JP2014086393A5 - - Google Patents

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Publication number
JP2014086393A5
JP2014086393A5 JP2012236901A JP2012236901A JP2014086393A5 JP 2014086393 A5 JP2014086393 A5 JP 2014086393A5 JP 2012236901 A JP2012236901 A JP 2012236901A JP 2012236901 A JP2012236901 A JP 2012236901A JP 2014086393 A5 JP2014086393 A5 JP 2014086393A5
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JP
Japan
Prior art keywords
charged particle
particle beam
incident angle
beam apparatus
calibrated
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JP2012236901A
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English (en)
Japanese (ja)
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JP2014086393A (ja
JP5965819B2 (ja
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Priority claimed from JP2012236901A external-priority patent/JP5965819B2/ja
Priority to JP2012236901A priority Critical patent/JP5965819B2/ja
Priority to TW102134768A priority patent/TWI498522B/zh
Priority to US14/435,203 priority patent/US9224575B2/en
Priority to KR1020157009208A priority patent/KR101712298B1/ko
Priority to PCT/JP2013/078678 priority patent/WO2014065311A1/ja
Publication of JP2014086393A publication Critical patent/JP2014086393A/ja
Publication of JP2014086393A5 publication Critical patent/JP2014086393A5/ja
Publication of JP5965819B2 publication Critical patent/JP5965819B2/ja
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JP2012236901A 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法 Active JP5965819B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012236901A JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法
TW102134768A TWI498522B (zh) 2012-10-26 2013-09-26 Measurement method of charged particle beam device and stacking misalignment
PCT/JP2013/078678 WO2014065311A1 (ja) 2012-10-26 2013-10-23 荷電粒子線装置及び重ね合わせずれ量測定方法
KR1020157009208A KR101712298B1 (ko) 2012-10-26 2013-10-23 하전 입자선 장치 및 중첩 어긋남량 측정 방법
US14/435,203 US9224575B2 (en) 2012-10-26 2013-10-23 Charged particle beam device and overlay misalignment measurement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012236901A JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法

Publications (3)

Publication Number Publication Date
JP2014086393A JP2014086393A (ja) 2014-05-12
JP2014086393A5 true JP2014086393A5 (OSRAM) 2015-08-13
JP5965819B2 JP5965819B2 (ja) 2016-08-10

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ID=50544687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012236901A Active JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法

Country Status (5)

