JP2013536475A5 - - Google Patents

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Publication number
JP2013536475A5
JP2013536475A5 JP2013525930A JP2013525930A JP2013536475A5 JP 2013536475 A5 JP2013536475 A5 JP 2013536475A5 JP 2013525930 A JP2013525930 A JP 2013525930A JP 2013525930 A JP2013525930 A JP 2013525930A JP 2013536475 A5 JP2013536475 A5 JP 2013536475A5
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JP
Japan
Prior art keywords
semiconductor die
chip package
optical signal
semiconductor
optical
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Application number
JP2013525930A
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English (en)
Japanese (ja)
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JP2013536475A (ja
JP5882326B2 (ja
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Publication date
Priority claimed from US12/868,577 external-priority patent/US8290319B2/en
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Publication of JP2013536475A publication Critical patent/JP2013536475A/ja
Publication of JP2013536475A5 publication Critical patent/JP2013536475A5/ja
Application granted granted Critical
Publication of JP5882326B2 publication Critical patent/JP5882326B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013525930A 2010-08-25 2011-08-04 傾斜スタックチップパッケージにおける光通信 Active JP5882326B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/868,577 2010-08-25
US12/868,577 US8290319B2 (en) 2010-08-25 2010-08-25 Optical communication in a ramp-stack chip package
PCT/US2011/046518 WO2012027081A2 (en) 2010-08-25 2011-08-04 Optical communication in a ramp-stack chip package

Publications (3)

Publication Number Publication Date
JP2013536475A JP2013536475A (ja) 2013-09-19
JP2013536475A5 true JP2013536475A5 (enExample) 2014-09-18
JP5882326B2 JP5882326B2 (ja) 2016-03-09

Family

ID=44774097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013525930A Active JP5882326B2 (ja) 2010-08-25 2011-08-04 傾斜スタックチップパッケージにおける光通信

Country Status (7)

Country Link
US (1) US8290319B2 (enExample)
EP (1) EP2609623B1 (enExample)
JP (1) JP5882326B2 (enExample)
KR (1) KR101831275B1 (enExample)
CN (1) CN103081102B (enExample)
TW (1) TWI520305B (enExample)
WO (1) WO2012027081A2 (enExample)

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US8373280B2 (en) * 2010-09-01 2013-02-12 Oracle America, Inc. Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component
US8283766B2 (en) * 2010-09-02 2012-10-09 Oracle America, Inc Ramp-stack chip package with static bends
US8390109B2 (en) * 2011-02-17 2013-03-05 Oracle America, Inc. Chip package with plank stack of semiconductor dies
US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
WO2014003533A1 (en) 2012-06-25 2014-01-03 Intel Corporation Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
US9250403B2 (en) * 2013-04-26 2016-02-02 Oracle International Corporation Hybrid-integrated photonic chip package with an interposer
US10230458B2 (en) 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
US9094135B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9261556B2 (en) 2013-06-10 2016-02-16 Freescale Semiconductor, Inc. Optical wafer and die probe testing
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US9810843B2 (en) 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US9091820B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Communication system die stack
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US8971676B1 (en) * 2013-10-07 2015-03-03 Oracle International Corporation Hybrid-integrated photonic chip package
US9209165B2 (en) * 2013-10-21 2015-12-08 Oracle International Corporation Technique for controlling positions of stacked dies
CN104730653B (zh) * 2013-12-23 2016-08-31 华为技术有限公司 光互连系统和方法
US9323008B2 (en) 2014-03-25 2016-04-26 Globalfoundries Inc. Optoelectronic structures having multi-level optical waveguides and methods of forming the structures
US9825002B2 (en) * 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
JP6649076B2 (ja) * 2015-10-26 2020-02-19 京セラ株式会社 光回路基板の製造方法
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
JP6820671B2 (ja) * 2016-06-02 2021-01-27 富士通株式会社 光回路デバイスとこれを用いた光トランシーバ
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board
CN107706170A (zh) * 2016-08-09 2018-02-16 晟碟信息科技（上海）有限公司 垂直半导体装置
CN108933109B (zh) * 2017-05-27 2020-07-07 晟碟信息科技（上海）有限公司 成角度的裸芯的半导体器件
US10141259B1 (en) * 2017-12-22 2018-11-27 Micron Technology, Inc. Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
KR102578797B1 (ko) 2018-02-01 2023-09-18 삼성전자주식회사 반도체 패키지
US20190279962A1 (en) * 2018-03-09 2019-09-12 Oracle International Corporation Method and apparatus for stacking warped chips to assemble three-dimensional integrated circuits
US10742217B2 (en) * 2018-04-12 2020-08-11 Apple Inc. Systems and methods for implementing a scalable system
US10600770B2 (en) 2018-05-14 2020-03-24 Micron Technology, Inc. Semiconductor dice assemblies, packages and systems, and methods of operation
US11532574B2 (en) * 2019-03-12 2022-12-20 Intel Coropration Through-substrate waveguide
US12009349B2 (en) * 2021-03-26 2024-06-11 Taiwan Semiconductor Manufacturing Company Limited Vertical semiconductor package including horizontally stacked dies and methods of forming the same
US11894343B2 (en) * 2021-05-24 2024-02-06 Western Digital Technologies, Inc. Vertical semiconductor device with side grooves
US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications

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JP3334739B2 (ja) * 1995-08-03 2002-10-15 日本電信電話株式会社 ボード間光インタコネクション装置
US5652811A (en) * 1996-03-06 1997-07-29 The United States Of America As Represented By The Secretary Of The Air Force Semiconductor on fiber optic substrate (SOFOS)
DK174111B1 (da) * 1998-01-26 2002-06-24 Giga As Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
TW460927B (en) 1999-01-18 2001-10-21 Toshiba Corp Semiconductor device, mounting method for semiconductor device and manufacturing method for semiconductor device
JP4630409B2 (ja) * 1999-03-18 2011-02-09 富士通株式会社 光電子集積回路装置
JP2001036309A (ja) 1999-07-15 2001-02-09 Nec Eng Ltd マルチチップモジュール接続構造
US6376904B1 (en) 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
US7687400B2 (en) * 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
US7215845B1 (en) * 2006-01-20 2007-05-08 Apic Corporation Optical interconnect architecture
US8064739B2 (en) * 2007-10-23 2011-11-22 Hewlett-Packard Development Company, L.P. Three-dimensional die stacks with inter-device and intra-device optical interconnect
KR100997787B1 (ko) 2008-06-30 2010-12-02 주식회사 하이닉스반도체 적층 반도체 패키지 및 이의 제조 방법

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