JP2014063791A - 接合システム、接合方法、プログラム及びコンピュータ記憶媒体 - Google Patents

接合システム、接合方法、プログラム及びコンピュータ記憶媒体 Download PDF

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Publication number
JP2014063791A
JP2014063791A JP2012206555A JP2012206555A JP2014063791A JP 2014063791 A JP2014063791 A JP 2014063791A JP 2012206555 A JP2012206555 A JP 2012206555A JP 2012206555 A JP2012206555 A JP 2012206555A JP 2014063791 A JP2014063791 A JP 2014063791A
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Japan
Prior art keywords
wafer
substrate
bonding
joining
adhesive
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Pending
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JP2012206555A
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English (en)
Japanese (ja)
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JP2014063791A5 (enrdf_load_stackoverflow
Inventor
Masatoshi Deguchi
雅敏 出口
Naoto Yoshitaka
直人 吉高
Masataka Matsunaga
正隆 松永
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012206555A priority Critical patent/JP2014063791A/ja
Priority to PCT/JP2013/072709 priority patent/WO2014045803A1/ja
Priority to TW102133489A priority patent/TW201423834A/zh
Publication of JP2014063791A publication Critical patent/JP2014063791A/ja
Publication of JP2014063791A5 publication Critical patent/JP2014063791A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012206555A 2012-09-20 2012-09-20 接合システム、接合方法、プログラム及びコンピュータ記憶媒体 Pending JP2014063791A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012206555A JP2014063791A (ja) 2012-09-20 2012-09-20 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
PCT/JP2013/072709 WO2014045803A1 (ja) 2012-09-20 2013-08-26 接合システム、接合方法及びコンピュータ記憶媒体
TW102133489A TW201423834A (zh) 2012-09-20 2013-09-16 接合系統、接合方法及電腦記憶媒體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012206555A JP2014063791A (ja) 2012-09-20 2012-09-20 接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Publications (2)

Publication Number Publication Date
JP2014063791A true JP2014063791A (ja) 2014-04-10
JP2014063791A5 JP2014063791A5 (enrdf_load_stackoverflow) 2015-01-22

Family

ID=50341126

Family Applications (1)

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JP2012206555A Pending JP2014063791A (ja) 2012-09-20 2012-09-20 接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Country Status (3)

Country Link
JP (1) JP2014063791A (enrdf_load_stackoverflow)
TW (1) TW201423834A (enrdf_load_stackoverflow)
WO (1) WO2014045803A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114695180A (zh) * 2020-12-29 2022-07-01 细美事有限公司 接合基板和基板的基板接合设备中的基板保管及对准装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6165102B2 (ja) * 2014-05-20 2017-07-19 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム、および情報記憶媒体
WO2019098142A1 (ja) 2017-11-17 2019-05-23 浜松ホトニクス株式会社 吸着方法
JP7299685B2 (ja) * 2018-10-11 2023-06-28 キヤノン株式会社 膜形成装置、膜形成方法および物品製造方法
DE102019004470B4 (de) * 2019-06-25 2021-12-09 Mühlbauer Gmbh & Co. Kg Bauteilfördervorrichtung mit einer Einstelleinheit und Verfahren zum Einstellen einer Bauteilfördervorrichtung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034623A (ja) * 2006-07-28 2008-02-14 Tokyo Ohka Kogyo Co Ltd ウエハの接着方法、薄板化方法、及び剥離方法
JP2008182016A (ja) * 2007-01-24 2008-08-07 Tokyo Electron Ltd 貼り合わせ装置、貼り合わせ方法
WO2010055730A1 (ja) * 2008-11-14 2010-05-20 東京エレクトロン株式会社 貼り合わせ装置及び貼り合わせ方法
WO2010058606A1 (ja) * 2008-11-21 2010-05-27 株式会社ニコン 保持部材管理装置、積層半導体製造装置および保持部材管理方法
JP2011258841A (ja) * 2010-06-10 2011-12-22 Tokyo Ohka Kogyo Co Ltd 基板の加工方法
JP2012049267A (ja) * 2010-08-25 2012-03-08 Tokyo Electron Ltd 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2012069906A (ja) * 2010-08-23 2012-04-05 Tokyo Electron Ltd 接合装置、接合方法、プログラム及びコンピュータ記憶媒体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034623A (ja) * 2006-07-28 2008-02-14 Tokyo Ohka Kogyo Co Ltd ウエハの接着方法、薄板化方法、及び剥離方法
JP2008182016A (ja) * 2007-01-24 2008-08-07 Tokyo Electron Ltd 貼り合わせ装置、貼り合わせ方法
WO2010055730A1 (ja) * 2008-11-14 2010-05-20 東京エレクトロン株式会社 貼り合わせ装置及び貼り合わせ方法
WO2010058606A1 (ja) * 2008-11-21 2010-05-27 株式会社ニコン 保持部材管理装置、積層半導体製造装置および保持部材管理方法
JP2011258841A (ja) * 2010-06-10 2011-12-22 Tokyo Ohka Kogyo Co Ltd 基板の加工方法
JP2012069906A (ja) * 2010-08-23 2012-04-05 Tokyo Electron Ltd 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP2012049267A (ja) * 2010-08-25 2012-03-08 Tokyo Electron Ltd 接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114695180A (zh) * 2020-12-29 2022-07-01 细美事有限公司 接合基板和基板的基板接合设备中的基板保管及对准装置
KR20220095321A (ko) * 2020-12-29 2022-07-07 세메스 주식회사 기판과 기판을 접합하기 위한 기판 접합 설비에서의 기판 보관 및 정렬 장치
KR102610837B1 (ko) * 2020-12-29 2023-12-06 세메스 주식회사 기판과 기판을 접합하기 위한 기판 접합 설비에서의 기판 보관 및 정렬 장치
US12278130B2 (en) 2020-12-29 2025-04-15 Semes Co., Ltd. Substrate storing and aligning apparatus in substrate bonding equipment for bonding substrates to each other

Also Published As

Publication number Publication date
TW201423834A (zh) 2014-06-16
WO2014045803A1 (ja) 2014-03-27

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