JP2013541827A - 終点検出のための２次元のスペクトル特徴の追跡 - Google Patents

終点検出のための２次元のスペクトル特徴の追跡 Download PDF

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Publication number
JP2013541827A
JP2013541827A JP2013521826A JP2013521826A JP2013541827A JP 2013541827 A JP2013541827 A JP 2013541827A JP 2013521826 A JP2013521826 A JP 2013521826A JP 2013521826 A JP2013521826 A JP 2013521826A JP 2013541827 A JP2013541827 A JP 2013541827A
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JP
Japan
Prior art keywords
polishing
substrate
value
layer
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013521826A
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English (en)
Japanese (ja)
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JP2013541827A5 (enExample
Inventor
ジェフリー ドルー ディヴィッド
シャオユェン フー
ジージェ ジュー
ハリー キュー リー
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2013541827A publication Critical patent/JP2013541827A/ja
Publication of JP2013541827A5 publication Critical patent/JP2013541827A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2013521826A 2010-07-23 2011-07-20 終点検出のための２次元のスペクトル特徴の追跡 Pending JP2013541827A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36712510P 2010-07-23 2010-07-23
US61/367,125 2010-07-23
PCT/US2011/044680 WO2012012530A2 (en) 2010-07-23 2011-07-20 Tracking spectrum features in two dimensions for endpoint detection

Publications (2)

Publication Number Publication Date
JP2013541827A true JP2013541827A (ja) 2013-11-14
JP2013541827A5 JP2013541827A5 (enExample) 2014-09-04

Family

ID=45494016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013521826A Pending JP2013541827A (ja) 2010-07-23 2011-07-20 終点検出のための２次元のスペクトル特徴の追跡

Country Status (5)

Country Link
US (1) US8814631B2 (enExample)
JP (1) JP2013541827A (enExample)
KR (1) KR101484696B1 (enExample)
TW (1) TWI478259B (enExample)
WO (1) WO2012012530A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
JP2019530236A (ja) * 2016-09-21 2019-10-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ フィルタリングのための補償を用いた終点検出
US11097397B2 (en) 2017-08-04 2021-08-24 Toshiba Memory Corporation Polishing device, polishing method, and record medium

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* Cited by examiner, † Cited by third party
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US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
US8563335B1 (en) * 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9248544B2 (en) 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
CN103624673B (zh) * 2012-08-21 2016-04-20 中芯国际集成电路制造(上海)有限公司 化学机械抛光装置及化学机械抛光的方法
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
TWI784719B (zh) 2016-08-26 2022-11-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
US12236573B2 (en) * 2020-12-03 2025-02-25 Battelle Memorial Institute Optical end-pointing for integrated circuit delayering; systems and methods using the same
US12288724B2 (en) 2021-03-04 2025-04-29 Applied Materials, Inc. Region classification of film non-uniformity based on processing of substrate images
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

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JP2001515283A (ja) * 1997-08-19 2001-09-18 マイクロン テクノロジー インコーポレイテッド 半導体ウェーハの化学・機械研磨の終了点を検出する方法及び装置
JP2001257187A (ja) * 2000-01-28 2001-09-21 Applied Materials Inc 化学機械研磨用の適応終点検出
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
JP2002343842A (ja) * 2001-03-12 2002-11-29 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2002359217A (ja) * 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2009505847A (ja) * 2005-08-22 2009-02-12 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2009283868A (ja) * 2008-05-26 2009-12-03 Tokyo Seimitsu Co Ltd 研磨終点検出方法
JP2010093147A (ja) * 2008-10-10 2010-04-22 Ebara Corp 研磨進捗監視方法および研磨装置
JP2010115726A (ja) * 2008-11-11 2010-05-27 Ebara Corp 研磨終点検知用の光の波長選択に用いられるダイヤグラムの作成方法、光の波長選択方法、研磨終点検出方法、研磨終点検出装置、および研磨装置

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US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US8388408B2 (en) * 2008-10-10 2013-03-05 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method
US8352061B2 (en) * 2008-11-14 2013-01-08 Applied Materials, Inc. Semi-quantitative thickness determination
WO2011056485A2 (en) 2009-11-03 2011-05-12 Applied Materials, Inc. Endpoint method using peak location of spectra contour plots versus time
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US8930013B2 (en) 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
WO2013028389A1 (en) * 2011-08-23 2013-02-28 Applied Materials, Inc. Optical detection of metal layer clearance
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control

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Publication number Priority date Publication date Assignee Title
JP2001515283A (ja) * 1997-08-19 2001-09-18 マイクロン テクノロジー インコーポレイテッド 半導体ウェーハの化学・機械研磨の終了点を検出する方法及び装置
JP2001257187A (ja) * 2000-01-28 2001-09-21 Applied Materials Inc 化学機械研磨用の適応終点検出
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
JP2002343842A (ja) * 2001-03-12 2002-11-29 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2002359217A (ja) * 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
JP2009505847A (ja) * 2005-08-22 2009-02-12 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
JP2009283868A (ja) * 2008-05-26 2009-12-03 Tokyo Seimitsu Co Ltd 研磨終点検出方法
JP2010093147A (ja) * 2008-10-10 2010-04-22 Ebara Corp 研磨進捗監視方法および研磨装置
JP2010115726A (ja) * 2008-11-11 2010-05-27 Ebara Corp 研磨終点検知用の光の波長選択に用いられるダイヤグラムの作成方法、光の波長選択方法、研磨終点検出方法、研磨終点検出装置、および研磨装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
CN106457507A (zh) * 2014-04-22 2017-02-22 株式会社荏原制作所 研磨方法及研磨装置
TWI657894B (zh) * 2014-04-22 2019-05-01 荏原製作所股份有限公司 研磨方法及研磨裝置
US10399203B2 (en) 2014-04-22 2019-09-03 Ebara Corporation Polishing method and polishing apparatus
JP2019530236A (ja) * 2016-09-21 2019-10-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ フィルタリングのための補償を用いた終点検出
JP7062644B2 (ja) 2016-09-21 2022-05-06 アプライド マテリアルズ インコーポレイテッド フィルタリングのための補償を用いた終点検出
US11097397B2 (en) 2017-08-04 2021-08-24 Toshiba Memory Corporation Polishing device, polishing method, and record medium

Also Published As

Publication number Publication date
TW201220415A (en) 2012-05-16
TWI478259B (zh) 2015-03-21
WO2012012530A2 (en) 2012-01-26
WO2012012530A3 (en) 2013-08-01
KR101484696B1 (ko) 2015-01-21
US20120021672A1 (en) 2012-01-26
KR20130093099A (ko) 2013-08-21
US8814631B2 (en) 2014-08-26

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