TWI478259B - 用於終點偵測之二維光譜特徵追蹤 - Google Patents

用於終點偵測之二維光譜特徵追蹤 Download PDF

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Publication number
TWI478259B
TWI478259B TW100123536A TW100123536A TWI478259B TW I478259 B TWI478259 B TW I478259B TW 100123536 A TW100123536 A TW 100123536A TW 100123536 A TW100123536 A TW 100123536A TW I478259 B TWI478259 B TW I478259B
Authority
TW
Taiwan
Prior art keywords
substrate
layer
spectral
grinding
spectrum
Prior art date
Application number
TW100123536A
Other languages
English (en)
Chinese (zh)
Other versions
TW201220415A (en
Inventor
Jeffrey Drue David
Xiaoyuan Hu
Zhize Zhu
Harry Q Lee
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201220415A publication Critical patent/TW201220415A/zh
Application granted granted Critical
Publication of TWI478259B publication Critical patent/TWI478259B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW100123536A 2010-07-23 2011-07-04 用於終點偵測之二維光譜特徵追蹤 TWI478259B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36712510P 2010-07-23 2010-07-23

Publications (2)

Publication Number Publication Date
TW201220415A TW201220415A (en) 2012-05-16
TWI478259B true TWI478259B (zh) 2015-03-21

Family

ID=45494016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100123536A TWI478259B (zh) 2010-07-23 2011-07-04 用於終點偵測之二維光譜特徵追蹤

Country Status (5)

Country Link
US (1) US8814631B2 (enExample)
JP (1) JP2013541827A (enExample)
KR (1) KR101484696B1 (enExample)
TW (1) TWI478259B (enExample)
WO (1) WO2012012530A2 (enExample)

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Publication number Priority date Publication date Assignee Title
US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
US8563335B1 (en) * 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9248544B2 (en) 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
CN103624673B (zh) * 2012-08-21 2016-04-20 中芯国际集成电路制造(上海)有限公司 化学机械抛光装置及化学机械抛光的方法
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
TWI784719B (zh) 2016-08-26 2022-11-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
CN109791881B (zh) * 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US12236573B2 (en) * 2020-12-03 2025-02-25 Battelle Memorial Institute Optical end-pointing for integrated circuit delayering; systems and methods using the same
US12288724B2 (en) 2021-03-04 2025-04-29 Applied Materials, Inc. Region classification of film non-uniformity based on processing of substrate images
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

Citations (7)

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US6191864B1 (en) * 1996-05-16 2001-02-20 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20070042675A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US20100093260A1 (en) * 2008-10-10 2010-04-15 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
US20100124870A1 (en) * 2008-11-14 2010-05-20 Applied Materials, Inc. Semi-Quantitative Thickness Determination

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US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
US6605405B2 (en) 2000-07-26 2003-08-12 Canon Kabushiki Kaisha Electrophotographic method and electrophotographic apparatus
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2002359217A (ja) 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP5274105B2 (ja) * 2008-05-26 2013-08-28 株式会社東京精密 研磨終点検出方法
JP2010093147A (ja) * 2008-10-10 2010-04-22 Ebara Corp 研磨進捗監視方法および研磨装置
JP4739393B2 (ja) * 2008-11-11 2011-08-03 株式会社荏原製作所 研磨終点検知用の光の波長選択に用いられるダイヤグラムの作成方法、光の波長選択方法、研磨終点検出方法、研磨終点検出装置、および研磨装置
WO2011056485A2 (en) 2009-11-03 2011-05-12 Applied Materials, Inc. Endpoint method using peak location of spectra contour plots versus time
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US8930013B2 (en) 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
WO2013028389A1 (en) * 2011-08-23 2013-02-28 Applied Materials, Inc. Optical detection of metal layer clearance
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191864B1 (en) * 1996-05-16 2001-02-20 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20070042675A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US20100093260A1 (en) * 2008-10-10 2010-04-15 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
US20100124870A1 (en) * 2008-11-14 2010-05-20 Applied Materials, Inc. Semi-Quantitative Thickness Determination

Also Published As

Publication number Publication date
TW201220415A (en) 2012-05-16
WO2012012530A2 (en) 2012-01-26
WO2012012530A3 (en) 2013-08-01
KR101484696B1 (ko) 2015-01-21
US20120021672A1 (en) 2012-01-26
KR20130093099A (ko) 2013-08-21
US8814631B2 (en) 2014-08-26
JP2013541827A (ja) 2013-11-14

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