JP2014072271A5 - - Google Patents

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Publication number
JP2014072271A5
JP2014072271A5 JP2012215555A JP2012215555A JP2014072271A5 JP 2014072271 A5 JP2014072271 A5 JP 2014072271A5 JP 2012215555 A JP2012215555 A JP 2012215555A JP 2012215555 A JP2012215555 A JP 2012215555A JP 2014072271 A5 JP2014072271 A5 JP 2014072271A5
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JP
Japan
Prior art keywords
les
chip
heat sink
dielectric film
flexible
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JP2012215555A
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English (en)
Japanese (ja)
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JP6030905B2 (ja
JP2014072271A (ja
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Priority to JP2012215555A priority Critical patent/JP6030905B2/ja
Priority claimed from JP2012215555A external-priority patent/JP6030905B2/ja
Publication of JP2014072271A publication Critical patent/JP2014072271A/ja
Publication of JP2014072271A5 publication Critical patent/JP2014072271A5/ja
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Publication of JP6030905B2 publication Critical patent/JP6030905B2/ja
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JP2012215555A 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造 Active JP6030905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016151633A Division JP6541629B2 (ja) 2016-08-02 2016-08-02 発光半導体を相互接続するためのオーバーレイ回路構造

Publications (3)

Publication Number Publication Date
JP2014072271A JP2014072271A (ja) 2014-04-21
JP2014072271A5 true JP2014072271A5 (enExample) 2015-11-05
JP6030905B2 JP6030905B2 (ja) 2016-11-24

Family

ID=50747248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012215555A Active JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Country Status (1)

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JP (1) JP6030905B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080154214A1 (en) 2006-12-22 2008-06-26 Medrad, Inc. Flow Based Pressure Isolation and Fluid Delivery System Including Flow Based Pressure Isolation
US7771383B2 (en) 2004-10-22 2010-08-10 Medegen, Inc. Fluid control device with valve and methods of use

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922176C2 (de) * 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
KR100880812B1 (ko) * 2004-03-29 2009-01-30 아티큘레이티드 테크놀러지스 엘엘씨 롤-투-롤 제조된 광 시트 및 캡슐화된 반도체 회로디바이스들
JP5162979B2 (ja) * 2007-06-28 2013-03-13 日亜化学工業株式会社 発光装置

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