JP2013532116A - 電気接続素子を備える窓ガラス - Google Patents
電気接続素子を備える窓ガラス Download PDFInfo
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- JP2013532116A JP2013532116A JP2013519021A JP2013519021A JP2013532116A JP 2013532116 A JP2013532116 A JP 2013532116A JP 2013519021 A JP2013519021 A JP 2013519021A JP 2013519021 A JP2013519021 A JP 2013519021A JP 2013532116 A JP2013532116 A JP 2013532116A
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- window glass
- connecting element
- conductive structure
- connection element
- solder material
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- 239000005357 flat glass Substances 0.000 title claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 67
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229910000531 Co alloy Inorganic materials 0.000 claims abstract description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 229910052709 silver Inorganic materials 0.000 claims description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 241001074085 Scophthalmus aquosus Species 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 18
- 238000005476 soldering Methods 0.000 description 12
- 229910000833 kovar Inorganic materials 0.000 description 10
- 229910001374 Invar Inorganic materials 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical compound [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005094 computer simulation Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910002545 FeCoNi Inorganic materials 0.000 description 1
- 229910002555 FeNi Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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Abstract
Description
ガラス製の基板、
基板の領域上に5μmから40μmの層厚を有する導電性構造、
接続素子、および
導電性構造の一部分に接続素子を電気的に接続する半田材料の層を含み、
接続素子は、少なくとも1つの鉄ニッケル合金または1つの鉄ニッケルコバルト合金を含有し、
接続素子は、その全面にわたって接触面を通じて導電性構造の部分に接続されており、
接触面は角部を有していない。
a)半田材料は、一定の層厚、体積、形状、および配置を有する小板として、接続素子上に配置および付着され、
b)導電性構造は基板上に付着され、
c)半田材料を備える接続素子は導電性構造上に配置され、
d)接続素子は導電性構造に半田付けされる。
試験片は、加熱導体構造の形態の導電性構造2、電気接続素子3,接続素子3の接触面上の銀層、および半田材料4を備える、窓ガラス1(厚さ3mm、幅150cm、および高さ80cm)を用いて作製された。半田材料4は、一定の層厚、体積、および形状を有する小板として、接続素子3の接触面11上に事前に付着させられた。接続素子3は、導電性構造2上に付着させられた半田材料4を用いて付着させられた。接続素子は、200℃の温度および2秒の処理時間で導電性構造2の上に半田付けされた。50μmの層厚tを超える、電気接続素子3と導電性構造2との間の中間領域からの半田材料4の流出物は、最大流出幅b=0.5mmまでだけ観察された。導電性構造2、電気接続素子3、接続素子3の接触面上の銀層、および半田材料4の寸法および組成物は、表1ならびに図1および図2ならびに図面の説明に見いだされる。
