JP2014078695A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2014078695A
JP2014078695A JP2013183879A JP2013183879A JP2014078695A JP 2014078695 A JP2014078695 A JP 2014078695A JP 2013183879 A JP2013183879 A JP 2013183879A JP 2013183879 A JP2013183879 A JP 2013183879A JP 2014078695 A JP2014078695 A JP 2014078695A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
led chip
substrate
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013183879A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014078695A5 (enExample
Inventor
Tomohiro Sanpei
友広 三瓶
Takuma Kato
卓真 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2014078695A publication Critical patent/JP2014078695A/ja
Publication of JP2014078695A5 publication Critical patent/JP2014078695A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2013183879A 2012-10-09 2013-09-05 発光装置 Pending JP2014078695A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120111596A KR20140047750A (ko) 2012-10-09 2012-10-09 발광 장치
KR10-2012-0111596 2012-10-09

Publications (2)

Publication Number Publication Date
JP2014078695A true JP2014078695A (ja) 2014-05-01
JP2014078695A5 JP2014078695A5 (enExample) 2016-10-13

Family

ID=49212592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013183879A Pending JP2014078695A (ja) 2012-10-09 2013-09-05 発光装置

Country Status (5)

Country Link
US (1) US9093626B2 (enExample)
EP (1) EP2720266B1 (enExample)
JP (1) JP2014078695A (enExample)
KR (1) KR20140047750A (enExample)
CN (1) CN103715338A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019114638A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 樹脂パッケージ及び半導体発光装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548005B (zh) * 2014-01-24 2016-09-01 環旭電子股份有限公司 選擇性電子封裝模組的製造方法
US10978619B2 (en) * 2016-12-02 2021-04-13 Toyoda Gosei Co., Ltd. Light emitting device
JP2018098085A (ja) * 2016-12-15 2018-06-21 株式会社ジャパンディスプレイ 表示装置
CN107369741A (zh) * 2017-07-13 2017-11-21 东莞市凯昶德电子科技股份有限公司 带一体式金属围坝的led支架模组及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317599A (ja) * 2004-04-27 2005-11-10 Kyocera Corp 電子部品搭載用基板および電子装置
US20060163587A1 (en) * 2005-01-21 2006-07-27 Erchak Alexei A Packaging designs for LEDs
JP2008300350A (ja) * 2007-05-02 2008-12-11 Cree Inc Ｃｒｉの高い暖色系白色光を供給するマルチチップ発光デバイスランプおよびこれを含む照明器具
JP2011071407A (ja) * 2009-09-28 2011-04-07 Sharp Corp 発光素子および照明装置
JP2011113672A (ja) * 2009-11-24 2011-06-09 Toshiba Lighting & Technology Corp 発光装置及びこれを備えた照明器具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
JP2002305261A (ja) * 2001-01-10 2002-10-18 Canon Inc 電子部品及びその製造方法
EP1909336B1 (en) * 2005-06-30 2014-10-22 Panasonic Corporation Light emitting device
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US7943952B2 (en) * 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
TWI367465B (en) * 2008-02-15 2012-07-01 Foxsemicon Integrated Tech Inc Led display
KR20100079688A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 Ｌｅｄ 패키지
CN102074558B (zh) * 2009-10-21 2013-06-19 东芝照明技术株式会社 发光装置以及照明器具
EP2315284A3 (en) * 2009-10-21 2013-03-27 Toshiba Lighting & Technology Corporation Light-Emitting apparatus and luminaire
EP2378576A2 (en) * 2010-04-15 2011-10-19 Samsung LED Co., Ltd. Light emitting diode package, lighting apparatus having the same, and method for manufacturing light emitting diode package
EP2448028B1 (en) * 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
KR101901890B1 (ko) * 2012-09-28 2018-09-28 엘지이노텍 주식회사 발광 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317599A (ja) * 2004-04-27 2005-11-10 Kyocera Corp 電子部品搭載用基板および電子装置
US20060163587A1 (en) * 2005-01-21 2006-07-27 Erchak Alexei A Packaging designs for LEDs
JP2008300350A (ja) * 2007-05-02 2008-12-11 Cree Inc Ｃｒｉの高い暖色系白色光を供給するマルチチップ発光デバイスランプおよびこれを含む照明器具
JP2011071407A (ja) * 2009-09-28 2011-04-07 Sharp Corp 発光素子および照明装置
JP2011113672A (ja) * 2009-11-24 2011-06-09 Toshiba Lighting & Technology Corp 発光装置及びこれを備えた照明器具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019114638A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 樹脂パッケージ及び半導体発光装置
JP7053249B2 (ja) 2017-12-22 2022-04-12 スタンレー電気株式会社 半導体発光装置

Also Published As

Publication number Publication date
US9093626B2 (en) 2015-07-28
EP2720266A2 (en) 2014-04-16
CN103715338A (zh) 2014-04-09
KR20140047750A (ko) 2014-04-23
EP2720266B1 (en) 2021-10-20
US20140097452A1 (en) 2014-04-10
EP2720266A3 (en) 2016-03-16

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