JP2014129477A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014129477A5 JP2014129477A5 JP2012288120A JP2012288120A JP2014129477A5 JP 2014129477 A5 JP2014129477 A5 JP 2014129477A5 JP 2012288120 A JP2012288120 A JP 2012288120A JP 2012288120 A JP2012288120 A JP 2012288120A JP 2014129477 A5 JP2014129477 A5 JP 2014129477A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- molecular chain
- bonded
- silicon atom
- dimethylvinylsiloxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 trimethylsiloxy Chemical group 0.000 description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 6
- 150000003961 organosilicon compounds Chemical class 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NNBKRIKVBOICMG-UHFFFAOYSA-N anthracen-1-yl-[anthracen-1-yl(methyl)silyl]oxy-methylsilane Chemical compound C1(=CC=CC2=CC3=CC=CC=C3C=C12)[SiH](O[SiH](C)C1=CC=CC2=CC3=CC=CC=C3C=C12)C NNBKRIKVBOICMG-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- RMZSTOAGUSEJFY-UHFFFAOYSA-N methyl-[methyl(phenyl)silyl]oxy-phenylsilane Chemical compound C=1C=CC=CC=1[SiH](C)O[SiH](C)C1=CC=CC=C1 RMZSTOAGUSEJFY-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012288120A JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| KR1020157020575A KR20150100930A (ko) | 2012-12-28 | 2013-12-24 | 경화성 실리콘 조성물, 이의 경화물 및 광반도체 장치 |
| PCT/JP2013/085315 WO2014104390A2 (en) | 2012-12-28 | 2013-12-24 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| US14/655,536 US20150344636A1 (en) | 2012-12-28 | 2013-12-24 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device |
| TW102148881A TW201428060A (zh) | 2012-12-28 | 2013-12-27 | 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012288120A JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014129477A JP2014129477A (ja) | 2014-07-10 |
| JP2014129477A5 true JP2014129477A5 (enExample) | 2016-02-04 |
| JP6059010B2 JP6059010B2 (ja) | 2017-01-11 |
Family
ID=49998635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012288120A Expired - Fee Related JP6059010B2 (ja) | 2012-12-28 | 2012-12-28 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150344636A1 (enExample) |
| JP (1) | JP6059010B2 (enExample) |
| KR (1) | KR20150100930A (enExample) |
| TW (1) | TW201428060A (enExample) |
| WO (1) | WO2014104390A2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5985981B2 (ja) | 2012-12-28 | 2016-09-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| CN109196008B (zh) * | 2016-05-30 | 2021-07-06 | 日产化学株式会社 | 反应性聚硅氧烷及包含该反应性聚硅氧烷的聚合性组合物 |
| WO2017208748A1 (ja) * | 2016-05-30 | 2017-12-07 | 日産化学工業株式会社 | 重合性シラン化合物 |
| CN106831849A (zh) * | 2017-01-24 | 2017-06-13 | 广东信翼科技有限公司 | 一种含烯丙基聚硅氧烷的制备方法 |
| CA3099861A1 (en) | 2018-05-17 | 2019-11-21 | Evonik Operations Gmbh | Linear polydimethylsiloxane-polyoxyalkylene block copolymers of the structural type aba |
| EP3611216A1 (de) * | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere des strukturtyps aba |
| US11345783B2 (en) | 2018-05-17 | 2022-05-31 | Evonik Operations Gmbh | Linear polydimethylsiloxane-polyoxyalkylene block copolymers of the structure type ABA |
| EP3611214A1 (de) | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Sioc-verknüpfte, lineare polydimethylsiloxan-polyoxyalkylen-blockcopolymere |
| EP3611215A1 (de) * | 2018-08-15 | 2020-02-19 | Evonik Operations GmbH | Verfahren zur herstellung acetoxygruppen-tragender siloxane |
| ES2989053T3 (es) * | 2018-08-15 | 2024-11-25 | Evonik Operations Gmbh | Copolímeros de bloques de polidimetilsiloxano-polioxialquileno del tipo estructural ABA |
| JP7220686B2 (ja) * | 2020-05-15 | 2023-02-10 | 信越化学工業株式会社 | 有機ケイ素化合物 |
| DE102020118247A1 (de) | 2020-07-10 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Precursor zur Herstellung eines Polysiloxans, Polysiloxan, Polysiloxanharz, Verfahren zur Herstellung eines Polysiloxans, Verfahren zur Herstellung eines Polysiloxanharzes und optoelektronisches Bauelement |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101152869B1 (ko) * | 2010-01-25 | 2012-06-12 | 주식회사 엘지화학 | 경화성 조성물 |
| JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
| JP2012097225A (ja) * | 2010-11-04 | 2012-05-24 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
| JP2012111875A (ja) * | 2010-11-25 | 2012-06-14 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
| JP5652387B2 (ja) * | 2011-12-22 | 2015-01-14 | 信越化学工業株式会社 | 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置 |
| KR101560042B1 (ko) * | 2012-07-27 | 2015-10-15 | 주식회사 엘지화학 | 경화성 조성물 |
-
2012
- 2012-12-28 JP JP2012288120A patent/JP6059010B2/ja not_active Expired - Fee Related
-
2013
- 2013-12-24 US US14/655,536 patent/US20150344636A1/en not_active Abandoned
- 2013-12-24 KR KR1020157020575A patent/KR20150100930A/ko not_active Withdrawn
- 2013-12-24 WO PCT/JP2013/085315 patent/WO2014104390A2/en not_active Ceased
- 2013-12-27 TW TW102148881A patent/TW201428060A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014129477A5 (enExample) | ||
| CN106103594B (zh) | 有机硅凝胶组合物 | |
| JP6532986B2 (ja) | 硬化性シリコーン組成物 | |
| US8895678B2 (en) | Cross-linkable silicone composition and cross-linked product thereof | |
| JP5755802B2 (ja) | 硬化性シリコーン組成物およびその硬化物 | |
| WO2005030874A1 (ja) | 熱伝導性シリコーン組成物 | |
| CN103814087B (zh) | 用于密封光学半导体元件的可固化有机硅组合物、制备树脂密封的光学半导体元件的方法、以及树脂密封的光学半导体元件 | |
| JP5922463B2 (ja) | 硬化性シリコーン組成物、その硬化物、および光半導体装置 | |
| CN104169368B (zh) | 有机硅树脂组合物、有机硅树脂固化物和光学半导体元件封装体 | |
| KR20120116007A (ko) | 열전도성 실리콘 고무 조성물 | |
| CN104212185B (zh) | 一种稳定不渗油型电子元器件用透明硅凝胶 | |
| JP2010001336A (ja) | 硬化性オルガノポリシロキサン組成物及び半導体装置 | |
| JP2012007057A5 (enExample) | ||
| JP7444856B2 (ja) | 多成分型硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体 | |
| JP2014084417A5 (enExample) | ||
| JP2005162975A (ja) | 熱伝導性シリコーン組成物 | |
| JP2013067683A5 (enExample) | ||
| KR20200010425A (ko) | 다이 본딩용 경화성 실리콘 조성물 | |
| JP2010180323A (ja) | 硬化性シリコーン組成物およびその硬化物 | |
| JP2014509668A5 (enExample) | ||
| WO2020203298A1 (ja) | 室温硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物 | |
| US9783717B2 (en) | Addition-curable silicone resin composition, addition-curable silicone resin cured product, and sealed optical semiconductor element | |
| JP2009102591A5 (enExample) | ||
| JP5368379B2 (ja) | 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置 | |
| JP2005294437A5 (enExample) |