JP2013545279A - シリコーン箔の製造方法、シリコーン箔、およびシリコーン箔を備えたオプトエレクトロニクス半導体部品 - Google Patents
シリコーン箔の製造方法、シリコーン箔、およびシリコーン箔を備えたオプトエレクトロニクス半導体部品 Download PDFInfo
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- 239000011888 foil Substances 0.000 title claims abstract description 297
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 174
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title description 7
- 238000000034 method Methods 0.000 claims abstract description 48
- 239000000203 mixture Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000013008 thixotropic agent Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 230000005670 electromagnetic radiation Effects 0.000 claims description 2
- 238000003682 fluorination reaction Methods 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229920006268 silicone film Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
- B29C43/206—Making multilayered articles by pressing the material between two preformed layers, e.g. deformable layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/40—Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0016—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
【選択図】図1B
Description
− 金型にモールド箔を導入するステップと、
− 金型にキャリア箔を導入するステップであって、キャリア箔が基板箔の上に固定され、金型のキャビティ内で基板箔が少なくとも部分的に横方向にキャリア箔よりも突き出している、ステップと、
− シリコーン系組成物を準備して、モールド箔またはキャリア箔に塗布するステップと、
− 金型の中、モールド箔とキャリア箔との間で、シリコーン系組成物をシリコーン箔に成形するステップであって、シリコーン系組成物が、横方向においてキャリア箔に並んでいる少なくとも1つの重複領域において基板箔に接触する、ステップと、
− シリコーン箔からモールド箔を除去するステップと、
− 重複領域を分離するステップ
個々の方法ステップは、指定した順序で行うことが好ましい。変形形態として、個々の方法ステップを異なる順序で行うこともできる。
Claims (14)
- オプトエレクトロニクス半導体部品(10)において使用されるシリコーン箔(2)を、成形によって製造する方法であって、
− 金型(5)にモールド箔(1)を導入するステップと、
− 前記金型(5)にキャリア箔(3)を導入するステップであって、前記キャリア箔(3)が基板箔(4)の上に固定され、前記基板箔(4)が、前記金型(5)のキャビティ(50)内で少なくとも部分的に横方向に前記キャリア箔(3)よりも突き出しているステップと、
− シリコーン系組成物(20)を準備して、前記モールド箔(1)または前記キャリア箔(3)に塗布するステップと、
− 前記金型(5)の中、前記モールド箔(1)と前記キャリア箔(3)との間で、前記シリコーン系組成物(20)を前記シリコーン箔(2)に成形するステップであって、前記シリコーン系組成物(20)が、横方向において前記キャリア箔(3)に並んでいる少なくとも1つの重複領域(24)において前記基板箔(4)に接触するステップと、
− 前記シリコーン箔(2)から前記モールド箔(1)を除去するステップと、
− 前記重複領域(24)を分離するステップと、
を含んでいる、方法。 - 前記シリコーン系組成物(20)および前記シリコーン箔(2)の少なくとも一方が、前記モールド箔(1)よりも前記基板箔(4)に強く接着し、かつ、前記キャリア箔(3)よりも前記モールド箔(1)に強く接着する、
請求項1に記載の方法。 - 前記モールド箔(1)の表面構造および前記キャリア箔(3)の表面構造の少なくとも一方が、成形時に前記シリコーン箔(2)に再現される、
請求項1または請求項2のいずれかに記載の方法。 - 前記金型(5)が閉じているとき、前記シリコーン箔(2)を予備硬化させ、前記シリコーン箔(2)の完全な硬化が、前記金型(5)を開いた後にのみ行われる、
請求項1から請求項3のいずれかに記載の方法。 - 前記シリコーン系組成物(20)を前記キャリア箔(3)または前記モールド箔(1)に塗布する前に、変換手段粒子が前記シリコーン系組成物(20)に、均一に分布するように混合され、前記変換手段粒子が、第1の波長域の電磁放射の少なくとも一部分を吸収して、前記第1の波長域とは異なる第2の波長域の放射に変換するように設計されている、
請求項1から請求項4のいずれかに記載の方法。 - 前記キャリア箔(3)または前記モールド箔(1)に塗布するときの前記シリコーン系組成物(20)の粘度が、少なくとも0.1Pa・sである、
請求項1から請求項5のいずれかに記載の方法。 - 前記シリコーン系組成物(20)に、チキソトロープ剤が含まれておらず、特に、1nm〜100nmの範囲内(両端値を含む)の平均直径を有する二酸化ケイ素ナノ粒子が含まれていない、
請求項1から請求項6のいずれかに記載の方法。 - 前記モールド箔(1)および前記キャリア箔(3)に、それぞれ、ポリフルオロオレフィン箔が使用され、前記キャリア箔(3)のフッ素化の程度が、前記モールド箔(1)の場合よりも高い、
