JP2014042027A5 - - Google Patents

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Publication number
JP2014042027A5
JP2014042027A5 JP2013170914A JP2013170914A JP2014042027A5 JP 2014042027 A5 JP2014042027 A5 JP 2014042027A5 JP 2013170914 A JP2013170914 A JP 2013170914A JP 2013170914 A JP2013170914 A JP 2013170914A JP 2014042027 A5 JP2014042027 A5 JP 2014042027A5
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JP
Japan
Prior art keywords
case
gas
wafer
article
spin chuck
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Application number
JP2013170914A
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English (en)
Japanese (ja)
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JP2014042027A (ja
JP6285125B2 (ja
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Priority claimed from US13/593,264 external-priority patent/US9316443B2/en
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Publication of JP2014042027A publication Critical patent/JP2014042027A/ja
Publication of JP2014042027A5 publication Critical patent/JP2014042027A5/ja
Application granted granted Critical
Publication of JP6285125B2 publication Critical patent/JP6285125B2/ja
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Anticipated expiration legal-status Critical

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JP2013170914A 2012-08-23 2013-08-21 ウエハ状物品の液体処理のための方法及び装置 Active JP6285125B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/593,264 2012-08-23
US13/593,264 US9316443B2 (en) 2012-08-23 2012-08-23 Method and apparatus for liquid treatment of wafer shaped articles

Publications (3)

Publication Number Publication Date
JP2014042027A JP2014042027A (ja) 2014-03-06
JP2014042027A5 true JP2014042027A5 (enExample) 2016-10-06
JP6285125B2 JP6285125B2 (ja) 2018-02-28

Family

ID=50147082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013170914A Active JP6285125B2 (ja) 2012-08-23 2013-08-21 ウエハ状物品の液体処理のための方法及び装置

Country Status (4)

Country Link
US (1) US9316443B2 (enExample)
JP (1) JP6285125B2 (enExample)
KR (1) KR102096672B1 (enExample)
TW (1) TWI622100B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9748120B2 (en) * 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US9245777B2 (en) 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US9972514B2 (en) * 2016-03-07 2018-05-15 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
CN109308986A (zh) * 2017-07-26 2019-02-05 北京中科信电子装备有限公司 一种离子注入机晶片冷却装置
KR102615845B1 (ko) * 2020-11-19 2023-12-22 세메스 주식회사 지지 유닛 및 기판 처리 장치
KR102683732B1 (ko) * 2021-04-01 2024-07-12 세메스 주식회사 지지 유닛 및 기판 처리 장치

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JPS592318A (ja) * 1982-06-28 1984-01-07 Toshiba Mach Co Ltd 半導体気相成長装置
JPS6146023A (ja) * 1984-08-10 1986-03-06 Ushio Inc 超高圧水銀灯による半導体ウエハ−材料の露光方法
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0213958A (ja) * 1988-06-30 1990-01-18 Mitsubishi Electric Corp レジスト現像装置
JPH05299350A (ja) * 1992-04-20 1993-11-12 Nec Corp 基板加熱機構
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JP2000334397A (ja) 1999-05-31 2000-12-05 Kokusai Electric Co Ltd 板状試料の流体処理装置及び板状試料の流体処理方法
US6536454B2 (en) 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
WO2003021642A2 (en) * 2001-08-31 2003-03-13 Applied Materials, Inc. Method and apparatus for processing a wafer
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KR100498609B1 (ko) * 2002-05-18 2005-07-01 주식회사 하이닉스반도체 배치형 원자층 증착 장치
WO2004084278A1 (en) 2003-03-20 2004-09-30 Sez Ag Device and method for wet treating disc-shaped articles
US8277569B2 (en) * 2004-07-01 2012-10-02 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus and substrate treating method
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US7509035B2 (en) * 2004-09-27 2009-03-24 Applied Materials, Inc. Lamp array for thermal processing exhibiting improved radial uniformity
US7112763B2 (en) * 2004-10-26 2006-09-26 Applied Materials, Inc. Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
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JP4680044B2 (ja) * 2005-11-24 2011-05-11 東京エレクトロン株式会社 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
KR101061945B1 (ko) * 2005-11-24 2011-09-05 도쿄엘렉트론가부시키가이샤 액 처리 방법, 액 처리 장치 및 이를 행하는 제어프로그램이 기억된 컴퓨터 판독 가능한 기억 매체
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TWI373804B (en) 2007-07-13 2012-10-01 Lam Res Ag Apparatus and method for wet treatment of disc-like articles
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JP5195175B2 (ja) * 2008-08-29 2013-05-08 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
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US8596623B2 (en) 2009-12-18 2013-12-03 Lam Research Ag Device and process for liquid treatment of a wafer shaped article
CN101922042B (zh) * 2010-08-19 2012-05-30 江苏中晟半导体设备有限公司 一种外延片托盘支撑旋转联接装置
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US9355883B2 (en) * 2011-09-09 2016-05-31 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles

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