CN103715338A - 发光器件 - Google Patents

发光器件 Download PDF

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Publication number
CN103715338A
CN103715338A CN201310467515.8A CN201310467515A CN103715338A CN 103715338 A CN103715338 A CN 103715338A CN 201310467515 A CN201310467515 A CN 201310467515A CN 103715338 A CN103715338 A CN 103715338A
Authority
CN
China
Prior art keywords
led chip
substrate
phosphor
luminescent device
dam body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310467515.8A
Other languages
English (en)
Chinese (zh)
Inventor
三瓶友広
加藤卓真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN103715338A publication Critical patent/CN103715338A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201310467515.8A 2012-10-09 2013-10-09 发光器件 Pending CN103715338A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120111596A KR20140047750A (ko) 2012-10-09 2012-10-09 발광 장치
KR10-2012-0111596 2012-10-09

Publications (1)

Publication Number Publication Date
CN103715338A true CN103715338A (zh) 2014-04-09

Family

ID=49212592

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310467515.8A Pending CN103715338A (zh) 2012-10-09 2013-10-09 发光器件

Country Status (5)

Country Link
US (1) US9093626B2 (enExample)
EP (1) EP2720266B1 (enExample)
JP (1) JP2014078695A (enExample)
KR (1) KR20140047750A (enExample)
CN (1) CN103715338A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548005B (zh) * 2014-01-24 2016-09-01 環旭電子股份有限公司 選擇性電子封裝模組的製造方法
US10978619B2 (en) * 2016-12-02 2021-04-13 Toyoda Gosei Co., Ltd. Light emitting device
JP2018098085A (ja) * 2016-12-15 2018-06-21 株式会社ジャパンディスプレイ 表示装置
CN107369741A (zh) * 2017-07-13 2017-11-21 东莞市凯昶德电子科技股份有限公司 带一体式金属围坝的led支架模组及其制备方法
JP7053249B2 (ja) * 2017-12-22 2022-04-12 スタンレー電気株式会社 半導体発光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935376A (en) * 2008-02-15 2009-08-16 Foxsemicon Integrated Tech Inc LED display
KR20100079688A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 Ｌｅｄ 패키지
CN102074558A (zh) * 2009-10-21 2011-05-25 东芝照明技术株式会社 发光装置以及照明器具
CN102222757A (zh) * 2010-04-15 2011-10-19 三星Led株式会社 发光二极管封装件、照明装置和制造该封装件的方法
CN103715190A (zh) * 2012-09-28 2014-04-09 Lg伊诺特有限公司 发光器件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
JP2002305261A (ja) * 2001-01-10 2002-10-18 Canon Inc 電子部品及びその製造方法
JP2005317599A (ja) * 2004-04-27 2005-11-10 Kyocera Corp 電子部品搭載用基板および電子装置
US8125137B2 (en) * 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US7170100B2 (en) * 2005-01-21 2007-01-30 Luminus Devices, Inc. Packaging designs for LEDs
EP1909336B1 (en) * 2005-06-30 2014-10-22 Panasonic Corporation Light emitting device
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US7943952B2 (en) * 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
JP2011071407A (ja) * 2009-09-28 2011-04-07 Sharp Corp 発光素子および照明装置
JP5375552B2 (ja) * 2009-11-24 2013-12-25 東芝ライテック株式会社 発光装置及びこれを備えた照明器具
EP2315284A3 (en) * 2009-10-21 2013-03-27 Toshiba Lighting & Technology Corporation Light-Emitting apparatus and luminaire
EP2448028B1 (en) * 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935376A (en) * 2008-02-15 2009-08-16 Foxsemicon Integrated Tech Inc LED display
KR20100079688A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 Ｌｅｄ 패키지
CN102074558A (zh) * 2009-10-21 2011-05-25 东芝照明技术株式会社 发光装置以及照明器具
CN102222757A (zh) * 2010-04-15 2011-10-19 三星Led株式会社 发光二极管封装件、照明装置和制造该封装件的方法
CN103715190A (zh) * 2012-09-28 2014-04-09 Lg伊诺特有限公司 发光器件

Also Published As

Publication number Publication date
US9093626B2 (en) 2015-07-28
JP2014078695A (ja) 2014-05-01
EP2720266A2 (en) 2014-04-16
KR20140047750A (ko) 2014-04-23
EP2720266B1 (en) 2021-10-20
US20140097452A1 (en) 2014-04-10
EP2720266A3 (en) 2016-03-16

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: Sanpei Tomohiro

Inventor after: Kato Takuma

Inventor after: Shuhei Matsuda

Inventor before: Sanpei Tomohiro

Inventor before: Kato Takuma

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: TOMOHIRO SAMPEI TAKUMA KATO TO: TOMOHIRO SAMPEI TAKUMA KATO MATSUDA ZHOUPING

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140409