JP2014139979A5 - - Google Patents
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- Publication number
- JP2014139979A5 JP2014139979A5 JP2013008285A JP2013008285A JP2014139979A5 JP 2014139979 A5 JP2014139979 A5 JP 2014139979A5 JP 2013008285 A JP2013008285 A JP 2013008285A JP 2013008285 A JP2013008285 A JP 2013008285A JP 2014139979 A5 JP2014139979 A5 JP 2014139979A5
- Authority
- JP
- Japan
- Prior art keywords
- led
- translucent
- led device
- external connection
- led die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013008285A JP6086738B2 (ja) | 2013-01-21 | 2013-01-21 | Led装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013008285A JP6086738B2 (ja) | 2013-01-21 | 2013-01-21 | Led装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014139979A JP2014139979A (ja) | 2014-07-31 |
JP2014139979A5 true JP2014139979A5 (th) | 2016-01-07 |
JP6086738B2 JP6086738B2 (ja) | 2017-03-01 |
Family
ID=51416559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013008285A Active JP6086738B2 (ja) | 2013-01-21 | 2013-01-21 | Led装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6086738B2 (th) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102252992B1 (ko) | 2014-12-12 | 2021-05-20 | 삼성전자주식회사 | 반도체 발광소자 패키지의 제조 방법 |
WO2016178397A1 (ja) * | 2015-05-01 | 2016-11-10 | 日東電工株式会社 | 蛍光体層-封止層付光半導体素子の製造方法 |
CN106856220B (zh) * | 2015-12-08 | 2020-03-06 | 上海芯元基半导体科技有限公司 | 晶元级封装的倒装led器件及其分割单元和制作方法 |
JP6314968B2 (ja) * | 2015-12-25 | 2018-04-25 | 日亜化学工業株式会社 | 発光装置 |
JP6512201B2 (ja) * | 2016-09-30 | 2019-05-15 | 日亜化学工業株式会社 | 線状発光装置の製造方法及び線状発光装置 |
JP6834469B2 (ja) | 2016-12-27 | 2021-02-24 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP6633111B2 (ja) * | 2018-02-19 | 2020-01-22 | アルパッド株式会社 | 発光ユニット及び半導体発光装置 |
JP2024018492A (ja) | 2022-07-29 | 2024-02-08 | 日亜化学工業株式会社 | 発光装置の製造方法ならびに発光装置および発光モジュール |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4438492B2 (ja) * | 2003-09-11 | 2010-03-24 | 日亜化学工業株式会社 | 半導体装置およびその製造方法 |
JP5008263B2 (ja) * | 2005-03-02 | 2012-08-22 | 日亜化学工業株式会社 | 半導体発光素子 |
JP5463901B2 (ja) * | 2009-12-24 | 2014-04-09 | 日亜化学工業株式会社 | 発光装置 |
US8198109B2 (en) * | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
JP2012216712A (ja) * | 2011-03-28 | 2012-11-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法および発光ダイオード素子 |
JP5680472B2 (ja) * | 2011-04-22 | 2015-03-04 | シチズンホールディングス株式会社 | 半導体発光装置の製造方法 |
-
2013
- 2013-01-21 JP JP2013008285A patent/JP6086738B2/ja active Active
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