請求項1から請求項7のいずれかに記載の方法。 - 前記金型(5)内の前記シリコーン箔(2)全体にわたる厚さ(T)の変動が、前記シリコーン箔(2)の平均厚さに対して最大で15%である、
請求項1から請求項8のいずれかに記載の方法。 - 前記シリコーン箔(2)が個片化されて多数のシリコーン薄膜(26)が形成される、
請求項1から請求項9のいずれかに記載の方法。 - シリコーン箔(2)であって、
− シリコーンを含んでいるマトリックス材料と、
− 前記マトリックス材料内に均一に分布している変換手段粒子と、
− 対向する2つの主面(21,23)と、
− 前記主面(21,23)の少なくとも一方に形成されている溝状の粗面化部(25)と、
を備えており、
前記シリコーン箔(2)の平均厚さ(T)が20μm〜250μmの範囲内(両端値を含む)である、
シリコーン箔(2)。 - 前記粗面化部(25)が、0.05μm〜15μmの範囲内(両端値を含む)の平均粗さ深さ(D)と、少なくとも50μmの平均溝長さ(L)とを有する、
請求項11に記載のシリコーン箔(2)。 - 請求項1から請求項10のいずれかに記載の方法によって製造される、
請求項11または請求項12のいずれかに記載のシリコーン箔(2)。 - オプトエレクトロニクス半導体部品(10)であって、
− 少なくとも1個のオプトエレクトロニクス半導体チップ(6)と、
− 請求項11から請求項13のいずれかに記載のシリコーン箔(2)からなる少なくとも1つのシリコーン薄膜(26)と、
を備えており、
前記シリコーン薄膜(26)が、前記半導体チップ(6)の放射主面(7)に少なくとも間接的に固定されており、かつ、前記放射主面(7)の少なくとも一部分を覆っている、
オプトエレクトロニクス半導体部品(10)。
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DE102010047454.1 | 2010-10-04 | ||
DE102010047454A DE102010047454A1 (de) | 2010-10-04 | 2010-10-04 | Verfahren zur Herstellung einer Silikonfolie, Silikonfolie und optoelektronisches Halbleiterbauteil mit einer Silikonfolie |
PCT/EP2011/064174 WO2012045511A2 (de) | 2010-10-04 | 2011-08-17 | Verfahren zur herstellung einer silikonfolie, silikonfolie und optoelektronisches halbleiterbauteil mit einer silikonfolie |
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US (1) | US20130228799A1 (ja) |
EP (1) | EP2625015A2 (ja) |
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Cited By (2)
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JP2014531340A (ja) * | 2011-09-06 | 2014-11-27 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | シリコーン部材を製造するための圧縮工具およびシリコーン部材を製造するための方法 |
JP2016103576A (ja) * | 2014-11-28 | 2016-06-02 | 三菱樹脂株式会社 | 蛍光体含有シリコーンシート及び発光装置 |
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DE102011080653A1 (de) * | 2011-08-09 | 2013-02-14 | Osram Opto Semiconductors Gmbh | Trägerfolie für ein silikonelement und verfahren zum herstellen einer trägerfolie für ein silikonelement |
DE102011081083A1 (de) * | 2011-08-17 | 2013-02-21 | Osram Ag | Presswerkzeug und verfahren zum pressen eines silikonelements |
DE102012216738A1 (de) * | 2012-09-19 | 2014-03-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
CN105599315B (zh) * | 2016-02-18 | 2017-12-22 | 东莞市正爱实业有限公司 | 智能餐具的制造方法 |
DE102018105910B4 (de) * | 2018-03-14 | 2023-12-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl von Konversionselementen |
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JP5604008B2 (ja) | 2014-10-08 |
KR20130061744A (ko) | 2013-06-11 |
CN103153570A (zh) | 2013-06-12 |
WO2012045511A2 (de) | 2012-04-12 |
EP2625015A2 (de) | 2013-08-14 |
WO2012045511A3 (de) | 2012-06-07 |
US20130228799A1 (en) | 2013-09-05 |
DE102010047454A1 (de) | 2012-04-05 |
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