比較例1は、以下の点が異なるほかは、実施例と同じように実行された。導電性構造2、電気接続素子3、接続素子3の接触面上の金属層、および半田材料4の寸法および組成物は、表3に見いだされる。半田材料4は、先行技術にしたがって、接続素子3の接触面上の小板として事前に付着されなかった。接続素子3は、従来の方法にしたがって導電性構造2に半田付けされた。50μmの層厚tを超える、電気接続素子3と導電性構造2との間の中間領域からの半田材料4の流出物があり、平均流出幅b=2mmから3mmが得られた。
比較例2は、以下の点が異なるほかは、実施例と同じように実行された。導電性構造2、電気接続素子3、接続素子3の接触面上の金属層。および半田材料4の寸法および組成物は、表4に見いだされる。半田材料4は、先行技術にしたがって、接続素子3の接触面上の小板として事前に付着されなかった。接続素子3は、従来の方法にしたがって導電性構造2に半田付けされた。50μmの層厚tを超える、電気接続素子3と導電性構造2との間の中間領域からの半田材料4の流出物があり、平均流出幅b=1mmから1.5mmが得られた。
2 導電性構造/Agスクリーン印刷
3 電気接続素子/Fe−Ni合金コバール
4 半田材料(Bi57Sn42Ag1)
5 濡れ層/Ag被覆
6 補償部材
7 溶接領域
8 接続ケーブル
9 接続タブ
10 刻み目
11 (2)および(3)の接触面
12 (2)の一部分
13 アーチ
b 半田材料の最大流出物
r 曲率半径
t 半田材料の限界厚
A−A’ 切断線
Claims (15)
- 電気接続素子を備える窓ガラスであって、
ガラス製の基板(1)と、
基板(1)の領域上に5μmから40μmの層厚を有する導電性構造(2)と、
接続素子(3)と、
導電性構造(2)の一部分(12)に接続素子(3)を電気的に接続する半田材料(4)の層と、を備え、
接続素子(3)は、少なくとも鉄ニッケル合金または鉄ニッケルコバルト合金を含有し、
接続素子(3)は、その全面にわたって接触面(11)を通じて導電性構造(2)の部分(12)に接続されており、
接触面(11)は角部を有していない、窓ガラス。 - 接続素子(3)が、少なくとも50重量%から75重量%の鉄、25重量%から50重量%のニッケル、0重量%から20重量%のコバルト、0重量%から1.5重量%のマグネシウム、0重量%から1重量%のシリコン、0重量%から1重量%の炭素、または0重量%から1重量%のマンガンを含有する、請求項1に記載の窓ガラス。
- 接触面(11)が楕円形、好ましくは長円形、特に、円形構造を有する、請求項1または2に記載の窓ガラス。
- 接触面(11)が丸みを帯びた角部を有する、凸状の多角形、好ましくは長方形を有し、丸みを帯びた角部は、0.5mmより大きい曲率半径rを有する、請求項1または2に記載の窓ガラス。
- 接続素子(3)が、少なくとも55重量%から70重量%の鉄、30重量%から45重量%のニッケル、0重量%から5重量%のコバルト、0重量%から1重量%のマグネシウム、0重量%から1重量%のシリコン、または0重量%から1重量%の炭素を含有する、請求項1から4のいずれか1項に記載の窓ガラス。
- ガラス製の基板(1)が第一膨張係数を有し、接続素子(3)は第二膨張係数を有し、第一および第二膨張係数の差は5×10−6/℃以上である、請求項5に記載の窓ガラス。
- 接続素子(3)が、少なくとも50重量%から60重量%の鉄、25重量%から35重量%のニッケル、15重量%から20重量%のコバルト、0重量%から0.5重量%のシリコン、0重量%から0.1重量%の炭素、または0重量%から0.5重量%のマンガンを含有する、請求項1から4のいずれか1項に記載の窓ガラス。
- ガラス製の基板(1)が第一膨張係数を有し、接続素子(3)は第二膨張係数を有し、第一および第二膨張係数の差は5×10−6/℃より小さい、請求項7に記載の窓ガラス。
- 半田材料(4)が、1mm未満、好ましくは0.5mm未満、特におよそ0mm未満の流出幅bを有する、接続素子(3)と導電性構造(2)との間の中間領域から流出する、請求項1から8のいずれか1項に記載の窓ガラス。
- 半田材料(4)が、スズおよびビスマス、インジウム、亜鉛、銅、銀、またはこれらの組成物を含有する、請求項1から9のいずれか1項に記載の窓ガラス。
- 半田組成物(4)におけるスズの割合が3重量%から99.5重量%であり、ビスマス、インジウム、亜鉛、銅、銀、またはこれらの組成物の割合が0.5重量%から97重量%である、請求項10に記載の窓ガラス。
- 接続素子(3)が、ニッケル、スズ、銅、および/または銀で被覆されている、請求項1から11のいずれか1項に記載の窓ガラス。
- 接続素子(3)が、0.1μmから0.3μmのニッケルおよび/または3μmから10μmの銀で被覆されている、請求項12に記載の窓ガラス。
- 接続素子(3)を有する窓ガラスを製造する方法であって、
a)半田材料(4)は、一定の層厚、体積、形状、および配置を有する小板として、接続素子(3)上に配置および付着され、
b)導電性構造(2)は基板(1)上に付着され、
c)半田材料(4)を有する接続素子(3)は導電性構造(2)上に配置され、
d)接続素子(3)は導電性構造(2)に半田付けされる、方法。 - 陸上、空中、または水上の移動手段、特に、自動車において、たとえばフロントガラス、後部ウィンドウ、サイドウィンドウ、および/またはガラス屋根など、車両用窓ガラスとしての、請求項1から13のいずれか1項に記載の電気接続素子を備える窓ガラスの使用。
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EP10169372A EP2408260A1 (de) | 2010-07-13 | 2010-07-13 | Glasscheibe mit einem elektrischen Anschlusselement |
