JP6030905B2 - 発光半導体を相互接続するためのオーバーレイ回路構造 - Google Patents

発光半導体を相互接続するためのオーバーレイ回路構造 Download PDF

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Publication number
JP6030905B2
JP6030905B2 JP2012215555A JP2012215555A JP6030905B2 JP 6030905 B2 JP6030905 B2 JP 6030905B2 JP 2012215555 A JP2012215555 A JP 2012215555A JP 2012215555 A JP2012215555 A JP 2012215555A JP 6030905 B2 JP6030905 B2 JP 6030905B2
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Japan
Prior art keywords
les
chip
flexible
interconnect structure
heat sink
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JP2012215555A
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English (en)
Japanese (ja)
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JP2014072271A5 (enExample
JP2014072271A (ja
Inventor
アルン・ヴィルパスカ・ゴウダ
ドナルド・ポール・カニングハム
シャクティ・シン・チュウハン
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General Electric Co
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General Electric Co
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Priority to JP2012215555A priority Critical patent/JP6030905B2/ja
Publication of JP2014072271A publication Critical patent/JP2014072271A/ja
Publication of JP2014072271A5 publication Critical patent/JP2014072271A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2012215555A 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造 Active JP6030905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012215555A JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016151633A Division JP6541629B2 (ja) 2016-08-02 2016-08-02 発光半導体を相互接続するためのオーバーレイ回路構造

Publications (3)

Publication Number Publication Date
JP2014072271A JP2014072271A (ja) 2014-04-21
JP2014072271A5 JP2014072271A5 (enExample) 2015-11-05
JP6030905B2 true JP6030905B2 (ja) 2016-11-24

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JP2012215555A Active JP6030905B2 (ja) 2012-09-28 2012-09-28 発光半導体を相互接続するためのオーバーレイ回路構造

Country Status (1)

Country Link
JP (1) JP6030905B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526829B2 (en) 2001-10-18 2016-12-27 Bayer Healthcare Llc Flow based pressure isolation and fluid delivery system including flow based pressure isolation and flow initiating mechanism
US9782576B2 (en) 2004-10-22 2017-10-10 Carefusion 303, Inc. Fluid control device with valve and methods of use

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922176C2 (de) * 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
KR100880812B1 (ko) * 2004-03-29 2009-01-30 아티큘레이티드 테크놀러지스 엘엘씨 롤-투-롤 제조된 광 시트 및 캡슐화된 반도체 회로디바이스들
JP5162979B2 (ja) * 2007-06-28 2013-03-13 日亜化学工業株式会社 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526829B2 (en) 2001-10-18 2016-12-27 Bayer Healthcare Llc Flow based pressure isolation and fluid delivery system including flow based pressure isolation and flow initiating mechanism
US9782576B2 (en) 2004-10-22 2017-10-10 Carefusion 303, Inc. Fluid control device with valve and methods of use

Also Published As

Publication number Publication date
JP2014072271A (ja) 2014-04-21

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