JP5882326B2 - 傾斜スタックチップパッケージにおける光通信 - Google Patents

傾斜スタックチップパッケージにおける光通信 Download PDF

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JP5882326B2
JP5882326B2 JP2013525930A JP2013525930A JP5882326B2 JP 5882326 B2 JP5882326 B2 JP 5882326B2 JP 2013525930 A JP2013525930 A JP 2013525930A JP 2013525930 A JP2013525930 A JP 2013525930A JP 5882326 B2 JP5882326 B2 JP 5882326B2
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semiconductor die
chip package
semiconductor
optical
optical signal
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JP2013536475A (ja
JP2013536475A5 (enExample
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ハラダ，ジョン・エイ
ダグラス，デイビッド・シィ
ドロスト，ロバート・ジェイ
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オラクル・インターナショナル・コーポレイション
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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    • H01L2924/1901—Structure
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    • H01L2924/191—Disposition
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    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
JP2013525930A 2010-08-25 2011-08-04 傾斜スタックチップパッケージにおける光通信 Active JP5882326B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/868,577 2010-08-25
US12/868,577 US8290319B2 (en) 2010-08-25 2010-08-25 Optical communication in a ramp-stack chip package
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