選択的に処理してパターン形成された透明導電体を得る工程が、前記堆積コアシェル繊維の一部分を、焼結、加熱およびこれらの組み合わせからなる群から選択される技術を使用して選択的に処理する工程を含む、請求項1に記載の方法。
- 請求項1に記載の方法により製造されたパターン形成された透明導電体。
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