KR101484696B1 - 종료점 검출을 위한 2차원적인 스펙트럼 피쳐들의 트랙킹 - Google Patents

종료점 검출을 위한 2차원적인 스펙트럼 피쳐들의 트랙킹 Download PDF

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KR101484696B1
KR101484696B1 KR1020137004558A KR20137004558A KR101484696B1 KR 101484696 B1 KR101484696 B1 KR 101484696B1 KR 1020137004558 A KR1020137004558 A KR 1020137004558A KR 20137004558 A KR20137004558 A KR 20137004558A KR 101484696 B1 KR101484696 B1 KR 101484696B1
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Prior art keywords
polishing
substrate
spectra
sequence
coordinates
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KR20130093099A (ko
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제프리 드루에 데이비드
시아오유안 후
히제 후
해리 큐. 리
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020137004558A 2010-07-23 2011-07-20 종료점 검출을 위한 2차원적인 스펙트럼 피쳐들의 트랙킹 Active KR101484696B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36712510P 2010-07-23 2010-07-23
US61/367,125 2010-07-23
PCT/US2011/044680 WO2012012530A2 (en) 2010-07-23 2011-07-20 Tracking spectrum features in two dimensions for endpoint detection

Publications (2)

Publication Number Publication Date
KR20130093099A KR20130093099A (ko) 2013-08-21
KR101484696B1 true KR101484696B1 (ko) 2015-01-21

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KR1020137004558A Active KR101484696B1 (ko) 2010-07-23 2011-07-20 종료점 검출을 위한 2차원적인 스펙트럼 피쳐들의 트랙킹

Country Status (5)

Country Link
US (1) US8814631B2 (enExample)
JP (1) JP2013541827A (enExample)
KR (1) KR101484696B1 (enExample)
TW (1) TWI478259B (enExample)
WO (1) WO2012012530A2 (enExample)

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US8563335B1 (en) * 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9248544B2 (en) 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
CN103624673B (zh) * 2012-08-21 2016-04-20 中芯国际集成电路制造(上海)有限公司 化学机械抛光装置及化学机械抛光的方法
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
WO2015163164A1 (ja) * 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
TWI784719B (zh) 2016-08-26 2022-11-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
CN109791881B (zh) * 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US12236573B2 (en) * 2020-12-03 2025-02-25 Battelle Memorial Institute Optical end-pointing for integrated circuit delayering; systems and methods using the same
US12288724B2 (en) 2021-03-04 2025-04-29 Applied Materials, Inc. Region classification of film non-uniformity based on processing of substrate images
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

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US20080099443A1 (en) 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
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US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
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JP2002359217A (ja) 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
US20080099443A1 (en) 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US20100093260A1 (en) 2008-10-10 2010-04-15 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method

Also Published As

Publication number Publication date
TW201220415A (en) 2012-05-16
TWI478259B (zh) 2015-03-21
WO2012012530A2 (en) 2012-01-26
WO2012012530A3 (en) 2013-08-01
US20120021672A1 (en) 2012-01-26
KR20130093099A (ko) 2013-08-21
US8814631B2 (en) 2014-08-26
JP2013541827A (ja) 2013-11-14

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