Country Link
US (1) US9224575B2 (OSRAM)
JP (1) JP5965819B2 (OSRAM)
KR (1) KR101712298B1 (OSRAM)
TW (1) TWI498522B (OSRAM)
WO (1) WO2014065311A1 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9418819B2 (en) * 2013-09-06 2016-08-16 Kla-Tencor Corporation Asymmetrical detector design and methodology
JP6511193B2 (ja) 2016-04-13 2019-05-15 株式会社日立ハイテクノロジーズ パターン計測装置およびパターン計測方法
KR102372842B1 (ko) 2016-04-22 2022-03-08 어플라이드 머티어리얼스, 인코포레이티드 Pecvd 오버레이 개선을 위한 방법
JP6850234B2 (ja) * 2017-09-29 2021-03-31 株式会社日立ハイテク 荷電粒子線装置
CN115507782A (zh) * 2017-10-13 2022-12-23 株式会社日立高新技术 图案测量装置及图案测量方法
US10403471B2 (en) * 2017-11-29 2019-09-03 Asml Netherlands B.V. Systems and methods for charged particle beam modulation
US10473460B2 (en) 2017-12-11 2019-11-12 Kla-Tencor Corporation Overlay measurements of overlapping target structures based on symmetry of scanning electron beam signals
JP2019164886A (ja) * 2018-03-19 2019-09-26 株式会社日立ハイテクノロジーズ ビーム照射装置
JP7093242B2 (ja) * 2018-06-27 2022-06-29 株式会社ニューフレアテクノロジー 荷電粒子ビーム画像取得装置
JP2020187876A (ja) * 2019-05-13 2020-11-19 株式会社日立ハイテク 荷電粒子線装置
JP2021034163A (ja) * 2019-08-20 2021-03-01 株式会社日立ハイテク 荷電粒子ビームシステム、及び重ね合わせずれ量測定方法
JP7254940B2 (ja) * 2019-08-23 2023-04-10 株式会社日立ハイテク オーバーレイ計測システム及びオーバーレイ計測装置
US12183541B2 (en) 2019-08-28 2024-12-31 Hitachi High-Tech Corporation Charged particle beam system and overlay misalignment measurement method
KR102623888B1 (ko) * 2019-10-30 2024-01-10 양쯔 메모리 테크놀로지스 씨오., 엘티디. 반도체 제조공정에 적용되는 입자빔의 수직도 보정 방법 및 시스템
US11054753B1 (en) * 2020-04-20 2021-07-06 Applied Materials Israel Ltd. Overlay monitoring
JP2022112137A (ja) 2021-01-21 2022-08-02 株式会社日立ハイテク 荷電粒子ビーム装置
TWI885216B (zh) * 2021-01-29 2025-06-01 日商日立高新技術科學股份有限公司 試料片移設裝置
CN119452449A (zh) * 2022-09-30 2025-02-14 Asml荷兰有限公司 扫描电子显微镜（sem）背向散射电子（bse）聚焦目标和方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03291880A (ja) 1990-04-06 1991-12-24 Matsushita Electric Works Ltd リード線付配線部品の組立方法
JP3101114B2 (ja) 1993-02-16 2000-10-23 日本電子株式会社 走査電子顕微鏡
JP3291880B2 (ja) 1993-12-28 2002-06-17 株式会社日立製作所 走査形電子顕微鏡
US5923041A (en) * 1995-02-03 1999-07-13 Us Commerce Overlay target and measurement procedure to enable self-correction for wafer-induced tool-induced shift by imaging sensor means
JPH11283545A (ja) * 1998-03-30 1999-10-15 Nikon Corp 電子画像観察装置
TWI294632B (en) * 2000-06-27 2008-03-11 Ebara Corp Inspecting device using an electron ebam and method for making semiconductor devices with such inspection device
US20040066517A1 (en) * 2002-09-05 2004-04-08 Hsu-Ting Huang Interferometry-based method and apparatus for overlay metrology
US7842933B2 (en) * 2003-10-22 2010-11-30 Applied Materials Israel, Ltd. System and method for measuring overlay errors
US7065737B2 (en) * 2004-03-01 2006-06-20 Advanced Micro Devices, Inc Multi-layer overlay measurement and correction technique for IC manufacturing
JP4695909B2 (ja) * 2005-03-31 2011-06-08 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2007042929A (ja) 2005-08-04 2007-02-15 Hitachi High-Tech Control Systems Corp ロードロック装置とその方法及び半導体製造装置
JP4988274B2 (ja) * 2006-08-31 2012-08-01 株式会社日立ハイテクノロジーズ パターンのずれ測定方法、及びパターン測定装置
JP5268532B2 (ja) 2008-09-30 2013-08-21 株式会社日立ハイテクノロジーズ 試料計測方法、及び計測装置
JP2010177500A (ja) * 2009-01-30 2010-08-12 Hitachi High-Technologies Corp パターンの重ね合わせ評価方法
JP5425601B2 (ja) 2009-12-03 2014-02-26 株式会社日立ハイテクノロジーズ 荷電粒子線装置およびその画質改善方法
JP5313939B2 (ja) 2010-02-09 2013-10-09 株式会社日立ハイテクノロジーズ パターン検査方法、パターン検査プログラム、電子デバイス検査システム
JP5986817B2 (ja) * 2012-06-15 2016-09-06 株式会社日立ハイテクノロジーズ オーバーレイ誤差測定装置、及びコンピュータープログラム

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