TW201423834A - 接合系統、接合方法及電腦記憶媒體 - Google Patents

接合系統、接合方法及電腦記憶媒體 Download PDF

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Publication number
TW201423834A
TW201423834A TW102133489A TW102133489A TW201423834A TW 201423834 A TW201423834 A TW 201423834A TW 102133489 A TW102133489 A TW 102133489A TW 102133489 A TW102133489 A TW 102133489A TW 201423834 A TW201423834 A TW 201423834A
Authority
TW
Taiwan
Prior art keywords
wafer
substrate
bonding
processed
heat treatment
Prior art date
Application number
TW102133489A
Other languages
English (en)
Chinese (zh)
Inventor
Masatoshi Deguchi
Naoto Yoshitaka
Masataka Matsunaga
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201423834A publication Critical patent/TW201423834A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102133489A 2012-09-20 2013-09-16 接合系統、接合方法及電腦記憶媒體 TW201423834A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012206555A JP2014063791A (ja) 2012-09-20 2012-09-20 接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Publications (1)

Publication Number Publication Date
TW201423834A true TW201423834A (zh) 2014-06-16

Family

ID=50341126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102133489A TW201423834A (zh) 2012-09-20 2013-09-16 接合系統、接合方法及電腦記憶媒體

Country Status (3)

Country Link
JP (1) JP2014063791A (enrdf_load_stackoverflow)
TW (1) TW201423834A (enrdf_load_stackoverflow)
WO (1) WO2014045803A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810221B (zh) * 2017-11-17 2023-08-01 日商濱松赫德尼古斯股份有限公司 吸附方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6165102B2 (ja) * 2014-05-20 2017-07-19 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム、および情報記憶媒体
JP7299685B2 (ja) * 2018-10-11 2023-06-28 キヤノン株式会社 膜形成装置、膜形成方法および物品製造方法
DE102019004470B4 (de) * 2019-06-25 2021-12-09 Mühlbauer Gmbh & Co. Kg Bauteilfördervorrichtung mit einer Einstelleinheit und Verfahren zum Einstellen einer Bauteilfördervorrichtung
KR102610837B1 (ko) * 2020-12-29 2023-12-06 세메스 주식회사 기판과 기판을 접합하기 위한 기판 접합 설비에서의 기판 보관 및 정렬 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5027460B2 (ja) * 2006-07-28 2012-09-19 東京応化工業株式会社 ウエハの接着方法、薄板化方法、及び剥離方法
JP2008182016A (ja) * 2007-01-24 2008-08-07 Tokyo Electron Ltd 貼り合わせ装置、貼り合わせ方法
US20110214809A1 (en) * 2008-11-14 2011-09-08 Tokyo Electron Limited Bonding apparatus and bonding method
TWI497244B (zh) * 2008-11-21 2015-08-21 尼康股份有限公司 A holding member managing means, a stacked semiconductor manufacturing apparatus, and a holding member managing method
JP5671265B2 (ja) * 2010-06-10 2015-02-18 東京応化工業株式会社 基板の加工方法
JP2012069906A (ja) * 2010-08-23 2012-04-05 Tokyo Electron Ltd 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP5352546B2 (ja) * 2010-08-25 2013-11-27 東京エレクトロン株式会社 接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810221B (zh) * 2017-11-17 2023-08-01 日商濱松赫德尼古斯股份有限公司 吸附方法
US11865701B2 (en) 2017-11-17 2024-01-09 Hamamatsu Photonics K.K. Suction method

Also Published As

Publication number Publication date
JP2014063791A (ja) 2014-04-10
WO2014045803A1 (ja) 2014-03-27

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