EP10169372.9 | 2010-07-13 | ||
PCT/EP2011/061195 WO2012007303A1 (de) | 2010-07-13 | 2011-07-04 | Scheibe mit einem elektrischen anschlusselement |
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EP (2) | EP2408260A1 (ja) |
JP (1) | JP5813110B2 (ja) |
KR (1) | KR101924652B1 (ja) |
CN (1) | CN102972092B (ja) |
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BR (1) | BR112012025061B1 (ja) |
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EA (1) | EA025251B1 (ja) |
ES (1) | ES2623795T3 (ja) |
MA (1) | MA34372B1 (ja) |
MX (1) | MX2013000023A (ja) |
MY (1) | MY164268A (ja) |
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JP2008218399A (ja) * | 2007-01-02 | 2008-09-18 | Agc Automotive Americas R & D Inc | 車両の窓ガラス用の電気コネクタ |
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JP2017216239A (ja) * | 2012-09-14 | 2017-12-07 | サン−ゴバン グラス フランスSaint−Gobain Glass France | 電気的な接続要素を備えるパネル、その製造方法およびその使用 |
JP2021505465A (ja) * | 2017-12-04 | 2021-02-18 | エージーシー グラス ユーロップAgc Glass Europe | シールド要素を備えた電気圧着コネクタ |
JP2021517516A (ja) * | 2018-03-22 | 2021-07-26 | セントラル硝子株式会社 | 車両用ガラスアッセンブリの製造方法 |
JP7324216B2 (ja) | 2018-03-22 | 2023-08-09 | セントラル硝子株式会社 | 車両用ガラスアッセンブリの製造方法 |
US12091729B2 (en) | 2018-03-22 | 2024-09-17 | Acr Ii Glass America Inc. | Method of producing a vehicle glass assembly |
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BR112012025061A2 (pt) | 2016-06-21 |
JP5813110B2 (ja) | 2015-11-17 |
AU2011278494B2 (en) | 2014-01-09 |
PL2594109T3 (pl) | 2017-08-31 |
CA2795561C (en) | 2017-06-27 |
EP2594109B1 (de) | 2017-04-12 |
PT2594109T (pt) | 2017-06-14 |
EA025251B1 (ru) | 2016-12-30 |
ZA201208418B (en) | 2013-07-31 |
AU2011278494C1 (en) | 2014-11-20 |
EA201390096A1 (ru) | 2013-05-30 |
US20130043066A1 (en) | 2013-02-21 |
MY164268A (en) | 2017-11-30 |
CA2795561A1 (en) | 2012-01-19 |
BR112012025061B1 (pt) | 2020-10-13 |
AU2011278494A1 (en) | 2012-11-15 |
MA34372B1 (fr) | 2013-07-03 |
WO2012007303A1 (de) | 2012-01-19 |
MX2013000023A (es) | 2013-02-01 |
CN102972092A (zh) | 2013-03-13 |
CN102972092B (zh) | 2018-03-09 |
EP2594109A1 (de) | 2013-05-22 |
EP2408260A1 (de) | 2012-01-18 |
KR20130094769A (ko) | 2013-08-26 |
US20160309588A1 (en) | 2016-10-20 |
ES2623795T3 (es) | 2017-07-12 |
KR101924652B1 (ko) | 2018-12-03 |
US9385437B2 (en) | 2016-07-05 |
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